# US 12,014,962 B2 · Systems and methods for wafer-level photonic testing > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,962 B2 - Document ID: US12014962B2 - Status: Granted - Kind: B2 - Application number: 18/346,555 - Filed: 2023-07-03 - Published: 2023-10-26 - Granted: 2024-06-18 - Earliest claimed: 2019-10-25 - Assignees: Ayar Labs, Inc. - Applicants: Ayar Labs, Inc. - Inventors: Roy Edward Meade; Anatol Khilo; Forrest Sedgwick; Alexandra Wright - Web page: https://patentgrep.com/patent/US12014962B2 ## CPC - G02B 6/305: {and having an integrated mode-size expanding section, e.g. tapered waveguide} - H10P 74/27: {Structural arrangements therefor} - G01R 31/318511: {Wafer Test} - G02B 6/12: of the integrated circuit kind (electric integrated circuits H10B, H10D84/00 - H10D89/00, H10F19/00, H10F39/00, H10H29/00, H10K19/00, H10K39/00, H10K59/00, H10N19/00, H10N39/00, H10N59/00, H10N69/00, H10N79/00, H10N89/00) - G02B 6/13: Integrated optical circuits characterised by the manufacturing method - G02B 6/3636: {the mechanical coupling means being grooves (G02B6/3652 takes precedence)} - H04B 10/0731: {Testing or characterisation of optical devices, e.g. amplifiers} - G02B 6/0028: {Light guide, e.g. taper} - H04B 10/503: {Laser transmitters} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H04B: TRANSMISSION ## Abstract A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region. ## Claims ### Claim 1 A method for fabricating a semiconductor chip, comprising: fabricating a semiconductor chip on a semiconductor wafer, the semiconductor chip including a photonic device, the semiconductor chip including an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated, the semiconductor chip including an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region, the in-plane fiber-to-chip optical coupler optically connected to the photonic device; and fabricating a sacrificial optical structure on the semiconductor wafer, the sacrificial optical structure optically coupled to the in-plane fiber-to-chip optical coupler, the sacrificial optical structure including an out-of-plane optical coupler formed in a portion of the semiconductor wafer outside of the optical fiber attachment region, the out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip, at least a portion of the sacrificial optical structure extending through the optical fiber attachment region, wherein the sacrificial optical structure is fabricated on the semiconductor wafer before the optical fiber alignment structure is fabricated in the optical fiber attachment region. ### Claim 2 (depends on 1) The method as recited in claim 1, further comprising: using the sacrificial optical structure to perform photonic testing of the photonic device on the semiconductor chip with the semiconductor wafer in an intact state and before the optical fiber alignment structure is fabricated in the optical fiber attachment region. ### Claim 3 (depends on 2) The method as recited in claim 2, further comprising: after using the sacrificial optical structure to perform photonic testing of the photonic device on the semiconductor chip, fabricating the optical fiber alignment structure in the optical fiber attachment region of the semiconductor chip. ### Claim 4 (depends on 3) The method as recited in claim 3, wherein fabricating the optical fiber alignment structure in the optical fiber attachment region of the semiconductor chip disables the sacrificial optical structure. ### Claim 5 (depends on 4) The method as recited in claim 4, wherein fabricating the optical fiber alignment structure in the optical fiber attachment region of the semiconductor chip eliminates at least a portion of the sacrificial optical structure. ### Claim 6 (depends on 2) The method as recited in claim 2, further comprising: after using the sacrificial optical structure to perform photonic testing of the photonic device on the semiconductor chip, singulating the semiconductor wafer to release the semiconductor chip from the semiconductor wafer. ### Claim 7 (depends on 6) The method as recited in claim 6, wherein singulating the semiconductor wafer disables the sacrificial optical structure. ### Claim 8 (depends on 7) The method as recited in claim 7, wherein singulating the semiconductor wafer eliminates at least a portion of the sacrificial optical structure. ### Claim 9 (depends on 1) The method as recited in claim 1, wherein fabricating the sacrificial optical structure includes fabricating an optical waveguide that extends through the optical fiber attachment region from the out-of-plane optical coupler to the in-plane fiber-to-chip optical coupler. ### Claim 10 (depends on 9) The method as recited in claim 9, wherein the out-of-plane optical coupler is located within the optical fiber attachment region. ### Claim 11 (depends on 10) The method as recited in claim 10, wherein an entirety of the optical waveguide is located within the optical fiber attachment region. ### Claim 12 (depends on 10) The method as recited in claim 10, wherein the optical fiber attachment region is a first optical fiber attachment region in which a first optical fiber alignment structure is to be fabricated, wherein the semiconductor chip includes a second optical fiber attachment region in which a second optical fiber alignment structure is to be fabricated, wherein the sacrificial optical structure is fabricated on the semiconductor wafer before the second optical fiber alignment structure is fabricated in the second optical fiber attachment region, wherein the in-plane fiber-to-chip optical coupler is a first in-plane fiber-to-chip optical coupler optically connected to a first photonic device within the semiconductor chip, wherein the semiconductor chip is fabricated to include a second in-plane fiber-to-chip optical coupler positioned at an edge of the second optical fiber attachment region, the second in-plane fiber-to-chip optical coupler optically connected to a second photonic device within the semiconductor chip, wherein the optical waveguide is fabricated to extend through the first optical fiber attachment region from the out-of-plane optical coupler to the first in-plane fiber-to-chip optical coupler, and wherein the optical waveguide is fabricated to extend through the second optical fiber attachment region from the out-of-plane optical coupler to the second in-plane fiber-to-chip optical coupler. ### Claim 13 (depends on 12) The method as recited in claim 12, wherein the first optical fiber attachment region is separated from the second optical fiber attachment region by a distance greater than zero. ### Claim 14 (depends on 13) The method as recited in claim 13, wherein a portion of the optical waveguide is fabricated to extend between the first optical fiber attachment region and the second optical fiber attachment region. ### Claim 15 (depends on 9) The method as recited in claim 9, wherein the out-of-plane optical coupler is located within a portion of the semiconductor wafer outside of the optical fiber attachment region. ### Claim 16 (depends on 15) The method as recited in claim 15, wherein the optical waveguide is fabricated to extend through a scribe line region of the semiconductor wafer. ### Claim 17 (depends on 15) The method as recited in claim 15, wherein the out-of-plane optical coupler is located within a scribe line region of the semiconductor wafer. ### Claim 18 (depends on 17) The method as recited in claim 17, wherein the edge of the optical fiber attachment region at which the in-plane fiber-to-chip optical coupler is positioned is an interior edge of the optical fiber attachment region, wherein the optical fiber attachment region includes an exterior edge adjacent to the scribe line region of the semiconductor wafer, wherein the optical waveguide is fabricated to extend across the exterior edge of the optical fiber attachment region. ### Claim 19 (depends on 18) The method as recited in claim 18, wherein the semiconductor chip is a first semiconductor chip and the photonic device is a first photonic device, wherein the optical fiber attachment region is a first optical fiber attachment region and the optical fiber alignment structure is a first optical fiber alignment structure, wherein the in-plane fiber-to-chip optical coupler is a first in-plane fiber-to-chip optical coupler, wherein the method further includes fabricating a second semiconductor chip on the semiconductor wafer, the second semiconductor chip fabricated to include a second photonic device, the second semiconductor chip including a second optical fiber attachment region in which a second optical fiber alignment structure is to be fabricated, wherein the sacrificial optical structure is fabricated on the semiconductor wafer before the second optical fiber alignment structure is fabricated in the second optical fiber attachment region, wherein the second semiconductor chip is fabricated to include a second in-plane fiber-to-chip optical coupler positioned at an interior edge of the second optical fiber attachment region, the second in-plane fiber-to-chip optical coupler optically connected to the second photonic device, wherein the second optical fiber attachment region includes an exterior edge adjacent to the scribe line region of the semiconductor wafer, wherein the optical waveguide is fabricated to extend across the exterior edge of the second optical fiber attachment region. ### Claim 20 (depends on 19) The method as recited in claim 19, wherein the second optical fiber attachment region includes a first lateral edge that extends between a first end of the interior edge of the second optical fiber attachment region and a first end of the exterior edge of the second optical fiber attachment region, wherein the second optical fiber attachment region includes a second lateral edge that extends between a second end of the interior edge of the second optical fiber attachment region and a second end of the exterior edge of the second optical fiber attachment region, and wherein the optical waveguide is fabricated to not extend across either the first lateral edge or the second lateral edge of the second optical fiber attachment region.