Curable resin composition, composite member, and production method therefor

A curable resin composition comprising:

• a polyamide-based resin;
• a blocked polyisocyanate;
• and
• an epoxy compound,
• wherein the molar ratio of the amino groups to the carboxy groups of the polyamide-based resin is from 60/40 to 99.9/0.1,
• the polyamide-based resin includes an amino group concentration from 20 to 300 mmol/kg and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570, in which a dried sample formed of the polyamide-based resin with a thickness of 0.125 is cooled in a desiccator, then a mass of the sample is measured, the sample is immersed in water of 23° C. for 24 hours, and then removed from the water, excess moisture is wiped off, and then the mass of the sample is measured, a ratio of the mass of the sample after wiping off the excess moisture to the mass of the dried sample being defined as the water absorption,
• the quantitative proportion of the polyamide-based resin relative to the total amount of 100 mass % of the polyamide-based resin, the blocked polyisocyanate, and the epoxy compound is from 50 to 95 mass %,
• the total number of moles of isocyanate groups of the blocked polyisocyanate is from 1.3 to 50 times relative to the total number of moles of the amino groups of the polyamide-based resin,
• the molar ratio of the carboxy groups of the polyamide-based resin to the epoxy groups of the epoxy compound is from 0.01/1 to 0.5/1 in terms of the former/latter, and
• the proportion of epoxy groups of the epoxy compound is from 0.1 to 1 mol relative to 1 mol of the amino group concentration of the polyamide-based resin.