# US 12,014,967 B2 · Manufacturing method of electronic package comprising a wire within an electronic component

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- Number: US 12,014,967 B2
- Document ID: US12014967B2
- Status: Granted
- Kind: B2
- Application number: 18/215,113
- Filed: 2023-06-27
- Published: 2023-10-26
- Granted: 2024-06-18
- Earliest claimed: 2021-05-04
- Assignees: Siliconware Precision Industries Co., Ltd.
- Applicants: Siliconware Precision Industries Co., Ltd.
- Inventors: Ho-Chuan Lin; Min-Han Chuang; Chia-Chu Lai
- Web page: https://patentgrep.com/patent/US12014967B2

## CPC

- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 20/427: {Power or ground buses}
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/015: {of bond wires}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/50: Bond wires
- H10W 74/01: Manufacture or treatment
- H10W 90/00: Package configurations
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

## Claims

### Claim 1

A method of manufacturing an electronic package, comprising:
providing a first electronic component including at least one conductive layer on a surface of the first electronic component, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface, and at least one wire electrically connected with the at least one electrode pad, and is provided inside the first electronic component, such that the at least one conductive layer is electrically connected with the at least one wire, and the at least one conductive layer is free from being formed on the at least one electrode pad; and
embedding the first electronic component along with the at least one conductive layer in an encapsulant.

### Claim 2 (depends on 1)

The method of claim 1, wherein the at least one electrode pad is positioned in a center of the active surface.

### Claim 3 (depends on 1)

The method of claim 1, wherein the at least one wire is exposed from at least one of the side surfaces and the non-active surface of the first electronic component for contacting the at least one conductive layer.

### Claim 4 (depends on 1)

The method of claim 1, wherein the at least one conductive layer is formed on at least one of the non-active surface and the side surfaces of the first electronic component.

### Claim 5 (depends on 1)

The method of claim 1, further comprising forming a routing structure on the encapsulant, wherein the routing structure is electrically connected with the at least one electrode pad.

### Claim 6 (depends on 5)

The method of claim 5, wherein the routing structure includes a first surface and a second surface opposite to the first surface, wherein the encapsulant and the first electronic component are disposed on the first surface, and at least one second electronic component electrically connected with the routing structure is disposed on the second surface, and wherein a plurality of second electronic components are disposed on the second surface of the routing structure, such that the first electronic component is electrically bridged between two of the plurality of second electronic components.

### Claim 7 (depends on 1)

The method of claim 1, further comprising embedding conductive pillars in the encapsulant.

### Claim 8 (depends on 7)

The method of claim 7, further comprising forming a plurality of conductive components on the encapsulant, wherein the plurality of conductive components are electrically connected with the at least one conductive layer and the conductive pillars.

### Claim 9 (depends on 7)

The method of claim 7, further comprising forming a plurality of conductive components on the encapsulant, wherein the plurality of conductive components are electrically connected with the at least one conductive layer.

### Claim 10 (depends on 1)

The method of claim 1, wherein a plurality of the wires separated and disconnected from one another are provided inside the first electronic component, and a plurality of the conductive layers separated and disconnected from one another are formed on the first electronic component, such that each of the plurality of wires is electrically connected to a different conductive layer.