# US 12,015,101 B2 · Chip scale light-emitting diode package and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,101 B2 - Document ID: US12015101B2 - Status: Granted - Kind: B2 - Application number: 17/450,181 - Filed: 2021-10-07 - Published: 2022-04-14 - Granted: 2024-06-18 - Earliest claimed: 2020-10-13 - Assignees: Lumens Co., Ltd. - Applicants: Lumens Co., Ltd. - Inventors: Seunghyun Oh; Pyoynggug Kim; Sungsik Jo - Web page: https://patentgrep.com/patent/US12015101B2 ## CPC - H10H 20/01: Manufacture or treatment - B29D 11/00307: {Producing lens wafers} - B29D 11/00432: {Auxiliary operations, e.g. machines for filling the moulds (B29D11/00125 takes precedence)} - B29D 11/00519: {Reusable moulds} - B29D 11/00807: {Producing lenses combined with electronics, e.g. chips} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/856: Reflecting means - H10H 20/0361: {of wavelength conversion means} - H10H 20/0363: {of optical field-shaping means} - H10H 20/8515: {not being in contact with the bodies} - H10H 20/853: characterised by their shape - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00) ## Abstract A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips. ## Claims ### Claim 1 A method of manufacturing a chip scale light- emitting diode package, the method comprising: manufacturing a lens molding sheet having intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging, on the adhesive layer, light-emitting diode chips each having a first surface, on which a first electrode pad and a second electrode pad are formed, and a second surface opposite to the first surface, in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips, wherein the adhesive layer includes a first adhesive film attached to the lens layer and a second adhesive film attached to the light-emitting diode chips, and a wavelength conversion material is disposed between the first adhesive film and the second adhesive film. ### Claim 2 (depends on 1) The method of claim 1, wherein, in the manufacturing of the lens molding sheet, an imprinting material layer is formed on a base film, and the imprinting material layer is pressed by a mold having projections corresponding to the intaglios to form the intaglios. ### Claim 3 (depends on 1) The method of claim 1, wherein the adhesive layer comprises an adhesive film having a surface in contact with the flat surface of the lens layer and a surface in contact with the light-emitting diode chips, wherein each of the surfaces has adhesiveness. ### Claim 4 (depends on 1) The method of claim 1, further comprising separating the chip array sheet from the lens molding sheet, and cutting the chip array sheet separated from the lens molding sheet into a plurality of chip scale light-emitting diode packages. ### Claim 5 (depends on 1) The method of claim 1, further comprising forming a plurality of chip scale light-emitting diode packages by cutting only the chip array sheet while the chip array sheet is positioned on the lens molding sheet, and transferring the plurality of chip scale light-emitting diode packages onto a support film or substrate after the lens molding sheet holding the plurality of chip scale light-emitting diode packages is inverted by 180 degrees. ### Claim 6 (depends on 1) The method of claim 1, wherein, in manufacturing the chip array sheet, the first electrode pad and the second electrode pad of each of the light-emitting diode chips are exposed to the outside through the molding part. ### Claim 7 (depends on 1) The method of claim 1, wherein each of the light-emitting diode chips includes a first reflective layer and a second reflective layer respectively constituting top and bottom ends thereof. ### Claim 8 (depends on 7) The method of claim 7, wherein the molding part includes a light-transmitting material. ### Claim 9 (depends on 1) The method of claim 1, wherein the molding part includes a reflective material.