# US 12,014,840 B2 · Method for manufacturing anisotropic conductive film, and anisotropic conductive film

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- Number: US 12,014,840 B2
- Document ID: US12014840B2
- Status: Granted
- Kind: B2
- Application number: 17/315,862
- Filed: 2021-05-10
- Published: 2021-08-26
- Granted: 2024-06-18
- Earliest claimed: 2016-05-02
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Junichi Nishimura
- Web page: https://patentgrep.com/patent/US12014840B2

## CPC

- H01B 1/22: the conductive material comprising metals or alloys
- C08K 9/02: Ingredients treated with inorganic substances
- C09J 7/30: characterised by the adhesive composition
- C09J 9/02: Electrically-conducting adhesives
- H01B 5/16: comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24)
- H01B 13/34: for marking conductors or cables
- H01R 4/04: using electrically conductive adhesives
- H01R 11/01: characterised by the form or arrangement of the conductive interconnection between the connecting locations
- H01R 43/00: Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors (of trolley lines B60M1/28)
- H10W 72/073: {of die-attach connectors}
- C08K 2003/0806: {Silver}
- C08K 2003/0831: {Gold}
- C08K 2003/085: {Copper}
- C08K 2003/0862: {Nickel}
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- H10W 72/013: {of die-attach connectors}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

## Claims

### Claim 1

A connection structure comprising:
a first component, a second component, and a filler disposition film to which the first component and the second component are adhered; wherein
the filler disposition film including: an insulating binder formed in a film shape; and a plurality of fillers disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

### Claim 2 (depends on 1)

The connection structure according to claim 1, wherein the filler is a conductive particle, and the first electronic component and the second electronic component are anisotropically connected.

### Claim 3 (depends on 2)

The connection structure according to claim 2, wherein the filler disposition film is cured.

### Claim 4 (depends on 2)

The connection structure according to claim 2, wherein the conductive particle is covered by an insulator.

### Claim 5 (depends on 4)

The connection structure according to claim 4, wherein the filler disposition film is cured.

### Claim 6 (depends on 1)

The connection structure according to claim 1, wherein the filler disposition film is cured.

### Claim 7

A method for manufacturing a connection structure, the method comprising:
a disposing step of disposing a first electronic component and a second electronic component with a filler disposition film interposed the first electronic component and the second electronic component, the filler disposition film including: an insulating binder formed in a film shape, and a plurality of fillers disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter; and
a compression bonding step of compression bonding the second electronic component to the first electronic component through a compression bonding tool.

### Claim 8 (depends on 7)

The method for manufacturing a connection structure according to claim 7, wherein the filler is a conductive particle, and the first electronic component and the second electronic component are anisotropically connected.

### Claim 9 (depends on 8)

The method for manufacturing a connection structure according to claim 8, wherein the insulating binder has curability.

### Claim 10 (depends on 8)

The method for manufacturing a connection structure according to claim 8, wherein the conductive particle is covered by an insulator.

### Claim 11

A filler disposition film comprising:
an insulating binder formed in a film shape; and
a plurality of fillers disposed in a plan view on the insulating binder, wherein
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

### Claim 12 (depends on 11)

The filler disposition film according to claim 11, wherein the filler is a conductive particle.

### Claim 13 (depends on 12)

The filler disposition film according to claim 12, wherein the conductive particle is covered by an insulator.

### Claim 14 (depends on 12)

The filler disposition film according to claim 12, wherein the insulating binder has curability.

### Claim 15 (depends on 11)

The filler disposition film according to claim 11, wherein the insulating binder has curability.

### Claim 16 (depends on 11)

A method for manufacturing the filler disposition film according to claim 11, the method comprising:
a holding step of supplying fillers having a plurality of particle diameters onto a member having a plurality of opening parts, and
holding the fillers in the opening parts; and
a transfer step of transferring the fillers held in the opening parts to an adhesive film, wherein
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter, and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the adhesive film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

### Claim 17 (depends on 16)

The method for manufacturing a filler disposition film according to claim 16, wherein the adhesive film has curability.