Gas phase component analysis device and gas phase component analysis method

A gas phase component analysis device comprising:

• a heating unit including a thermal decomposition furnace, a heater provided around the thermal decomposition furnace, and a GC inlet into which a leading end of the thermal decomposition furnace is inserted, the heating unit configured to heat a solid specimen, as a specimen housed in a specimen cup input to the thermal decomposition furnace, by the heater to generate a gas phase component composite;
• a first column with one end inserted into the GC inlet and facing the leading end of the thermal decomposition furnace, wherein the gas phase component composite generated by the heating unit is introduced into the first column through the one end inserted into the GV inlet;
• a second column that is a separation column connected with the first column through a connection unit;
• an isothermal oven housing the first column, the second column, and the connection unit;
• a detection unit configured to detect a gas phase component having passed through the second column;
• a suction unit connected with the connection unit;
• an isothermal oven controller;
• and
• a suction unit controller, wherein
• the suction unit controller is configured to activate the suction unit to discharge a non-analysis target component to outside through the suction unit,
• the isothermal oven controller is configured to control a temperature of the isothermal oven so as to control a temperature of the first column to be higher than a boiling point of the non-analysis target component and lower than a boiling point of an analysis target component so that the analysis target component is selectively captured by the first column while the specimen housed in the specimen cup input to the thermal decomposition furnace is heated,
• the suction unit controller is configured to stop suction by the suction unit after a predetermined time of being activated,
• the isothermal oven controller is configured to increase a temperature of the isothermal oven to a temperature equal to or higher than the boiling point of the analysis target component when the suction unit stops suction, and
• the isothermal oven controller is configured to heat the isothermal oven to the temperature equal to or higher than the boiling point of the analysis target component when the analysis target component is introduced to the second column.