# US 12,010,814 B2 · Liquid immersion cooling sheet with improved surface structure

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- Number: US 12,010,814 B2
- Document ID: US12010814B2
- Status: Granted
- Kind: B2
- Application number: 17/725,208
- Filed: 2022-04-20
- Published: 2023-10-26
- Granted: 2024-06-11
- Earliest claimed: 2022-04-20
- Assignees: Taiwan Microloops Corp.
- Applicants: Taiwan Microloops Corp.
- Inventors: Chun-Teng Chiu
- Web page: https://patentgrep.com/patent/US12010814B2

## CPC

- H05K 7/20236: {by immersion}
- H05K 7/20254: {Cold plates transferring heat from heat source to coolant}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

## Claims

### Claim 1

A liquid immersion cooling sheet, comprising: a metal case, comprising a heated surface and a cooling surface disposed on a back of the heated surface; and a porous structure, disposed on the cooling surface, comprising multiple gaps, and a width of each gap being between about 0.05 mm and about 0.1 mm, wherein the porous structure comprises multiple pins, and each of the multiple gap is disposed between any adjacent two of the multiple pins, wherein a width or a diameter of each pin is less than or equal to 0.2 mm.

### Claim 2 (depends on 1)

The liquid immersion cooling sheet of claim 1, wherein each of the multiple pin is integratedly formed with the metal case and extended from the cooling surface.

### Claim 3 (depends on 1)

The liquid immersion cooling sheet of claim 1, further comprising a heat conduction plate sandwiched between the cooling surface of the metal case and the porous structure.