# US 12,014,868 B2 · Electrode structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,014,868 B2 - Document ID: US12014868B2 - Status: Granted - Kind: B2 - Application number: 17/165,933 - Filed: 2021-02-02 - Published: 2022-02-17 - Granted: 2024-06-18 - Earliest claimed: 2020-08-14 - Assignees: Cyntec Co., Ltd. - Applicants: Cyntec Co., Ltd. - Inventors: Yi-Cheng Lin - Web page: https://patentgrep.com/patent/US12014868B2 ## CPC - H01F 3/10: Composite arrangements of magnetic circuits - H01F 41/0233: {Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16)} - H01F 17/04: with magnetic core - H01F 27/255: made from particles (H01F27/26 takes precedence) - H01F 27/266: {Fastening or mounting the core on casing or support (on coil H01F27/30)} - H01F 27/306: {Fastening or mounting coils or windings on core, casing or other support} - H01F 41/0246: {Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36)} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/341: Surface mounted components - H05K 3/40: Forming printed elements for providing electric connections to or between printed circuits - H01F 1/22: pressed, sintered, or bound together - H01F 2003/106: {Magnetic circuits using combinations of different magnetic materials} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H05K 2201/09009: Substrate related - H05K 2201/10007: Types of components - Y02E 60/10: Energy storage using batteries - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component. ## Claims ### Claim 1 An electrode structure on a circuit board, said electrode structure comprising a first metal structure disposed on and electrically connected to the circuit board, wherein the first metal structure and a first surface of the circuit board forms a first space therebetween, wherein at least one first electrical component is disposed in said first space and an outer surface of the first metal structure forms a first electrode for electrically connecting with an external component, wherein said electrode structure further comprises a second metal structure disposed on and electrically connected to the circuit board, wherein the second metal structure and a second surface of the circuit board forms a second space therebetween, wherein at least one second electrical component is disposed in said second space and an outer surface of the second metal structure forms a second electrode for electrically connecting with said external component. ### Claim 2 (depends on 1) The electrode structure according to claim 1, wherein the external component is a battery and the first metal structure is electrically connected to a positive or a negative electrode of the battery. ### Claim 3 (depends on 1) The electrode structure according to claim 1, wherein the outer surface of the first metal structure comprises a first lateral surface and a bottom surface, wherein the outer surface of the first metal structure comprises a continuous metal path extending from the first lateral surface to the bottom surface, wherein the bottom surface covers the at least one first electrical component. ### Claim 4 (depends on 3) The electrode structure according to claim 3, wherein the outer surface of the first metal structure further comprises a second lateral surface opposite to the first lateral surface, wherein the continuous metal path extends from the first lateral surface to the second lateral surface via the bottom surface. ### Claim 5 (depends on 1) The electrode structure according to claim 1, wherein the metal structure comprises copper. ### Claim 6 (depends on 5) The electrode structure according to claim 5, wherein the first metal structure comprises a copper layer and a tin layer overlaid on the copper layer. ### Claim 7 (depends on 1) The electrode structure according to claim 1, wherein the first surface of the circuit board is a bottom surface of the circuit board. ### Claim 8 (depends on 1) The electrode structure according to claim 1, wherein the metal structure is soldered to the circuit board. ### Claim 9 (depends on 1) The electrode structure according to claim 1, wherein the at least one electrical component comprises at least one of the following: a resistor, a capacitor and an inductor. ### Claim 10 (depends on 1) The electrode structure according to claim 1, wherein the at least one electrical component comprises an active device and a passive device. ### Claim 11 (depends on 1) The electrode structure according to claim 1, wherein the external component is a battery, and the first metal structure and the second metal structure are electrically connected to a positive electrode and a negative electrode of the battery, respectively. ### Claim 12 (depends on 1) The electrical component according to claim 1, wherein the first metal structure forms a first surface-mounted pad. ### Claim 13 (depends on 12) The electrical component according to claim 12, wherein the second metal structure forms a second surface-mounted pad. ### Claim 14 (depends on 1) The electrical component according to claim 1, wherein lateral surfaces of the first metal structure comprises a closed metal path. ### Claim 15 (depends on 1) The electrical component according to claim 1, wherein lateral surfaces of the second metal structure comprises a closed metal path. ### Claim 16 (depends on 1) The electrical component according to claim 1, wherein a molding body encapsulates the electrical components disposed on the circuit board. ### Claim 17 (depends on 1) The electrical component according to claim 1, wherein a molding body encapsulates the electrical components on the circuit board and at least one portion of the circuit board. ### Claim 18 (depends on 1) The electrical component according to claim 1, wherein a molding body encapsulates the electrical components disposed on the circuit board, the circuit board and a portion of the first metal structure. ### Claim 19 An electrode structure on a circuit board, said electrode structure comprising a first metal structure disposed on and electrically connected to the circuit board, wherein the first metal structure and a first surface of the circuit board forms a first space therebetween, wherein at least one first electrical component is disposed in said first space and an outer surface of the first metal structure forms a first electrode for electrically connecting with an external component, wherein the first metal structure comprises a copper layer, a nickel layer overlaid on the copper layer, and an aluminum layer overlaid on the nickel layer.