# US 12,015,044 B2 · Image sensor module and camera module including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,044 B2 - Document ID: US12015044B2 - Status: Granted - Kind: B2 - Application number: 17/592,925 - Filed: 2022-02-04 - Published: 2023-04-20 - Granted: 2024-06-18 - Earliest claimed: 2021-10-14 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Kang Jin Lee - Web page: https://patentgrep.com/patent/US12015044B2 ## CPC - H10F 39/811: {Interconnections} - G02B 5/208: {for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation} - H04N 23/51: Housings - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H10F 39/804: {Containers or encapsulations} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An image sensor module includes an image sensor and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, an accommodation portion in which the image sensor is disposed is provided at the step portion, the image sensor is connected to the substrate by a bonding wire, and the bonding wire is covered with a bonding portion. ## Claims ### Claim 1 An image sensor module comprising: an image sensor; and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, wherein an accommodation portion in which the image sensor is disposed is provided at the step portion, wherein the image sensor is connected to the substrate by a bonding wire, wherein the bonding wire is covered with a bonding portion, wherein an inclined surface is disposed on the step portion, and a bonding pad provided at the step portion is disposed on the inclined surface, and wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction. ### Claim 2 (depends on 1) The image sensor module of claim 1, wherein the accommodation portion has a shape of a recess or a hole to accommodate the image sensor. ### Claim 3 (depends on 1) The image sensor module of claim 1, wherein the bonding portion covers a bonding pad provided at the image sensor and the bonding pad provided at the step portion. ### Claim 4 (depends on 3) The image sensor module of claim 3, wherein the bonding pad provided at the step portion is disposed in a position lower than that of the bonding pad provided at the image sensor in an optical axis direction. ### Claim 5 (depends on 1) The image sensor module of claim 1, further comprising: a sub-housing attached to the bonding portion, wherein an infrared (IR) cut-off filter is disposed at the sub-housing. ### Claim 6 (depends on 5) The image sensor module of claim 5, wherein an uneven portion is provided on one surface of the sub-housing attached to the bonding portion. ### Claim 7 (depends on 5) The image sensor module of claim 5, wherein a first blocking wall protruding toward the image sensor is disposed in the sub-housing. ### Claim 8 (depends on 7) The image sensor module of claim 7, wherein a second blocking wall protruding toward the step portion is disposed in the sub-housing. ### Claim 9 (depends on 8) The image sensor module of claim 8, wherein the bonding portion is disposed between the first blocking wall and the second blocking wall. ### Claim 10 (depends on 5) The image sensor module of claim 5, wherein a seating recess is provided in one surface of the sub-housing facing the bonding portion. ### Claim 11 (depends on 5) The image sensor module of claim 5, wherein the substrate includes a protrusion portion protruding toward the sub-housing from an outer side of the step portion, and the sub-housing is bonded to the bonding portion and the protrusion portion. ### Claim 12 (depends on 5) The image sensor module of claim 5, wherein the substrate includes a protrusion portion protruding toward the sub-housing from an outer side of the step portion, and an apex of the bonding wire is positioned below an uppermost end surface of the protrusion portion. ### Claim 13 (depends on 1) The image sensor module of claim 1, wherein a reinforcing plate is coupled to a lower surface of the substrate. ### Claim 14 (depends on 1) A camera module comprising: a lens module including at least one lens; a housing accommodating the lens module; and the image sensor module of claim 1 configured to convert light incident through the lens module into an electrical signal. ### Claim 15 An image sensor module comprising: an image sensor; and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, wherein an accommodation portion in which the image sensor is disposed is provided at the step portion, wherein the image sensor is connected to the substrate by a bonding wire, wherein the bonding wire is covered with a bonding portion, wherein the bonding portion covers a bonding pad provided at the image sensor and a bonding pad provided at the step portion, wherein the bonding pad provided at the step portion is disposed in a position lower than that of the bonding pad provided at the image sensor in an optical axis direction, wherein an inclined surface is disposed on the step portion, and the bonding pad provided at the step portion is disposed on the inclined surface, and wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction. ### Claim 16 An image sensor module comprising: a substrate comprising an accommodation portion and a step portion; an image sensor disposed in the accommodation portion; a bonding wire connected to the substrate in the step portion and connected to the image sensor; and a bonding portion disposed on the bonding wire, wherein an upper surface of the step portion is disposed lower than an upper surface of the image sensor in an optical axis direction, and wherein an inclined surface is disposed on the step portion, and a bonding pad provided at the step portion is disposed on the inclined surface. ### Claim 17 (depends on 16) A camera module comprising: a lens module including at least one lens; a housing accommodating the lens module; the image sensor module of claim 16 configured to convert light incident through the lens module into an electrical signal; a sub-housing attached to the bonding portion; and an infrared (IR) cut-off filter disposed in the sub-housing to filter light incident through the lens module prior to the image sensor.