# US 12,014,971 B2 · Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,971 B2 - Document ID: US12014971B2 - Status: Granted - Kind: B2 - Application number: 17/335,077 - Filed: 2021-06-01 - Published: 2022-12-01 - Granted: 2024-06-18 - Earliest claimed: 2021-06-01 - Assignees: NXP USA, Inc. - Applicants: NXP USA, Inc. - Inventors: Lu Li; Sharan Kishore; Freek Egbert van Straten; Lakshminarayan Viswanathan - Web page: https://patentgrep.com/patent/US12014971B2 ## CPC - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/77: Auxiliary members characterised by their shape - H10W 40/25: characterised by their materials - H10W 40/251: {Organics} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)} - H10W 40/611: {Bolts or screws} - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 40/235: {attached to package parts} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A thermal interface structure for transferring heat from an electronic component to a system heat sink includes a stack of one or more layers of a stiff thermal interface material and one or more layers of a compliant thermal interface material stacked on and connected to the one or more layers of the compliant thermal interface material. In some embodiments, the thermal interface structure also may include one or more layers of a shape memory alloy and/or a collapsible encasement. ## Claims ### Claim 1 A thermal interface structure for transferring heat from an electronic component to a system heat sink, the thermal interface structure comprising: a plurality of layers of a stiff thermal interface material; and a plurality of layers of a compliant thermal interface material stacked on and connected to the plurality of layers of the stiff thermal interface material, wherein the plurality of layers of the compliant thermal interface material and layers of the plurality of layers of the stiff thermal interface material form a stack, wherein at least one of the plurality of layers of the compliant thermal interface material is formed between two of the plurality of layers of the stiff interface material, and wherein at least one of the plurality of layers of the stiff interface material is formed between two of the plurality of layers of the compliant thermal interface material. ### Claim 2 (depends on 1) The thermal interface structure of claim 1, wherein the compliant thermal interface material is selected from silicone-containing thermal gap filler, liquid solder, non-silicon resin material, thermal grease, thermal conductive grease, thermally conductive epoxy, thermally conductive epoxy paste, and thermally conductive gel. ### Claim 3 (depends on 1) The thermal interface structure of claim 1, wherein the stiff thermal interface material is selected from pyrolytic graphite sheet material, black lead sheet material, electrically conductive graphite sheet material, indium foil, copper foil, silicone sheet material, non-silicon resin sheet material, thermally-conductive gel pad material, silver foil, and silver sinter film. ### Claim 4 (depends on 1) The thermal interface structure of claim 1, wherein: the compliant thermal interface material has an XY-plane thermal conductivity in a range from 1 Watt per meter Kelvin (W/mK) to 250 W/mK, and a Z-axis thermal conductivity in a range from 1 W/mK to 250 W/mK; and the stiff thermal interface material has an XY-plane thermal conductivity in a range from 50 W/mK to 1700 W/mK, and a Z-axis thermal conductivity in a range from 1 W/mK to 450 W/mK. ### Claim 5 (depends on 1) The thermal interface structure of claim 1, wherein: Each of the plurality of layers of the compliant thermal interface material has a thickness in a range from 5 microns to 500 microns; and each of the plurality of layers of the stiff thermal interface material has a thickness in a range from 5 microns to 500 microns. ### Claim 6 (depends on 1) The thermal interface structure of claim 1, wherein: the plurality of layers of the compliant thermal interface material includes from 2 to 10 layers; the plurality of layers of the stiff thermal interface material includes from 2 to 10 layers; and the plurality of layers of the compliant thermal interface material and the plurality of layers of the stiff thermal interface material are stacked and interleaved in an alternating arrangement. ### Claim 7 (depends on 1) The thermal interface structure of claim 1, wherein: at least some of the plurality of layers of the stiff thermal interface material include a through hole that provides a channel through which air and the compliant thermal interface material may flow during compression of the thermal interface structure. ### Claim 8 (depends on 1) The thermal interface structure of claim 1, further comprising: a collapsible encasement at least partially surrounding the stack. ### Claim 9 (depends on 8) The thermal interface structure of claim 8, wherein the collapsible encasement is formed from a material selected from copper, aluminum, indium, silver, a collapsible metal, and a shape memory alloy. ### Claim 10 (depends on 8) The thermal interface structure of claim 8, wherein the collapsible encasement includes at least one opening through which air and the compliant thermal interface material may flow during compression of the thermal interface structure. ### Claim 11 (depends on 1) The thermal interface structure for transferring heat from an electronic component to a system heat sink of claim 1, wherein the uppermost surface and the lowest surface of the stack include the same material type. ### Claim 12 (depends on 1) The thermal interface structure for transferring heat from an electronic component to a system heat sink of claim 1, further comprising one or more shape memory alloy layers formed below an uppermost surface of the stack and above a lowest surface of the stack, in direct contact with the one or more layers of the compliant thermal interface material. ### Claim 13 (depends on 12) The thermal interface structure of claim 12, wherein the one or more shape memory alloy layers are configured to have a relatively-flat deformed shape that transitions to a curved pre-deformed shape in response to absorbing thermal energy. ### Claim 14 An electrical system comprising: an electronic component; a system heat sink; a composite thermal interface structure with a first surface contacting the electronic component and a second surface contacting the system heat sink, wherein the composite thermal interface structure includes a stack of a plurality of layers of a stiff thermal interface material, and a plurality of layers of a compliant thermal interface material stacked on and connected to the one or more layers of the stiff thermal interface material, wherein at least one of the plurality of layers of the compliant thermal interface material is formed between two of the plurality of layers of the stiff interface material, and wherein at least one of the plurality of layers of the stiff interface material is formed between two of the plurality of layers of the compliant thermal interface material. ### Claim 15 (depends on 14) The electrical system of claim 14, wherein: the compliant thermal interface material is selected from silicone-containing thermal gap filler, liquid solder, non-silicon resin material, thermal grease, thermal conductive grease, thermally conductive epoxy, thermally conductive epoxy paste, and thermally conductive gel; and the stiff thermal interface material is selected from pyrolytic graphite sheet material, black lead sheet material, electrically conductive graphite sheet material, Indium foil, Copper foil, silicone sheet material, non-silicon resin sheet material, thermally-conductive gel pad material, silver foil, and silver sinter film. ### Claim 16 (depends on 14) The electrical system of claim 14, wherein the composite thermal interface structure further comprises: a collapsible encasement at least partially surrounding the stack. ### Claim 17 (depends on 16) The electrical system of claim 16, wherein the collapsible encasement is formed from a material selected from copper, aluminum, indium, silver, a collapsible metal, and a shape memory alloy. ### Claim 18 (depends on 14) The electrical system of claim 14, wherein the electronic component comprises: a module substrate having a mounting surface and a thermal interface surface opposite the mounting surface, wherein the thermal interface surface faces the composite thermal interface structure, and the mounting surface faces away from the composite thermal interface structure; a thermally conductive structure extending through the module substrate and having a first surface co-planar with the mounting surface and a second surface co-planar with the thermal interface surface; a semiconductor die coupled to the mounting surface of the module substrate and to the first surface of the thermally conductive structure; and a plurality of terminals extending from the mounting surface. ### Claim 19 (depends on 18) The electrical system of claim 18, further comprising: a system substrate with a plurality of terminal pads at a first surface of the system substrate, wherein the plurality of terminals of the electronic component are connected to the plurality of terminal pads; and a securement mechanism that connects the system heat sink to the system substrate, and that provides a clamping force to compress the composite thermal interface structure between the electronic component and the system heat sink. ### Claim 20 A method of manufacturing a thermal interface structure and an electrical system, the method comprising: Assembling a stack of multiple layers of different thermal interface materials, wherein the stack includes a plurality of layers of a stiff thermal interface material, a plurality of layers of a compliant thermal interface material connected to the layers of the stiff thermal interface material, and one or more shape memory alloy layers formed below an uppermost surface of the stack and above a lowest surface of the stack, within or in contact with the layers of the compliant thermal interface material, wherein at least one of the plurality of layers of the compliant thermal interface material is formed between two of the plurality of layers of the stiff interface material, and wherein at least one of the plurality of layers of the stiff interface material is formed between two of the plurality of layers of the compliant thermal interface material. ### Claim 21 (depends on 20) The method of claim 20, further comprising: at least partially enclosing the stack with a collapsible encasement. ### Claim 22 (depends on 20) The method of claim 20, further comprising: coupling an electronic component to a surface of a system substrate; inserting the stack between the electronic component and a system heat sink; and connecting the system heat sink to the system substrate with a securement mechanism that applies a clamping force to compress the stack between the electronic component and the system heat sink.