# US 12,014,875 B2 · Miniaturization process of passive component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,875 B2 - Document ID: US12014875B2 - Status: Granted - Kind: B2 - Application number: 17/497,154 - Filed: 2021-10-08 - Published: 2023-04-13 - Granted: 2024-06-18 - Earliest claimed: 2021-10-08 - Assignees: Trusval Technology Co., Ltd. - Applicants: Trusval Technology Co., Ltd. - Inventors: Shih-Pao Chien - Web page: https://patentgrep.com/patent/US12014875B2 ## CPC - H01G 4/002: Details - H01G 4/228: Terminals - H01G 2/06: specially adapted for mounting on a printed-circuit support - H01G 4/224: Housing; Encapsulation - H01G 9/0029: {Processes of manufacture} - H01G 9/08: Housing; Encapsulation - H01G 9/14: Structural combinations {or circuits} for modifying, or compensating for, electric characteristics of electrolytic capacitors - H01G 13/003: {Apparatus or processes for encapsulating capacitors} - H01G 13/006: {Apparatus or processes for applying terminals} - H01G 2/065: {for surface mounting, e.g. chip capacitors} - H01G 9/10: Sealing, e.g. of lead-in wires - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader. ## Claims ### Claim 1 A miniaturization process of passive electronic components comprising the steps of: A. reforming: placing a capacitor element connected with electrode pins into a reforming tank, using a hydrogen peroxide solution as an oxidizing agent, and applying a current for repairing reoxidation and oxidation of the capacitor element while the electrode pins are oxidized; B. reacting at high temperature: applying high temperature to the capacitor element already reformed after the step A to continue the oxidation reaction and release gas; C1. preparing paste: preparing a composite material including flexible epoxy used as main agent and micro-scale and nanoscale thermal conductive layered materials with high insulation and gas barrier properties by in situ composition, then mixing the composite material with a curing agent at adequate curing temperature homogeneously in a vacuum chamber to form a composite paste; C. dipping in paste: pumping the composite paste prepared in the step C1 to an impregnation tank, dipping the capacitor element in the composite paste, and removing redundant composite paste with gas so that a surface of the capacitor element is covered with the composite paste homogeneously; D. light curing: moving the capacitor element into a processing tank with a vacuum pump device and a light curing device for vacuum pumping and light curing of the composite paste on the capacitor element after the step C so that the composite paste is cured; E. packaging: placing the capacitor element on at least one truss after the step D, moving the truss into a corresponding mold, and performing injection molding of plastic under high temperature and high pressure for forming a plastic packaged surface covering the capacitor element; F. heat curing: moving the capacitor element to a processing tank with a vacuum pump device and a high temperature heater for being treated by vacuum pumping and high temperature heating after the step E; G. cutting pins: taking out the capacitor element after the step F, then removing the electrode pins projecting from the plastic packaged surface by cutting; H. coating silver paste: coating silver paste on positions where the electrode pins are removed by cutting and allowing the silver paste to extend from the electrode pins on an anode and a cathode to edges of two sides of the plastic packaged surface; I. heating and drying: heating and drying the silver paste and performing laser welding on positions where the electrode pins are in contact with the silver paste; and J. engraving by laser: engraving words or symbols for recognition on the plastic packaged surface by laser to complete the miniaturization process. ### Claim 2 (depends on 1) The process as claimed in claim 1, wherein at least 10% hydrogen peroxide gas and carbon dioxide gas are dissolved in the hydrogen peroxide solution in the step A. ### Claim 3 (depends on 1) The process as claimed in claim 1, wherein a length of the oxidized electrode pins projecting from an edge of the capacitor element is over 0.2 mm in the step A. ### Claim 4 (depends on 1) The process as claimed in claim 1, wherein a length of the oxidized electrode pins projecting from an edge of the capacitor element is 0.4 mm in the step A. ### Claim 5 (depends on 1) The process as claimed in claim 1, wherein the high temperature being applied to the capacitor element is at least 150° C. in the step B. ### Claim 6 (depends on 1) The process as claimed in claim 1, wherein the high temperature being applied to the capacitor element is ranging from 180° C. to 250° C. in the step B. ### Claim 7 (depends on 1) The process as claimed in claim 1, wherein the curing temperature of the curing agent in the step C1 is at least 50° C. ### Claim 8 (depends on 1) The process as claimed in claim 1, wherein the curing temperature of the curing agent in the step C1 is 90° C. ### Claim 9 (depends on 1) The process as claimed in claim 1, wherein a viscosity of the composite paste in the step C is 3000-4500 CPS. ### Claim 10 (depends on 1) The process as claimed in claim 1, wherein the gas used in the step C is selected from the group consisting of air and inert gas. ### Claim 11 (depends on 1) The process as claimed in claim 1, wherein a thickness of the composite paste in the step D is at least 0.02 mm. ### Claim 12 (depends on 1) The process as claimed in claim 1, wherein a thickness of the composite paste in the step D is 0.08 mm. ### Claim 13 (depends on 1) The process as claimed in claim 1, wherein a plurality of trusses arranged in arrays is used in the step E. ### Claim 14 (depends on 1) The process as claimed in claim 1, wherein a multi-screw injection molding machine is used to perform the injection molding of the plastic under high temperature and high pressure in the step E. ### Claim 15 (depends on 1) The process as claimed in claim 1, wherein a temperature of the injection molding of the plastic in the step E is at least 150° C. ### Claim 16 (depends on 1) The process as claimed in claim 1, wherein a temperature of the injection molding of the plastic in the step E is 180° C. ### Claim 17 (depends on 1) The process as claimed in claim 1, wherein a pressure of the injection molding of the plastic in the step E is at least 50 kg/cm2. ### Claim 18 (depends on 1) The process as claimed in claim 1, wherein a pressure of the injection molding of the plastic in the step E is 90-105 kg/cm2. ### Claim 19 (depends on 1) The process as claimed in claim 1, wherein a thickness of the plastic packaged surface injected in the step E is at least 0.1 mm. ### Claim 20 (depends on 1) The process as claimed in claim 1, wherein a thickness of the plastic packaged surface injected in the step E is 0.4 mm. ### Claim 21 (depends on 1) The process as claimed in claim 1, wherein the plastic in the step E is highly filled micro-scale and nano-scale materials with high temperature resistance, high gas barrier property, high mechanical strength, high thermal conductivity, and high electromagnetic wave absorption. ### Claim 22 (depends on 1) The process as claimed in claim 1, wherein the plastic in the step E is resistant to a temperature of at least 250° C. ### Claim 23 (depends on 1) The process as claimed in claim 1, wherein vacuum pressure of the vacuum pumping in the step F is at least 0.1 Pa. ### Claim 24 (depends on 1) The process as claimed in claim 1, wherein vacuum pressure of the vacuum pumping in the step F is 0.1 MPa. ### Claim 25 (depends on 1) The process as claimed in claim 1, wherein a temperature of the high temperature heating in the step F is at least 150° C. ### Claim 26 (depends on 1) The process as claimed in claim 1, wherein a temperature of the high temperature heating in the step F is 180° C.-250° C. ### Claim 27 (depends on 1) The process as claimed in claim 1, wherein the high temperature heating is in a gradient heating mode and each temperature gradient of 20° C. is kept for at least 2 hours in the step F. ### Claim 28 (depends on 1) The process as claimed in claim 1, wherein the silver paste in the step H is rich in nickel and tin. ### Claim 29 (depends on 1) The process as claimed in claim 1, wherein a thickness of the silver paste in the step H is at least 0.03 mm. ### Claim 30 (depends on 1) The process as claimed in claim 1, wherein a thickness of the silver paste in the step H is 0.1 mm. ### Claim 31 (depends on 1) The process as claimed in claim 1, wherein a width of the silver paste in the step H is at least 0.1 mm. ### Claim 32 (depends on 1) The process as claimed in claim 1, wherein a width of the silver paste in the step H is 3 mm.