# US 12,014,883 B2 · Tantalum capacitor including conductive polymer layer having a filler > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,883 B2 - Document ID: US12014883B2 - Status: Granted - Kind: B2 - Application number: 17/834,277 - Filed: 2022-06-07 - Published: 2023-05-04 - Granted: 2024-06-18 - Earliest claimed: 2021-10-28 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Yong Hyun Lee; Jin Ho Hong; Hyun Sub Oh; Youn Soo Kim; Jae Bum Cho; Hee Sung Choi - Web page: https://patentgrep.com/patent/US12014883B2 ## CPC - H01G 9/0036: {Formation of the solid electrolyte layer} - H01G 9/025: Solid electrolytes (H01G11/54 takes precedence) - H01G 9/028: Organic semiconducting electrolytes, e.g. TCNQ - H01G 9/042: characterised by the material (H01G11/22 takes precedence) - H01G 9/0425: {specially adapted for cathode} - H01G 9/048: characterised by their structure (H01G11/22 takes precedence) - H01G 9/15: Solid electrolytic capacitors (H01G11/00 takes precedence) - H01G 9/052: Sintered electrodes - H01G 2009/05: {consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A tantalum capacitor includes a sintered tantalum body including tantalum powder, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, a carbon layer disposed on the conductive polymer layer; and a tantalum body including a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction. A ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction. ## Claims ### Claim 1 A tantalum capacitor comprising: a tantalum body comprising a sintered tantalum body including tantalum particle, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, and a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction, wherein a ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction. ### Claim 2 (depends on 1) The tantalum capacitor of claim 1, wherein the ratio of the area of the first filler to the area of the conductive polymer layer is less than 0.83 in the first cross-section. ### Claim 3 (depends on 2) The tantalum capacitor of claim 2, wherein the ratio of the area of the first filler to the area of the conductive polymer layer is 0.55 or more and 0.81 or less in the first cross-section. ### Claim 4 (depends on 3) The tantalum capacitor of claim 3, wherein the first cross-section cuts a length of the sintered tantalum body in the first direction by 2:1. ### Claim 5 (depends on 4) The tantalum capacitor of claim 4, wherein the conductive polymer layer includes poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS). ### Claim 6 (depends on 5) The tantalum capacitor of claim 5, wherein the first filler includes one or more metal oxides, among BaTiO3, Al2O3, SiO2, and ZrO2. ### Claim 7 (depends on 6) The tantalum capacitor of claim 6, wherein the first filler includes SiO2. ### Claim 8 (depends on 7) The tantalum capacitor of claim 7, wherein the conductive polymer layer further comprises a second filler, and the second filler includes at least one of graphene, carbon nanotubes, and carbon black. ### Claim 9 (depends on 7) The tantalum capacitor of claim 7, wherein the tantalum body further comprises: a carbon layer disposed on the conductive polymer layer; and a silver (Ag) layer disposed on the carbon layer. ### Claim 10 (depends on 9) The tantalum capacitor of claim 9, wherein the tantalum wire further penetrates through the carbon layer and the silver (Ag) layer. ### Claim 11 (depends on 10) The tantalum capacitor of claim 10, comprising: a molding portion having fifth and sixth surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and first and second surfaces opposing each other in a third direction, and disposed to surround the tantalum body; an anode lead frame extending from the second surface of the molding portion and electrically connected to the tantalum wire; and a cathode lead frame spaced apart from the anode lead frame and extending from the second surface of the molding portion. ### Claim 12 (depends on 1) The tantalum capacitor of claim 1, further comprising a dielectric oxide layer disposed between the sintered tantalum body and the conductive polymer layer, and the conductive polymer layer is disposed directly on the dielectric oxide layer. ### Claim 13 (depends on 1) The tantalum capacitor of claim 1, wherein the first filler is a non-conductive particle and a ratio of the area of the first filler to the area of the conductive polymer layer is 0.55 or more. ### Claim 14 (depends on 1) The tantalum capacitor of claim 1, wherein the conductive polymer layer further comprises a second filler including one or more conductive particles. ### Claim 15 A tantalum capacitor comprising: a sintered tantalum body including tantalum particle; a conductive polymer layer disposed on the sintered tantalum body and comprising a first filler; a carbon layer disposed on the conductive polymer layer; and a tantalum body comprising a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction, wherein when a cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction, is a first cross-section including a plurality of first regions spaced apart from each other and each of the first region having a square shape of which a center of gravity is disposed on an extension line connecting a ⅓ point of a thickness of the conductive polymer layer, an average of ratios of an area of the first filler to an area of the conductive polymer layer in the plurality of first regions is greater than 0.38. ### Claim 16 (depends on 15) The tantalum capacitor of claim 15, wherein the average of the ratios of the area of the first filler to the area of the conductive polymer layer in the plurality of first regions is less than 0.83. ### Claim 17 (depends on 16) The tantalum capacitor of claim 16, wherein the average of the ratios of the area of the first filler to the area of the conductive polymer layer in the plurality of first regions is 0.55 or more and 0.81 or less. ### Claim 18 (depends on 17) The tantalum capacitor of claim 17, wherein an edge of each of the plurality of first regions has a length of 5 μm. ### Claim 19 (depends on 18) The tantalum capacitor of claim 18, further comprising: a silver (Ag) layer disposed on the carbon layer. ### Claim 20 A tantalum capacitor comprising: a tantalum body comprising a sintered tantalum body including tantalum particle, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, and a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction, wherein a ratio of an area of the first filler to an area of the conductive polymer layer is 0.55 or more and less than 0.83 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction. ### Claim 21 (depends on 20) The tantalum capacitor of claim 20, wherein the conductive polymer layer includes poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS). ### Claim 22 (depends on 21) The tantalum capacitor of claim 21, wherein the first filler includes one or more metal oxides, among BaTiO3, Al2O3, SiO2, and ZrO2. ### Claim 23 A tantalum capacitor comprising: a tantalum body comprising a sintered tantalum body including tantalum particle, a conductive polymer layer disposed on the sintered tantalum body and including a first filler, and a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction, wherein a ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section, perpendicular to the first direction and cutting a length of the sintered tantalum body in the first direction by 2:1.