# US 12,015,016 B2 · Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,015,016 B2 - Document ID: US12015016B2 - Status: Granted - Kind: B2 - Application number: 17/719,361 - Filed: 2022-04-12 - Published: 2022-10-06 - Granted: 2024-06-18 - Earliest claimed: 2012-10-05 - Assignees: Bridgelux, Inc. - Applicants: Bridgelux, Inc. - Inventors: Wenhui Zhang; Tao Tong; Zhengqing Gan - Web page: https://patentgrep.com/patent/US12015016B2 ## CPC - H10W 90/00: Package configurations - H10H 20/8515: {not being in contact with the bodies} - H10H 20/853: characterised by their shape - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another. ## Claims ### Claim 1 A light emitting assembly comprising: a substrate comprising a first region and a second region remote from the first region; a plurality of Light Emitting Diode (LED) dies positioned on a upper surface of the substrate first region, wherein the dies are adjacent one another and electrically connected together, wherein the substrate first region upper surface includes exposed portions that extend continuously between adjacent dies, wherein the LED dies are electrically connected with one or more landing pads on the substrate second region, and wherein the one or more landing pads are configured to make electrical connection with an interconnect substrate; and an optical lens structure disposed over the plurality of dies, wherein the optical lens structure is in contact with and extends along a substantial entirety of the substrate first region upper surface exposed portions. ### Claim 2 (depends on 1) The light emitting assembly of claim 1, wherein the optical lens structure comprises optical lenses disposed over each of the LED dies, wherein the optical lenses of the LED dies are integral such that the optical lens structure is a one-piece construction. ### Claim 3 (depends on 2) The light emitting assembly of claim 2, wherein the optical lens of a respective LED die does not overlap with an optical lens of an adjacent respective LED die. ### Claim 4 (depends on 1) The light emitting assembly of claim 1, wherein at least some of the LED dies are arranged in a circular pattern. ### Claim 5 (depends on 1) The light emitting assembly of claim 1, wherein the LED dies form an array, wherein the LED dies are spaced apart from one another a distance, and wherein the distance between adjacent LED dies is less than about 4 times the LED die size as measured from a middle of adjacent LED dies. ### Claim 6 (depends on 5) The light emitting assembly of claim 5, wherein the distance between adjacent LED dies is less than about 3 times the LED die size as measured from a middle of adjacent LED dies. ### Claim 7 (depends on 1) The light emitting assembly of claim 1, wherein the LED dies are electrically connected together by wired bond connection. ### Claim 8 (depends on 1) The light emitting assembly of claim 1, further comprising an interconnect substrate that is configured to connect with at least a portion of the substrate and provide an electrical connection between the substrate one or more landing pads and one or more electrical contact pads of the interconnect substrate for powering the plurality of LED dies. ### Claim 9 A light emitting assembly comprising: a substrate; a plurality of Light Emitting Diode (LED) dies disposed on a surface of the substrate and electrically connected together, wherein substrate surface portions between adjacent LED dies are exposed and extend continuously between adjacent LED dies; and a plurality of optical lenses disposed over each of the plurality of LED dies, wherein the plurality of optical lenses are integral with one another forming a one-piece lens structure, and wherein the lens structure contacts and covers a substantial entirety of the substrate surface portions; one or more landing pads disposed on the substrate that are electrically connected with the LED dies, wherein the one or more landing pads are positioned to make contact with electrical contact pads of an interconnect substrate. ### Claim 10 (depends on 9) The light emitting assembly of claim 9, wherein the each of the optical lenses are hemispherical in shape, and wherein the optical lens of a respective LED die does not overlap with the optical lens of an adjacent respective LED die. ### Claim 11 (depends on 10) The light emitting assembly of claim 10, wherein the optical lenses have a lens diameter between about 1.5 to 3 times the size of a respective LED die. ### Claim 12 (depends on 10) The light emitting assembly of claim 10, wherein a connecting segment is interposed between adjacent optical lenses, and wherein the optical segment has a diameter as measured from the substrate that is less than the adjacent optical lenses. ### Claim 13 (depends on 9) The light emitting assembly of claim 9, wherein at least some of the LED dies are arranged in a circular pattern. ### Claim 14 (depends on 9) The light emitting assembly of claim 9, wherein one or more of the LED dies are positioned in a center location, and wherein a number of the LED dies are arranged forming a perimeter around the one or more LED dies in the center location. ### Claim 15 (depends on 9) The light emitting assembly of claim 9, further comprising an interconnect substrate that is configured to connect with at least a portion of the substrate and provide an electrical connection between the substrate one or more landing pads and one or more electrical contact pads of the interconnect substrate for powering the plurality of LED dies. ### Claim 16 A method of making a light emitting assembly comprising the steps of: placing a plurality of Light Emitting Diode (LED) dies on a substrate surface adjacent one another; electrically connecting the LED dies together and electrically connecting the LED dies to one or more landing pads on the substrate, wherein substrate surface portions extending between adjacent LED die are exposed along an entirety of a distance between adjacent LED dies; and forming optical lenses over each of the LED dies, wherein the optical lenses are in contact with a substantial entirety of the substrate surface portions; wherein the substrate is configured to connect with an interconnect substrate so that the one or more landing pads contact one or more electrical contact pads to provide electrical power to the LED dies. ### Claim 17 (depends on 16) The method of claim 16, wherein, during the step of placing, the LED dies are arranged having a distance between adjacent LED dies that is less than about 3 times the LED die size as measured from a middle of adjacent LED dies. ### Claim 18 (depends on 16) The method of claim 16, wherein during the step of forming, the optical lenses are integral with each other forming a one-piece lens structure. ### Claim 19 (depends on 16) The method of claim 16, wherein during the step of forming, the each of the optical lenses are hemispherical in shape, and wherein the optical lens of a respective LED die does not overlap with the optical lens of an adjacent respective LED die. ### Claim 20 (depends on 16) The method of claim 16, wherein during the step of placing, at least some of the LED dies are arranged to form a perimeter around one or more other LED dies.