# US 12,014,909 B2 · Plasma processing apparatus and plasma processing system

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- Number: US 12,014,909 B2
- Document ID: US12014909B2
- Status: Granted
- Kind: B2
- Application number: 16/950,179
- Filed: 2020-11-17
- Published: 2021-03-11
- Granted: 2024-06-18
- Earliest claimed: 2017-08-08
- Assignees: Hitachi High-Tech Corporation
- Applicants: Hitachi High-Tech Corporation
- Inventors: Ryoji Asakura; Shota Umeda; Daisuke Shiraishi; Akira Kagoshima; Satomi Inoue
- Web page: https://patentgrep.com/patent/US12014909B2

## CPC

- H01J 37/32926: {Software, data control or modelling}
- G01J 3/443: Emission spectrometry
- H10P 72/0421: {for drying etching}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- H01J 2237/334: Etching
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The plasma processing apparatus includes a plasma processing unit that performs plasma processing of a sample and a control unit that controls the plasma processing. The control unit selects one of a plurality of the prediction models for predicting a result of the plasma processing based on a state of the plasma processing unit, and predicts the result of the plasma processing by using a selected prediction model.

## Claims

### Claim 1

A semiconductor device manufacturing system comprising:
a plasma processing unit that performs plasma processing of a sample;
a control unit connected via a network interface with the plasma processing unit and configured to control the plasma processing performed by the plasma processing unit on the sample; and
a state manager coupled to the control unit and configured to store a management value indicating a state of the plasma processing unit,
wherein the control unit is configured to
select one of a plurality of prediction models for predicting a result of the plasma processing for each of a plurality of divided data of the management value;
predict the result of the plasma processing by using the selected prediction model selected for each said divided data; and
cause the plasma processing unit to process the sample based on the selected prediction model selected for each said divided data, and
wherein the divided data is data divided based on a threshold of the management value.