Optical sensor module and packaging method thereof
AssigneeSensortek Technology Corp.
InventorsYu-Min Lin, Feng-Jung Hsu
Life of this patent
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Abstract
An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.
Claims19
An optical sensor module, comprising:
- a substrate, including a light-sensing device and a light-emitting device;
- and
- a housing, made of a transparent material, connected to said substrate and covering said light-sensing device;
- wherein said housing includes a light-receiving region facing said light-sensing device;
- and said housing includes a shading coating layer on the inner surface of said housing facing said substrate and outside said light-receiving region;
- wherein said housing includes a light-emitting region facing said light-emitting device;
- and said shading coating layer is disposed on the said inner surface of said housing facing said substrate and outside said light-receiving region and said light-emitting region;
- wherein said housing includes a rib part protruding toward said substrate;
- said rib part is located between said light-sensing device and said light-emitting device, and said shading coating layer is disposed on a surface of said rib part facing said light-sensing device or a surface of said rib part facing light-emitting device.
Dependencies are inferred from the claim text.