# US 12,014,937 B2 · Wafer treatment device

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- Number: US 12,014,937 B2
- Document ID: US12014937B2
- Status: Granted
- Kind: B2
- Application number: 17/726,445
- Filed: 2022-04-21
- Published: 2022-08-04
- Granted: 2024-06-18
- Earliest claimed: 2013-01-14
- Assignees: Pico & Tera Co., Ltd.
- Applicants: Pico & Tera Co., Ltd.
- Inventors: Bum Je Woo
- Web page: https://patentgrep.com/patent/US12014937B2

## CPC

- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- F24F 7/007: with forced flow (using ducting systems F24F7/06)
- H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)}
- H10P 72/1924: {characterised by atmosphere control}
- H10P 72/1926: {characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier}
- H10P 72/3412: {Batch transfer of wafers}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- F24F: AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING (removing dirt or fumes from areas where they are produced B08B15/00; vertical ducts for carrying away waste gases from buildings E04F17/02; tops for chimneys or ventilating shafts, terminals for flues F23L17/02)

## Abstract

Provided is an exhaust system of a wafer treatment device, and the main purpose thereof is to prevent secondary contamination of a wafer by not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with the wafer in a side storage. The wafer treatment device comprises: a cleaning device for removing foreign substances remaining on a wafer; and an exhaust device comprising first and second main bodies at the lower side of a main body of the wafer treatment device. By not allowing foreign substances such as process gases and fumes and the like floating in the wafer treatment device to make contact with a wafer in a side storage, secondary contamination of the wafer is prevented.

## Claims

### Claim 1

A wafer treatment device, comprising:
a wafer cassette;
a first cleaning device provided in the wafer cassette to support a first wafer; and
a second cleaning device stacked on the first cleaning device to support a second wafer,
wherein the first cleaning device and the second cleaning device are arranged in a vertical direction in the wafer cassette,
wherein the first cleaning device comprises: a first purge gas inlet hole; and
a plurality of first injection holes connected with the first purge gas inlet hole,
wherein the second cleaning device comprises: a second purge gas inlet hole; and a plurality of second injection holes connected with the second purge gas inlet hole,
wherein the first purge gas inlet hole is connected to a corresponding first emission hole of an air pressure block emitting a purge gas,
wherein the second purge gas inlet hole is connected to a corresponding second emission hole of the air pressure block emitting the purge gas,
wherein the purge gas supplied through the first emission hole of the air pressure block is only emitted into the wafer cassette through the first injection holes, and the purge gas supplied through the second emission hole of the air pressure block is only emitted into the wafer cassette through the second injection holes,
wherein each emission hole of the air pressure block can be selectively opened and closed independent of the other emission holes, and
wherein the emission holes of the air pressure block supply the purge gas to the corresponding purge gas inlet holes.

### Claim 2 (depends on 1)

The wafer treatment device according to claim 1, further comprising:
at least one sensor for detecting whether a wafer is loaded on each cleaning device; and
a controller configured to sense an electrical signal from said sensor,
wherein the emission holes of the air pressure block are selectively opened and closed by the controller according to the electrical signal.

### Claim 3 (depends on 1)

The wafer treatment device according to claim 1, wherein the first cleaning device includes a wafer support member and a spacer, the wafer support member including a rib that supports the first wafer, the spacer being disposed on the wafer supporting member.

### Claim 4 (depends on 3)

The wafer treatment device according to claim 3, wherein the first purge gas inlet hole of the first cleaning device is provided in the spacer along a lengthwise direction of the spacer, and the plurality of first injection holes are provided at a side of the first purge gas inlet hole and spaced apart from each other in the lengthwise direction.