Apparatus for manufacturing a thin film and a method therefor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsai-Fu Hsiao, Kuang-Yuan Hsu, Pei-Ren Jeng, Tze-Liang Lee
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsai-Fu Hsiao, Kuang-Yuan Hsu, Pei-Ren Jeng, Tze-Liang Lee
Estimating the term…
An apparatus includes a vacuum chamber, a wafer transfer mechanism, a first gas source, a second gas source and a reuse gas pipe. The vacuum chamber is divided into at least three reaction regions including a first reaction region, a second reaction region and a third reaction region. The wafer transfer mechanism is structured to transfer a wafer from the first reaction region to the third reaction region via the second reaction region. The first gas source supplies a first gas to the first reaction region via a first gas pipe, and a second gas source supplies a second gas to the second reaction region via a second gas pipe. The reuse gas pipe is connected between the first reaction region and the third reaction region for supplying an unused first gas collected in the first reaction region to the third reaction region.
A method of forming a film by using an atomic layer deposition (ALD), the method comprising:
A method of forming a film by using an atomic layer deposition (ALD) in a vacuum chamber divided into a plurality of reaction regions including a first reaction region, a second reaction region, and a third reaction region, the plurality of reaction regions being located on a circumference of a circle arranged in order, the method comprising:
A method of forming a film by using an atomic layer deposition (ALD) in a vacuum chamber divided into at least three reaction regions including a first reaction region, a second reaction region, and a third reaction region arranged in order, the method comprising:
Dependencies are inferred from the claim text.