Antimicrobial phenolic fatty acid-based epoxy curing agents for epoxies

Abstract

Compositions containing at least one compound of formula I where R1 is a phenolic compound (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition. Compositions containing at least one compound produced by a method involving reacting phenolic-branched chain fatty acid methyl ester with at least one polyamine.

Dependencies are inferred from the claim text.