# US 12,014,974 B2 · Power module with electrodes and heat sink and manufacturing method therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,974 B2 - Document ID: US12014974B2 - Status: Granted - Kind: B2 - Application number: 17/615,206 - Filed: 2019-07-02 - Published: 2022-07-21 - Granted: 2024-06-18 - Earliest claimed: 2019-07-02 - Assignees: Mitsubishi Electric Corporation - Applicants: Mitsubishi Electric Corporation - Inventors: Masakazu Tani - Web page: https://patentgrep.com/patent/US12014974B2 ## CPC - H10W 90/811: {Multiple chips on leadframes} - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/778: {in encapsulations} - H10W 70/421: {Shapes or dispositions} - H10W 70/461: {specially adapted for cooling} - H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00} - H10W 74/016: {using moulds} - H10W 74/111: {the semiconductor body being completely enclosed} - H10W 90/00: Package configurations - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 72/07354: {changes in dispositions} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/763: {between laterally-adjacent chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract A manufacturing method for a power module capable of shortening a manufacturing time for a power module is obtained. The manufacturing method for a power module includes: a subassembly arranging step of placing a subassembly including a first electrode, a semiconductor device, and a second electrode on a heat sink via a joining material; and a transfer molding step of, after the subassembly arranging step, under a state in which the first electrode, the semiconductor device, and a second-electrode inner portion are arranged in a region surrounded by the heat sink and a molding die, injecting a thermoplastic resin into the region, wherein, in the transfer molding step, the subassembly is joined to the heat sink via the joining material with use of the resin. ## Claims ### Claim 1 A power module, comprising: a subassembly including: a first electrode; a semiconductor device joined to the first electrode; and a second electrode joined to the semiconductor device; a heat sink to which the subassembly is joined via a joining material; and a resin portion molded integrally with the first electrode, the semiconductor device, a second-electrode inner portion being a portion of the second electrode joined to the semiconductor device, and the heat sink; and a water jacket joined to the heat sink, wherein the water jacket includes: a frame having a plurality of through holes; and a tub portion joined to the frame, and wherein, under a state in which a plurality of heat sinks are inserted into the plurality of through holes, respectively, each of the plurality of heat sinks and the water jacket are joined to each other. ### Claim 2 (depends on 1) The power module according to claim 1, wherein the heat sink includes a flat-plate portion having a first surface on which the subassembly is placed via the joining material, and wherein the resin portion is molded integrally with the first surface of the heat sink. ### Claim 3 (depends on 1) The power module according to claim 1, wherein the heat sink includes a flat-plate portion having a first surface on which the subassembly is placed via the joining material, and wherein the resin portion is molded integrally with the first surface and a side surface of the heat sink. ### Claim 4 (depends on 1) The power module according to claim 1, wherein the joining material is a semi-cured thermosetting resin. ### Claim 5 (depends on 1) The power module according to claim 1, wherein the joining material has a film-like shape or a sheet-like shape. ### Claim 6 (depends on 1) The power module according to claim 1, wherein the second electrode and the semiconductor device are joined to each other by wire bonding. ### Claim 7 (depends on 1) The power module according to claim 1, wherein the second electrode and the semiconductor device are joined to each other with use of solder. ### Claim 8 (depends on 1) The power module according to claim 1, wherein the joining material is made of a sintered material. ### Claim 9 (depends on 1) The power module according to claim 1, wherein a plurality of subassemblies are separately joined to the heat sink via the joining material, and wherein a plurality of separate resin portions corresponding to the plurality of subassemblies are molded integrally with the heat sink. ### Claim 10 A manufacturing method for a power module, comprising: a subassembly arranging step of placing a subassembly including a first electrode, a semiconductor device joined to the first electrode, and a second electrode joined to the semiconductor device on a heat sink via a joining material; and a transfer molding step of, after the subassembly arranging step, under a state in which the first electrode, the semiconductor device, and a second-electrode inner portion being a portion of the second electrode joined to the semiconductor device are arranged in a region surrounded by the heat sink and a molding die, injecting a thermoplastic resin into the region, wherein, in the transfer molding step, the subassembly is joined to the heat sink via the joining material with use of the resin, wherein, in the transfer molding step, a second pin abuts against at least two or more pin abutment portions formed on the joining material so that the joining material is positioned with respect to the heat sink. ### Claim 11 (depends on 10) The manufacturing method for a power module according to claim 10, wherein, in the transfer molding step, a first pin pushes the first electrode toward the heat sink so that the first electrode is positioned with respect to the heat sink. ### Claim 12 (depends on 10) The manufacturing method for a power module according to claim 10, wherein the two or more pin abutment portions are two or more side surfaces formed on the joining material. ### Claim 13 (depends on 10) The manufacturing method for a power module according to claim 10, wherein the two or more pin abutment portions are two or more holes formed in the joining material.