Method of manufacturing electronic component and electronic component

An electronic component comprising:

• a ceramic element body including a ceramic material containing a metal oxide, the ceramic element body having an inner electrode and having an extended surface to which part of the inner electrode is extended;
• a base electrode on the extended surface of the ceramic element body and connected to the inner electrode, the base electrode being an electrode configured by a conductive paste;
• a reformed portion at another surface of the ceramic element body adjacent to the extended surface and including a reduced metal element of the metal oxide which is a product of a reduction reaction of the metal oxide that is contained in the ceramic material of the ceramic element body, wherein the reformed portion has laser irradiation marks each having a V-shaped or U-shaped cross-section when viewed in a direction parallel to the another surface, and wherein the reformed portion includes a reduction layer in which the metal element of the metal oxide of the ceramic material of the ceramic element body is reduced, and a reoxidation layer with which the reduction layer is covered;
• and
• a plating electrode on the base electrode and the reformed portion.