# US 12,014,998 B2 · Semiconductor devices comprising a radar semiconductor chip and associated production methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,998 B2 - Document ID: US12014998B2 - Status: Granted - Kind: B2 - Application number: 18/312,800 - Filed: 2023-05-05 - Published: 2023-08-31 - Granted: 2024-06-18 - Earliest claimed: 2019-02-05 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Ernst Seler; Markus Josef Lang; Maciej Wojnowski - Web page: https://patentgrep.com/patent/US12014998B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - G01S 7/032: {Constructional details for solid-state radar subsystems} - G01S 13/08: Systems for measuring distance only (indirect measurement G01S13/46) - H01P 5/107: Hollow-waveguide/strip-line transitions - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 15/08: formed of solid dielectric material - H01Q 19/062: {for focusing} - H01Q 21/064: {using horn or slot aerials (slotted waveguides arrays H01Q21/005)} - H01Q 25/007: {using two or more primary active elements in the focal region of a focusing device (for operation on different wavebands H01Q5/22)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - G01S 13/931: of land vehicles - H01Q 21/065: {Patch antenna array} - H10W 44/212: {Coaxial feed-throughs in substrates} - H10W 44/216: {Waveguides, e.g. strip lines} - H10W 44/219: {characterised by transitions between different types of waveguides} - H10W 44/248: {for antennas} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate. ## Claims ### Claim 1 A semiconductor device, comprising: a substrate having a first surface and a second surface opposite the first surface; a connection element, arranged on the first surface of the substrate, connecting the substrate to a printed circuit board; a radar semiconductor chip arranged on the first surface of the substrate; and a dielectric lens, arranged over the second surface of the substrate, configured to focus signals transmitted or received by the semiconductor device, wherein the dielectric lens and the printed circuit board form a cavity completly enclosing the substrate, the connection element, and the radar semiconductor chip. ### Claim 2 (depends on 1) The semiconductor device of claim 1, wherein the dielectric lens surrounds the connection element. ### Claim 3 (depends on 1) The semiconductor device of claim 1, wherein the dielectric lens and the connection element connect to a same surface of the printed circuit board. ### Claim 4 (depends on 1) The semiconductor device of claim 1, further comprising: one or more antennas on the second surface of the substrate, wherein the dielectric lens is configured to focus the signals transmitted or received by the one or more antennas. ### Claim 5 (depends on 4) The semiconductor device of claim 4, wherein the dielectric lens is configured to focus the signals received by the semiconductor device on to the one or more antennas. ### Claim 6 (depends on 4) The semiconductor device of claim 4, wherein the one or more antennas comprises a plurality of antennas spaced on the substrate. ### Claim 7 (depends on 6) The semiconductor device of claim 6, wherein the dielectric lens is configured to focus the signals transmitted by the plurality of antennas into a delimited narrow beam. ### Claim 8 (depends on 6) The semiconductor device of claim 6, wherein the dielectric lens has a shape based on an arrangement of the plurality of antennas on the substrate. ### Claim 9 A method for producing a semiconductor device, wherein the method comprises: arranging a connection element on a first surface of a substrate, wherein the connection element connects the substrate to a printed circuit board; arranging a radar semiconductor chip on the first surface of the substrate; and arranging a dielectric lens over a second surface of the substrate, wherein the dielectric lens is configured to focus signals transmitted or received by the semiconductor device, wherein the dielectric lens and the printed circuit board form a cavity completely enclosing the substrate, the connection element, and the radar semiconductor chip. ### Claim 10 (depends on 9) The method of claim 9, wherein the dielectric lens surrounds the connection element. ### Claim 11 (depends on 9) The method of claim 9, wherein the dielectric lens and the connection element connect to a same surface of the printed circuit board. ### Claim 12 (depends on 9) The method of claim 9, further comprising: arranging one or more antennas on the second surface of the substrate, wherein the dielectric lens is configured to focus the signals transmitted or received by the one or more antennas. ### Claim 13 (depends on 9) The method of claim 9, wherein arranging the dielectric lens comprises: producing the dielectric lens over the second surface. ### Claim 14 (depends on 9) The method of claim 9, wherein the dielectric lens is produced via a three-dimensional printing method. ### Claim 15 A semiconductor device, comprising: a substrate having a first surface and a second surface opposite the first surface; a connection element, arranged on the first surface of the substrate, connecting the substrate to a printed circuit board; and a dielectric lens, arranged over the second surface of the substrate, configured to focus signals transmitted or received by the semiconductor device, wherein the dielectric lens and the printed circuit board form a cavity completly enclosing the substrate and the connection element. ### Claim 16 (depends on 15) The semiconductor device of claim 15, wherein the dielectric lens surrounds the connection element. ### Claim 17 (depends on 15) The semiconductor device of claim 15, wherein the dielectric lens comprises one or more of a quartz, a polyethylene, an acrylonitrile-butadiene-styrene plastic, or an acrylonitrile-butadiene-styrene-M30 plastic. ### Claim 18 (depends on 1) The semiconductor device of claim 1, further comprising: a signal routing structure, in the substrate, electrically connecting the connection element to the radar semiconductor chip. ### Claim 19 (depends on 9) The method of claim 9, further comprising: arranging a signal routing structure in the substrate, wherein the signal routing structure electrically connects the connection element to the radar semiconductor chip. ### Claim 20 (depends on 15) The semiconductor device of claim 15, further comprising: a signal routing structure, in the substrate, electrically connecting the connection element to a radar semiconductor chip.