# US 12,015,204 B2 · Semiconductor device, communication system, and method of manufacturing semiconductor device

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- Number: US 12,015,204 B2
- Document ID: US12015204B2
- Status: Granted
- Kind: B2
- Application number: 17/846,014
- Filed: 2022-06-22
- Published: 2022-10-06
- Granted: 2024-06-18
- Earliest claimed: 2016-06-13
- Assignees: Lapis Semiconductor Co., Ltd.
- Applicants: LAPIS Semiconductor Co., Ltd.
- Inventors: Hiroji Akahori
- Web page: https://patentgrep.com/patent/US12015204B2

## CPC

- H01Q 9/26: with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength (resonant loop antennas H01Q7/00)
- H01Q 21/0087: {Apparatus or processes specially adapted for manufacturing antenna arrays (manufacturing waveguides H01P11/00)}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/243: {with built-in antennas}
- H01Q 1/48: Earthing means; Earth screens; Counterpoises
- H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)}
- H01Q 21/0025: {Modular arrays}
- H01Q 21/29: Combinations of different interacting antenna units for giving a desired directional characteristic (H01Q25/00 takes precedence)
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 44/248: {for antennas}
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device includes a semiconductor chip, a first antenna element and a second antenna element. The semiconductor chip includes a communication circuit. The first antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a first direction parallel to a first surface of the semiconductor chip. The second antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a second direction parallel to a second surface opposite to the first surface of the semiconductor chip.

## Claims

### Claim 1

A semiconductor device, comprising:
a semiconductor chip including a communication circuit;
a first antenna element including a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a first direction parallel to a first surface of the semiconductor chip; and
a second antenna element including a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a second direction parallel to a second surface opposite to the first surface of the semiconductor chip,
wherein an end portion of the second antenna element is connected to the communication circuit, and another end portion of the second antenna element is connected to an end portion of the first antenna element.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, further comprising:
a matching circuit matching an impedance of at least one of the first antenna element and the second antenna element with an impedance of the communication circuit.