# US 12,010,816 B2 · Nucleation control system and method leading to enhanced boiling based electronic cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,816 B2 - Document ID: US12010816B2 - Status: Granted - Kind: B2 - Application number: 17/291,728 - Filed: 2019-11-12 - Published: 2022-01-13 - Granted: 2024-06-11 - Earliest claimed: 2018-11-12 - Assignees: Michigan Technological University - Applicants: Michigan Technological University - Inventors: Amitabh Narain; Soroush Sepahyar; Divya Kamlesh Pandya; Vibhu Vivek - Web page: https://patentgrep.com/patent/US12010816B2 ## CPC - H05K 7/20327: {Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds} - H10W 40/47: by flowing liquids, e.g. forced water cooling - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - F28D 15/046: {characterised by the material or the construction of the capillary structure} - F28F 13/10: by imparting a pulsating motion to the flow, e.g. by sonic vibration - H05K 7/20309: {Evaporators} - H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)} - H10W 40/73: for cooling by change of state - F28F 2260/02: having microchannels - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract A cooling module for an electronic device includes a body having formed therein a plurality of channels, a micro-structured boiling surface, a piezoelectric transducer, an inlet header, and an outlet header. Each channel of the plurality of channels is defined by a first channel surface and opposing lateral channel surfaces cooperatively defining a rectangular cross section normal to a channel axis. The micro-structured boiling surface is positioned adjacent the first channel surface of each channel. The piezoelectric transducer is in acoustic communication with one of the opposing lateral channel surfaces of each channel and configured to direct acoustic waves on the micro-structured boiling surface. The inlet header is in fluid communication with each channel of the plurality of channels. The outlet header is in fluid communication with each channel of the plurality of channels. ## Claims ### Claim 1 A cooling module for an electronic device, the cooling module comprising: a body having formed therein a plurality of channels, each channel of the plurality of channels defined by a first channel surface positioned between opposing lateral channel surfaces to define a rectangular cross section normal to a channel axis; a micro-structured boiling surface positioned adjacent the first channel surface of each channel; a first piezoelectric transducer in acoustic communication with one of the opposing lateral channel surfaces of each channel and a second piezoelectric transducer in acoustic communication with the other opposing lateral channel surface, each transducer configured to direct acoustic waves on the micro-structured boiling surface; an inlet header in fluid communication with each channel of the plurality of channels; and an outlet header in fluid communication with each channel of the plurality of channels, wherein the first and second piezoelectric transducers are transverse mode piezoelectric transducers having a resonant frequency (fp), and further including a controller configured to provide a range of acoustic modulating frequencies (fM) to the transducers resulting from signals of modulating strengths available at fp and fp±n·fM where “n≥1” is an integer. ### Claim 2 (depends on 1) The cooling module of claim 1, wherein a distance between the opposing lateral channel surfaces of each channel is greater than 6 mm. ### Claim 3 (depends on 1) The cooling module of claim 1, wherein the micro-structured boiling surface is a micro-structured mesh. ### Claim 4 (depends on 3) The cooling module of claim 3, wherein the micro-structured mesh is formed from copper. ### Claim 5 (depends on 1) The cooling module of claim 1, wherein the first and second piezoelectric transducers are configured, when a cooling fluid is flowing within the channel, to introduce acoustic waves sufficient to induce resonance of the micro-structured boiling surface. ### Claim 6 (depends on 1) The cooling module of claim 1, wherein the outlet header includes a primary outlet port and a secondary outlet port, the secondary outlet port configured to receive a liquid-vapor mixture of the cooling fluid. ### Claim 7 (depends on 1) The cooling module of claim 1, wherein the cooling module is mountable on a microchip for thermal communication therewith. ### Claim 8 (depends on 1) The cooling module of claim 1, wherein each channel has a length along the channel axis no greater than 6 cm. ### Claim 9 A method of cooling an electronic device, the method comprising: passing a heat transfer fluid through one or more channels formed in a cooling module body, each channel defined by a first channel surface and lateral channel surfaces and further including a micro-structured boiling surface adjacent the first channel surface; and energizing a piezoelectric transducer in acoustic communication with one of the lateral channel surfaces of each channel to direct in plane acoustic waves on the micro-structured boiling surface and its vicinity to facilitate formation of microbubbles within the heat transfer fluid at microbubble nucleation sites on the micro-structured boiling surface, wherein energizing the piezoelectric transducer in acoustic communication with one of the lateral channel surfaces of each channel to direct in plane acoustic waves on the micro-structured boiling surface means energizing the piezoelectric transducer to its natural 1 MHz frequency (fp) and thereafter imposing and tuning modulating frequencies (fM) associated with an on-off mechanism of the controller resulting in acoustic energy in a modulating frequency range of 1-2000 Hz. ### Claim 10 (depends on 9) The method of claim 9, wherein passing the heat transfer fluid through one or more channels means passing a subcooled heat transfer fluid through the one or more channels. ### Claim 11 (depends on 10) The method of claim 10, wherein the subcooled heat transfer fluid is within 3° C. of its saturation temperature.