# US 12,014,963 B2 · Power semiconductor module having protrusions as fixing structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,963 B2 - Document ID: US12014963B2 - Status: Granted - Kind: B2 - Application number: 17/362,088 - Filed: 2021-06-29 - Published: 2022-12-29 - Granted: 2024-06-18 - Earliest claimed: 2021-06-29 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Tomas Manuel Reiter; Peter Bayer; Christoph Koch - Web page: https://patentgrep.com/patent/US12014963B2 ## CPC - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 76/15: Containers comprising an insulating or insulated base - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits - H10W 20/427: {Power or ground buses} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/695: Organic materials - H10W 76/12: characterised by their shape - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 2201/10424: Frame holders - H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A power semiconductor module includes: an electrically insulative frame having opposite first and second mounting sides, and a border that defines a periphery of the electrically insulative frame; a first substrate seated in the electrically insulative frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a plurality of busbars attached to the first substrate and extending through the border of the electrically insulative frame; a plurality of fixing positions at the first mounting side of the electrically insulative frame; and a plurality of electrically insulative protrusions jutting out from the second mounting side of the electrically insulative frame, wherein the protrusions are vertically aligned with the fixing positions. Methods of producing the power semiconductor module and power electronic assemblies that incorporate the power semiconductor module are also described. ## Claims ### Claim 1 A power semiconductor module, comprising: an electrically insulative frame having a first mounting side, a second mounting side opposite the first mounting side, and a border that defines a periphery of the electrically insulative frame; a first substrate seated in the electrically insulative frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a plurality of busbars attached to the first substrate and extending through the border of the electrically insulative frame; a plurality of fixing positions at the first mounting side of the electrically insulative frame and configured to facilitate attachment of a base plate to the power semiconductor module at the first mounting side of the electrically insulative frame; and a plurality of electrically insulative protrusions jutting out from the second mounting side of the electrically insulative frame, wherein the plurality of electrically insulative protrusions is vertically aligned with the plurality of fixing positions and configured to facilitate attachment of a circuit board to the power semiconductor module at the second mounting side of the electrically insulative frame. ### Claim 2 (depends on 1) The power semiconductor module of claim 1, wherein the electrically insulative frame comprises plastic, and wherein the electrically insulative protrusions are protrusions of the plastic jutting out from the second mounting side of the electrically insulative frame. ### Claim 3 (depends on 2) The power semiconductor module of claim 2, wherein a plurality of protrusions of the plastic jut out from the first mounting side of the electrically insulative frame at the plurality of fixing positions, and wherein the plurality of protrusions of the plastic jutting out from the first mounting side of the electrically insulative frame is vertically aligned with the plurality of protrusions of the plastic jutting out from the second mounting side of the electrically insulative frame. ### Claim 4 (depends on 2) The power semiconductor module of claim 2, further comprising: a plurality of openings in the plastic at the plurality of fixing positions. ### Claim 5 (depends on 1) The power semiconductor module of claim 1, wherein the electrically insulative protrusions are configured to allow attachment of the circuit board at the second mounting side of the electrically insulative frame only in a single orientation. ### Claim 6 (depends on 1) The power semiconductor module of claim 1, further comprising: the base plate attached to the first mounting side of the electrically insulative frame at the plurality of fixing positions. ### Claim 7 (depends on 6) The power semiconductor module of claim 6, wherein the electrically insulative frame comprises plastic, and wherein the electrically insulative protrusions are protrusions of the plastic jutting out from the second mounting side of the electrically insulative frame. ### Claim 8 (depends on 7) The power semiconductor module of claim 7, wherein a plurality of protrusions of the plastic jut out from the first mounting side of the electrically insulative frame, wherein a distal end of the plurality of protrusions of the plastic jutting out from the first mounting side of the electrically insulative frame is deformed to attach the base plate to the first mounting side, and wherein the plurality of protrusions of the plastic jutting out from the first mounting side of the electrically insulative frame is vertically aligned with the plurality of protrusions of the plastic jutting out from the second mounting side of the electrically insulative frame. ### Claim 9 (depends on 7) The power semiconductor module of claim 7, further comprising: a plurality of openings in the plastic at the plurality of fixing positions; and a plurality of fasteners inserted in the plurality of openings and that attach the base plate to the first mounting side of the electrically insulative frame at the plurality of fixing positions.