# US 12,014,912 B2 · Apparatus and method for physical vapor deposition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,912 B2 - Document ID: US12014912B2 - Status: Granted - Kind: B2 - Application number: 17/308,372 - Filed: 2021-05-05 - Published: 2022-11-10 - Granted: 2024-06-18 - Earliest claimed: 2021-05-05 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Limited - Inventors: Yu-Young Wang; Wen-Cheng Yang; Chyi-Tsong Ni - Web page: https://patentgrep.com/patent/US12014912B2 ## CPC - H01J 37/3458: {Electromagnets in particular for cathodic sputtering apparatus (electromagnets in general H01F7/06)} - C23C 14/3407: {Cathode assembly for sputtering apparatus, e.g. Target} - C23C 14/35: by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} - H01F 7/20: without armatures (cores H01F3/00; coils H01F5/00 {; shaping metal by applying magnetic forces B21D26/14; electromagnets specially adapted for NMR applications G01R33/381}) - H01F 27/24: Magnetic cores - H01F 27/28: Coils; Windings; Conductive connections - H01F 27/327: {Encapsulating or impregnating (encapsulating coil and core H01F27/022)} - H01J 37/3405: {Magnetron sputtering} - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract An apparatus and method for physical vapor deposition includes a magnetron having a plurality of electromagnets disposed between a base and a magnetic conductive plate. The magnetron includes a plurality of individually controlled electromagnets between a base and an electromagnetic plate. The magnetron controls the polarity and strength of current supplied to the respective electromagnets to generate magnetic fields that confine electrons to areas near a target material within the deposition chamber. ## Claims ### Claim 1 A magnetron for physical vapor deposition, comprising: a magnetic conductive plate defining a plurality of receptacles, wherein the magnetic conductive plate comprises magnetic conductive segments disposed within at least some receptacles of the plurality of receptacles; a base coupled to the magnetic conductive plate; and a plurality of electromagnets disposed between the magnetic conductive plate and the base in a first direction and spaced apart from the magnetic conductive plate in the first direction, wherein: the plurality of electromagnets are in direct contact with the base, and each electromagnet of the plurality of electromagnets comprises: a magnetic core; a coil surrounding the magnetic core, wherein the coil comprises a conductor; and an encapsulator encapsulating the magnetic core and the coil, wherein the encapsulator comprises a magnetic-isolated material. ### Claim 2 (depends on 1) The magnetron of claim 1, wherein the magnetic conductive plate comprises: side surfaces defining the plurality of receptacles. ### Claim 3 (depends on 2) The magnetron of claim 2 wherein some of the magnetic conductive segments disposed within some receptacles of the plurality of receptacles collectively define a polygonal shape. ### Claim 4 (depends on 1) The magnetron of claim 1, comprising a current regulator electrically coupled to one or more electromagnets of the plurality of electromagnets. ### Claim 5 (depends on 4) The magnetron of claim 4, comprising a programmer electrically coupled to the current regulator to activate at least one electromagnet of the plurality of electromagnets, and to concurrently deactivate at least one other electromagnet of the plurality of electromagnets. ### Claim 6 A deposition device for physical vapor deposition, comprising: a housing defining a deposition chamber, wherein the housing comprises a side surface defining a gas port to introduce a gas into the deposition chamber; a holder disposed within the deposition chamber, wherein the holder comprises a surface; and a magnetron disposed within the deposition chamber, wherein the magnetron comprises: a magnetic conductive plate defining a plurality of receptacles, wherein the magnetic conductive plate comprises magnetic conductive segments disposed within at least some receptacles of the plurality of receptacles, a base, wherein the magnetic conductive plate is disposed between the base and the surface in a first direction, and a plurality of electromagnets in direct contact with the base, wherein the plurality of electromagnets are disposed between the magnetic conductive plate and the base in the first direction and spaced apart from the magnetic conductive plate, including the magnetic conductive segments, in the first direction, wherein each electromagnet of the plurality of electromagnets comprises: a magnetic core; a coil surrounding the magnetic core, wherein the coil comprises a conductor; and an encapsulator encapsulating the magnetic core and the coil, wherein the encapsulator comprises a magnetic-isolated material. ### Claim 7 (depends on 6) The deposition device of claim 6, wherein: the magnetic conductive plate comprises side surfaces defining the plurality of receptacles. ### Claim 8 (depends on 7) The deposition device of claim 7, wherein the side surfaces of the magnetic conductive plate define a pattern of triangular receptacles of the plurality of receptacles. ### Claim 9 (depends on 7) The deposition device of claim 7, wherein a first group of the magnetic conductive segments disposed within a first set of the plurality of receptacles collectively define a polygonal shape. ### Claim 10 (depends on 6) The deposition device of claim 6, comprising a target material disposed between the magnetron and the holder and spaced apart from the magnetic conductive plate. ### Claim 11 (depends on 6) The deposition device of claim 6, wherein: the base comprises side surfaces defining a plurality of conductor receptacles, and the conductor of each of the plurality of electromagnets passes through a corresponding conductor receptacle of the plurality of conductor receptacles. ### Claim 12 (depends on 6) The deposition device of claim 6, comprising a current regulator electrically coupled to one or more electromagnets of the plurality of electromagnets. ### Claim 13 (depends on 12) The deposition device of claim 12, comprising a programmer electrically coupled to the current regulator to activate at least one electromagnet of the plurality of electromagnets, and to concurrently deactivate at least one other electromagnet of the plurality of electromagnets. ### Claim 14 (depends on 6) The deposition device of claim 6, wherein: a first electromagnet of the plurality of electromagnets has a first polarity, and a second electromagnet of the plurality of electromagnets has a second polarity, opposite the first polarity. ### Claim 15 A deposition device for physical vapor deposition, comprising: a magnetron comprising: a magnetic conductive plate defining a plurality of receptacles, wherein the magnetic conductive plate comprises magnetic conductive segments disposed within at least some receptacles of the plurality of receptacles; and a plurality of electromagnets overlying the magnetic conductive segments in a first direction and spaced apart from the magnetic conductive plate, wherein the plurality of electromagnets are in direct contact with a base of the magnetron; and a holder for supporting a substrate, wherein the magnetic conductive segments are between the plurality of electromagnets and the holder in the first direction, wherein each electromagnet of the plurality of electromagnets comprises: a magnetic core; a coil surrounding the magnetic core, wherein the coil comprises a conductor; and an encapsulator encapsulating the magnetic core and the coil, wherein the encapsulator comprises a magnetic-isolated material. ### Claim 16 (depends on 15) The deposition device of claim 15, wherein the magnetron further comprises: a magnetic conductive plate support extending between the base and the magnetic conductive plate. ### Claim 17 (depends on 16) The deposition device of claim 16, wherein the plurality of electromagnets are disposed between the magnetic conductive plate and the base in the first direction. ### Claim 18 (depends on 15) The deposition device of claim 15, wherein the magnetron further comprises a current regulator electrically coupled to one or more electromagnets of the plurality of electromagnets. ### Claim 19 (depends on 16) The deposition device of claim 16, wherein: the base comprises side surfaces defining a plurality of conductor receptacles, and the conductor of each of the plurality of electromagnets passes through a corresponding conductor receptacle of the plurality of conductor receptacles. ### Claim 20 (depends on 1) The magnetron of claim 1, wherein: the base comprises side surfaces defining a plurality of conductor receptacles, and the conductor of each of the plurality of electromagnets passes through a corresponding conductor receptacle of the plurality of conductor receptacles.