# US 12,015,191 B2 · Antenna-on-package integrated circuit device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,191 B2 - Document ID: US12015191B2 - Status: Granted - Kind: B2 - Application number: 16/559,094 - Filed: 2019-09-03 - Published: 2020-08-13 - Granted: 2024-06-18 - Earliest claimed: 2019-02-08 - Assignees: Texas Instruments Incorporated - Applicants: Texas Instruments Incorporated - Inventors: Meysam Moallem - Web page: https://patentgrep.com/patent/US12015191B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/3233: {particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/525: {between emitting and receiving antennas} - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 21/065: {Patch antenna array} - H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them - H01Q 1/24: with receiving set - H10D 1/20: Inductors - H10D 89/00: Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00 - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes an integrated circuit die and an antenna substrate coupled to the integrated circuit die. The antenna substrate includes a conductor layer and a first dielectric layer disposed between the conductor layer and the integrated circuit die. The conductor layer includes antennas electrically coupled to the integrated circuit die. The integrated circuit package further includes an I/O substrate coupled to the integrated circuit die opposite the antenna substrate. In some such examples, the I/O substrate includes interconnect connectors and a second dielectric layer disposed between the interconnect connectors and the integrated circuit die. In some such examples, the integrated circuit package includes interconnect connectors extending between the antenna substrate and the I/O substrate. ## Claims ### Claim 1 An integrated circuit package comprising: an antenna substrate including a first dielectric layer, and a plurality of conductor layers including a first conductor layer, a transmitter antenna formed by the first conductor layer, a receiver antenna formed by the first conductor layer, a second conductor layer disposed on a first side of the first dielectric layer and a third conductor layer disposed on a second side of the first dielectric layer, the second side being opposite the first side; an electromagnetic bandgap structure formed in part by the first, second and third conductor layers, a portion of the electromagnetic bandgap structure that is formed by the first conductor layer being disposed between the transmitter antenna and the receiver antenna; an I/O substrate including a second dielectric layer and a second set of package connectors disposed on the second dielectric layer; a first set of package connectors that physically and electrically couple the antenna substrate to the I/O substrate; and an integrated circuit die disposed alongside the first set of package connectors; wherein the integrated circuit die and the first set of package connectors are positioned between the antenna substrate and the I/O substrate; wherein the integrated circuit die includes a bond pad positioned on a first side of the integrated circuit die, and the bond pad is coupled to the second side of the first dielectric layer; wherein the bond pad is electrically connected to the first conductor layer; wherein the antenna substrate is coupled to the first side of the integrated circuit die; wherein the first dielectric layer positioned between the integrated circuit die and the first conductor layer that forms the transmitter antenna and the receiver antenna; and wherein the second dielectric layer is positioned between the second set of the package connectors and the integrated circuit die. ### Claim 2 (depends on 1) The integrated circuit package of claim 1, wherein the first conductor layer includes transmitter antennas including the transmitter antenna and receiver antennas including the receiver antenna arranged in a multi-input multi-output array. ### Claim 3 (depends on 2) The integrated circuit package of claim 2, wherein the transmitter antennas are arranged in a first multi-dimensional array and the receiver antennas are arranged in a second multi-dimensional array. ### Claim 4 (depends on 2) The integrated circuit package of claim 2, wherein the first conductor layer is coupled to the second conductor layer by a first via, and the second conductor layer is coupled to the third conductor layer by a second via. ### Claim 5 (depends on 1) The integrated circuit package of claim 1, wherein at least one of the transmitter antenna and the receiver antenna has: a center portion; a first side portion partially separated from the center portion by a first recess; and a second side portion partially separated from the center portion by a second recess. ### Claim 6 (depends on 1) The integrated circuit package of claim 1, wherein the first set of package connectors includes at least one of: a ball grid array connector, a land grid array connector, a pin grid array connector, or a surface-mount lead. ### Claim 7 (depends on 6) The integrated circuit package of claim 6, wherein the second set of package connectors includes at least one of: a ball grid array connector, a land grid array connector, a pin grid array connector, or a surface-mount lead. ### Claim 8 (depends on 1) The integrated circuit package of claim 1 further comprising a mold compound disposed between the antenna substrate and the I/O substrate, wherein the mold compound is disposed between the first set of package connectors and the integrated circuit die. ### Claim 9 (depends on 8) The integrated circuit package of claim 8, wherein the mold compound further extends between the integrated circuit die and the I/O substrate. ### Claim 10 (depends on 2) The integrated circuit package of claim 2, wherein the transmitter antenna is a first transmitter antenna of the transmitter antennas and is offset from a second transmitter antenna of the transmitter antennas in a first direction, and wherein the first transmitter antenna is offset from a third transmitter antenna of the transmitter antennas in a second direction perpendicular to the first direction. ### Claim 11 (depends on 2) The integrated circuit package of claim 2, wherein the receiver antenna is a first receiver antenna of the receiver antennas and is offset from a second receiver antenna of the receiver antennas in a first direction, and wherein the first receiver antenna is offset from a third receiver antenna of the receiver antennas in a second direction perpendicular to the first direction. ### Claim 12 (depends on 1) The integrated circuit package of claim 1, wherein the bond pad of the integrated circuit die is physically coupled to the antenna substrate.