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US 12,011,801 B2Granted
Printing a chemical mechanical polishing pad
AssigneeApplied Materials, Inc.
InventorsRajeev Bajaj, Barry Lee Chin, Terrance Y. Lee
Life of this patent
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Abstract
A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
Claims13
A method of fabricating a polishing layer of a polishing pad, comprising:
- successively forming a plurality of layers with a droplet ejection, each respective layer of the plurality of polishing layers formed by
- depositing a liquid pad material precursor by scanning a nozzle across a support and ejecting the liquid pad material precursor from the nozzle, and
- before depositing a subsequent layer, solidifying the liquid pad material precursor by curing the liquid pad material precursor to form solidified pad material of the respective layer, wherein curing the liquid pad material precursor includes curing before an entirety of the respective layer is deposited.
An apparatus for fabricating a polishing layer of a polishing pad, comprising:
- a 3D printer including
- a support,
- a nozzle configured to scan across the support and to eject droplets of a liquid pad material precursor from a pad material precursor supply, and
- a UV light source;
- and
- a computer coupled to the 3D printer and configured to control the 3D printer to
- deposit the liquid pad material precursor by scanning the nozzle across the support and ejecting the liquid pad material precursor from the nozzle, and
- before depositing a subsequent layer, solidify the liquid pad material precursor by curing the liquid pad material precursor to form solidified pad material of the respective layer, wherein curing the liquid pad material precursor includes curing before an entirety of the respective layer is deposited.
5 more elements
Dependencies are inferred from the claim text.