# US 12,010,883 B2 · Display device having filler and seal, and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,883 B2 - Document ID: US12010883B2 - Status: Granted - Kind: B2 - Application number: 16/932,831 - Filed: 2020-07-20 - Published: 2021-03-04 - Granted: 2024-06-11 - Earliest claimed: 2019-08-30 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Seung-Soo Ryu; Sang Hyuck Yoon; Byoungyong Kim - Web page: https://patentgrep.com/patent/US12010883B2 ## CPC - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/8723: {Vertical spacers, e.g. arranged between the sealing arrangement and the OLED} - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - H10K 59/1201: {Manufacture or treatment} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS ## Abstract A display device includes: a first layer including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array; a second layer coupled with the first layer; a seal disposed between the first layer and the second layer and surrounding the pixel array; a filler, spaced apart from the seal, overlapping at least a portion of the side terminal and filling a space between the first layer and the second layer; and a conductive connection pad disposed on a side surface of the first layer and contacting the side terminal. ## Claims ### Claim 1 A display device comprising: an array substrate including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, a transfer wiring electrically connected to the side terminal and the pixel array, and an inorganic insulation layer covering the side terminal; a cover substrate coupled with the array substrate; a seal disposed between the array substrate and the cover substrate and surrounding the pixel array; a filler, spaced apart from the seal, the filler substantially consisting of an inorganic material overlapping at least a portion of the side terminal and filling a space between the array substrate and the cover substrate; and a conductive connection pad disposed on a side surface of the array substrate and contacting the side terminal, wherein the filler comprises a first filling member and a second filling member disposed between the first filling member and the seal, wherein the first filling member is separately disposed from the second filling member with a first air gap provided therebetween, wherein the first filling member and the second filling member are disposed along only a side of the array substrate where the side terminal is disposed, wherein the first filling member has an outer side surface continuously connected to an outer side surface of the inorganic insulation layer and contacting the conductive connection pad, wherein the side terminal includes an upper conductive layer and a lower conductive layer disposed under the upper conductive layer with an intervening layer between the upper conductive layer and the lower conductive layer, and wherein both of the upper conductive layer and the lower conductive layer contact the conductive connection pad. ### Claim 2 (depends on 1) The display device of claim 1, wherein the filler consists of glass second filling member is separately disposed from the seal by a second air gap that is less than a width of the first air gap that separates the second filling member and the first filling member. ### Claim 3 (depends on 1) The display device of claim 1, wherein the filler comprises substantially the same material as the seal. ### Claim 4 (depends on 1) The display device of claim 1, wherein the filler comprises a filling member having a first width, and the seal comprises a sealing member having a second width larger than the first width. ### Claim 5 (depends on 4) The display device of claim 4, wherein the first width is from about 100 μm to about 300 μm, and the second width is from about 300 μm to about 1,000 μm. ### Claim 6 (depends on 1) The display device of claim 1, wherein the seal comprises a different material from that of the filler. ### Claim 7 (depends on 1) The display device of claim 1, wherein the side terminal comprises a plurality of conductive layers. ### Claim 8 (depends on 1) The display device of claim 1, wherein the transfer wiring is spaced apart from the conductive connection pad. ### Claim 9 (depends on 1) The display device of claim 1, further comprising a driving device bonded to the conductive connection pad, the driving device configured to generate a driving signal or a power to the transfer wiring through the conductive connection pad and the side terminal. ### Claim 10 (depends on 9) The display device of claim 9, wherein the driving device comprises a flexible printed circuit board on which a driving chip is mounted. ### Claim 11 A method of manufacturing a display device, the method comprising the steps of: preparing an array substrate including a pixel array disposed on a base substrate, a transfer wiring electrically connected to the pixel array, a conductive pattern electrically connected to the transfer wiring, and an inorganic insulation layer covering the conductive pattern; forming a seal and a filler, the seal disposed between the array substrate and a cover substrate, the filler, being spaced apart from the seal, the filer substantially consisting of an inorganic material overlapping at least a portion of the conductive pattern, and filling a space between the array substrate and the cover substrate; removing a portion of the array substrate to dispose a side terminal from the conductive pattern and/or, the side terminal being exposed through a side surface of the array substrate; and forming a conductive connection pad on the side surface of the array substrate, the conductive connection pad contacting the side terminal, wherein the filler comprises a first filler and a second filler spaced apart from the seal and the first filler with an air gap provided between the first filler and the second filler, wherein the first filling member and the second filling member are disposed along only a side of the array substrate where the side terminal is disposed, wherein the second filler fills a second space between the array substrate and the cover substrate, wherein the first filler has an outer side surface continuously connected to an outer side surface of the inorganic insulation layer and contacting the conductive connection pad, wherein the conductive pattern includes an upper conductive layer and a lower conductive layer disposed under the upper conductive layer with an intervening layer between the upper conductive layer and the lower conductive layer, and wherein both of the upper conductive layer and the lower conductive layer contact the conductive connection pad. ### Claim 12 (depends on 11) The method of claim 11, wherein the step of forming the seal and the filler comprises: forming a sealing frit and a filling frit on a surface of the array substrate or the cover substrate; disposing the array substrate to contact the cover substrate; and sintering the sealing frit and the filling frit. ### Claim 13 (depends on 12) The method of claim 12, wherein the sealing frit and the filling frit comprise glass frit. ### Claim 14 (depends on 11) The method of claim 11, wherein the filler comprises a filling member, and the seal comprises a sealing member, and the step of removing the portion of the array substrate comprises: scribing the cover substrate, the array substrate and the first filling member; and grinding or polishing an exposed side surface of the cover substrate, the array substrate and the filling member. ### Claim 15 (depends on 11) The method of claim 11, wherein the step of forming the conductive connection pad comprises: forming a metal layer contacting a side surface of the side terminal; and patterning the metal layer.