# US 12,014,897 B2 · Ventilated semiconductor processing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,897 B2 - Document ID: US12014897B2 - Status: Granted - Kind: B2 - Application number: 17/373,921 - Filed: 2021-07-13 - Published: 2022-03-10 - Granted: 2024-06-18 - Earliest claimed: 2020-09-08 - Assignees: Hitachi High-Tech Corporation - Applicants: Hitachi High-Tech Corporation - Inventors: Akira Nishioka; Shuichi Nakagawa; Masaki Mizuochi; Takaaki Kikuchi; Masashi Fujita; Kenta Nomura; Naoya Ishigaki - Web page: https://patentgrep.com/patent/US12014897B2 ## CPC - H01J 37/261: {Details} - H10P 72/0471: {comprising at least one ion or electron beam chamber} - H01J 37/3497: {Temperature of target} - H05K 7/20: Modifications to facilitate cooling, ventilating, or heating - H10P 72/0452: {characterised by the layout of the process chambers} - H10P 72/33: {into and out of processing chamber} - H01J 37/32743: {for introducing the material into processing chamber} - H01J 2237/16: Vessels - H01J 2237/204: Means for introducing and/or outputting objects - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A semiconductor processing apparatus according to the present invention includes a main body cover that covers a main body device and a control device. The main body cover has a transfer opening for transferring a semiconductor, and the main body cover further has an intake port that generates an air flow in a horizontal direction inside the main body cover. ## Claims ### Claim 1 A semiconductor processing apparatus comprising: a main body device that inspects or processes a semiconductor; a control device that controls the main body device; and a transfer device that transfers the semiconductor to and from the main body device, the semiconductor processing apparatus further comprising a main body cover that covers the main body device and the control device, wherein the main body cover has a transfer opening for transferring the semiconductor to and from the transfer device, the transfer device has a fan filter unit configured to generate a downward air flow inside the transfer device, apply the downward air flow to the semiconductor, and send the downward airflow to the main body cover through the transfer opening, the main body cover further has an upper intake port that generates an air flow in a horizontal direction in an upper region inside the main body cover, and the main body cover further has an exhaust port that exhausts an air flow in the horizontal direction in the upper region. ### Claim 2 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein the main body cover further has a lower intake port that generates an air flow in the horizontal direction in a lower region inside the main body cover, and the main body cover further has an exhaust port that exhausts an air flow in the horizontal direction in the lower region. ### Claim 3 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein the main body cover has the transfer opening on a front surface side, the main body cover further has a first exhaust fan in an upper portion on a back surface side inside the main body cover, and the main body cover further has a first exhaust duct that guides air discharged by the first exhaust fan downward. ### Claim 4 (depends on 3) The semiconductor processing apparatus according to claim 3, wherein the first exhaust fan is configured by arranging a plurality of axial fans in parallel. ### Claim 5 (depends on 3) The semiconductor processing apparatus according to claim 3, wherein a metal plate having a honeycomb structure is disposed in an exhaust path of the first exhaust duct. ### Claim 6 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein a part of the control device includes an upper control device disposed in an upper portion on a back surface side inside the main body cover, a partition plate is disposed in an upper region inside the main body cover, and the partition plate is disposed between the upper control device and the main body device. ### Claim 7 (depends on 2) The semiconductor processing apparatus according to claim 2, wherein the upper intake port and the lower intake port are configured by arranging a plurality of openings. ### Claim 8 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein the main body cover further has side intake ports disposed on both side portions of the transfer opening, and each of the side intake ports is configured by arranging a plurality of openings. ### Claim 9 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein a part of the control device includes a lower control device disposed in a lower portion on a back surface side inside the main body cover, the semiconductor processing apparatus further comprising a lower control device housing that is disposed in a lower region on a back surface side inside the main body cover and houses the lower control device, wherein the lower control device is configured by stacking and arranging a plurality of control devices, and the lower control device housing has a second exhaust fan that exhausts air inside the lower control device. ### Claim 10 (depends on 3) The semiconductor processing apparatus according to claim 3, wherein a part of the control device includes a lower control device disposed in a lower portion on a back surface side inside the main body cover, the semiconductor processing apparatus further comprising a lower control device housing that is disposed in a lower region on a back surface side inside the main body cover and houses the lower control device, wherein the lower control device housing has a second exhaust fan that exhausts air inside the lower control device and a second exhaust duct that guides air exhausted by the second exhaust fan downward, and the first exhaust duct and the second exhaust duct are disposed so as to be shifted from each other in the horizontal direction so that an exhaust port of the first exhaust duct is not covered by the second exhaust duct. ### Claim 11 (depends on 1) The semiconductor processing apparatus according to claim 1, wherein a part of the control device includes a lower control device disposed in a lower portion on a back surface side inside the main body cover, the semiconductor processing apparatus further comprising a lower control device housing that is disposed in a lower region on a back surface side inside the main body cover and houses the lower control device, wherein the lower control device housing has a second exhaust fan that exhausts air inside the lower control device and a second exhaust duct that guides air exhausted by the second exhaust fan downward, and a metal plate having a honeycomb structure is disposed in an exhaust path of the second exhaust duct. ### Claim 12 (depends on 11) The semiconductor processing apparatus according to claim 11, wherein the metal plate is disposed to be inclined with respect to an extending direction of the exhaust path of the second exhaust duct. ### Claim 13 (depends on 9) The semiconductor processing apparatus according to claim 9, wherein the lower control device housing has the second exhaust fan on a back surface and a housing intake port on a front surface, and the housing intake port includes a plurality of holes. ### Claim 14 (depends on 9) The semiconductor processing apparatus according to claim 9, wherein the lower control device is a power supply unit that supplies power to the control device other than the lower control device, and the power supply unit includes a switching element. ### Claim 15 (depends on 14) The semiconductor processing apparatus according to claim 14, wherein a shape of the power supply unit has a short side and a long side, and the long side extends along an air flow discharged by the second exhaust fan, and the lower control device is configured by arranging a plurality of the power supply units in parallel in a direction orthogonal to the air flow.