# US 12,015,007 B2 · Adhesive member and display device including the same

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- Number: US 12,015,007 B2
- Document ID: US12015007B2
- Status: Granted
- Kind: B2
- Application number: 18/074,671
- Filed: 2022-12-05
- Published: 2023-03-30
- Granted: 2024-06-18
- Earliest claimed: 2020-06-29
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., LTD.
- Inventors: Hong Am Kim; Young Min Cho
- Web page: https://patentgrep.com/patent/US12015007B2

## CPC

- G09G 3/006: {Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309)}
- H10W 90/00: Package configurations
- G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels}
- G02F 1/13458: {Terminal pads}
- G09G 3/3208: organic, e.g. using organic light-emitting diodes [OLED]
- H10K 59/129: Chiplets
- G02F 2202/28: Adhesive materials or arrangements
- G09G 2300/0426: Layout of electrodes and connections
- H10K 59/179: Interconnections, e.g. wiring lines or terminals
- H10W 72/013: {of die-attach connectors}
- H10W 72/01321: {using local deposition}
- H10W 72/01333: {in liquid form, e.g. spin coating, spray coating or immersion coating}
- H10W 72/01351: {Changing the shapes of die-attach connectors}
- H10W 72/01361: {Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W72/01351)}
- H10W 72/072: {of bump connectors}
- H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07353: {changes in shapes}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/234: {Cross-sectional shape, i.e. in side view}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/261: {Functions other than electrical connecting}
- H10W 72/267: {Multiple bump connectors having different functions}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/322: {Multilayered die-attach connectors, e.g. a coating on a top surface of a core}
- H10W 72/324: {Die-attach connectors having multiple side-by-side cores}
- H10W 72/331: {Shapes of die-attach connectors}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/20: Configurations of stacked chips
- H10W 90/284: {characterised by structural arrangements for measuring or testing}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G09G: ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION (arrangements for transferring data between digital computers and displays G06F3/14; static indicating arrangements comprising an association of a number of separate sources or light control cells G09F9/00; static indicating arrangements comprising integral associations of a number of light sources H01J, H01K, H10H, H05B33/12; scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission, details thereof H04N1/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A display device includes a substrate including a conductive pad, a driving chip facing the substrate and including a conductive bump electrically connected to the conductive pad and an inspection bump which is insulated from the conductive pad, and an adhesive member which is between the conductive pad and the driving chip and connects the conductive pad to the driving chip. The adhesive member includes a first adhesive layer including a conductive ball, and a second adhesive layer facing the first adhesive layer, the second adhesive layer including a first area including a color-changing material, and a second area adjacent to the first area and excluding the color-changing material.

## Claims

### Claim 1

An adhesive member comprising:
a first adhesive layer; and
a second adhesive layer facing the first adhesive layer, the second adhesive layer including:
a first area including a color-changing material, and
a second area excluding the color-changing material.

### Claim 2 (depends on 1)

The adhesive member of claim 1, wherein the first adhesive layer includes a conductive member.

### Claim 3 (depends on 2)

The adhesive member of claim 2, wherein the first adhesive layer includes a first adhesive material having a first modulus.

### Claim 4 (depends on 3)

The adhesive member of claim 3, further comprising a third adhesive layer,
wherein the third adhesive layer includes a second adhesive material having a second modulus which is smaller than the first modulus of the first adhesive layer.

### Claim 5 (depends on 3)

The adhesive member of claim 3, wherein the second adhesive layer includes a second adhesive material having a second modulus which is smaller than the first modulus of the first adhesive layer.

### Claim 6 (depends on 3)

The adhesive member of claim 3, further comprising a third adhesive layer between the first adhesive layer and the second adhesive layer,
wherein the third adhesive layer includes a second adhesive material having a second modulus which is smaller than the first modulus of the first adhesive layer.

### Claim 7 (depends on 1)

The adhesive member of claim 1, wherein the color-changing material changes color by pressure applied to the first area of the second adhesive layer.