# US 12,014,849 B2 · Insulated wire with bonding layer of polyolefin and polyamide

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- Number: US 12,014,849 B2
- Document ID: US12014849B2
- Status: Granted
- Kind: B2
- Application number: 17/422,291
- Filed: 2019-12-26
- Published: 2022-03-17
- Granted: 2024-06-18
- Earliest claimed: 2019-01-16
- Assignees: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
- Applicants: Autonetworks Technologies, Ltd.; Sumitomo Wiring Systems, Ltd.; Sumitomo Electric Industries, Ltd.
- Inventors: Yuta Yasuyoshi; Toyoki Furukawa
- Web page: https://patentgrep.com/patent/US12014849B2

## CPC

- H01B 7/40: with arrangements for facilitating mounting or securing
- H01B 7/0275: {comprising one or more extruded layers of insulation}
- H01B 13/148: {Selection of the insulating material therefor}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

An insulated wire with bonding layer includes: a conductor; an insulating coating layer that covers an outer circumference of the conductor; and a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat, wherein the insulating coating layer contains polyvinyl chloride, and the bonding layer contains a modified polyolefin resin and a polyamide resin.

## Claims

### Claim 1

An insulated wire with bonding layer comprising:
a conductor;
an insulating coating layer that covers an outer circumference of the conductor; and
a bonding layer that is provided on an outer side of the insulating coating layer and is bonded by heat,
wherein the insulating coating layer contains polyvinyl chloride,
the bonding layer contains a modified polyolefin resin and a polyamide resin, and does not contain a polymer component apart from the modified polyolefin resin and the polyamide resin or contains only at most 30 parts by mass of the polymer component apart from the modified polyolefin resin and the polyamide resin with respect to 100 parts by mass of the total polymer components,
the modified polyolefin resin is obtained by introducing an ester group into a base polyolefin,
the polyamide resin is a nylon-based hot-melt resin, and
the nylon-based hot-melt resin has a structure of one of an amino acid, a dicarboxylic acid, and a diamine, and has a saturated aliphatic compound having 6 to 11 carbon atoms as a monomer.

### Claim 2 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the bonding layer contains at least 5 parts by mass of the polyamide resin with respect to 100 parts by mass of the polymer components.

### Claim 3 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the bonding layer is provided on the outer side of the insulating coating layer over the entire circumference in the circumference direction.

### Claim 4 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the insulated wire with bonding layer is bonded via the bonding layer to a member containing a polyolefin resin.

### Claim 5 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the bonding layer is an extrusion molded body having a thickness of 0.03 to 0.12 mm.

### Claim 6 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the content of the polyamide resin in the bonding layer is at most 70 parts by mass with respect to 100 parts by mass of the polymer components.

### Claim 7 (depends on 1)

The insulated wire with bonding layer according to claim 1,
wherein the base polyolefin of the modified polyolefin resin is a polyolefin derived from α-olefin as a monomer.

### Claim 8 (depends on 7)

The insulated wire with bonding layer according to claim 7,
wherein the base polyolefin of the modified polyolefin resin is polypropylene.