# US 12,010,800 B2 · Systems for surface mounting electronic components on a printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,800 B2 - Document ID: US12010800B2 - Status: Granted - Kind: B2 - Application number: 17/305,108 - Filed: 2021-06-30 - Published: 2022-03-03 - Granted: 2024-06-11 - Earliest claimed: 2020-08-31 - Assignees: IO Tech Group Ltd. - Applicants: IO Tech Group Ltd. - Inventors: Michael Zenou; Ziv Gilan; Guy Nesher - Web page: https://patentgrep.com/patent/US12010800B2 ## CPC - H05K 13/0409: {Sucking devices} - B65G 47/91: incorporating pneumatic, e.g. suction, grippers - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H05K 13/0812: {the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement} - H10H 29/02: using pick-and-place processes - H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates} - Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate. ## Claims ### Claim 1 A system for surface mounting electronic components on a printed circuit board, the system comprising: a vacuum cell configured for picking the electronic components; and an inkjet print head configured to cause a first one of the electronic components to detach from the vacuum cell by emitting one or more droplets of a solvent towards a surface of the vacuum cell at which the first electronic component is held to break a holding vacuum of the vacuum cell exerted on the first electronic component at a desired release point. ### Claim 2 (depends on 1) The system of claim 1, wherein the vacuum cell is closed by a porous substrate or a micro hole array plate on at least one side or part thereof. ### Claim 3 (depends on 1) The system of claim 1, further comprising a controller configured to control a temperature and humidity of the vacuum cell. ### Claim 4 (depends on 1) The system of claim 1, wherein the inkjet print head is translatable inside the vacuum cell by a piezo element. ### Claim 5 (depends on 1) The system of claim 1, wherein the electronic components include one or more of a resistor, a light emitting diode (LED) or an integrated circuit (IC). ### Claim 6 (depends on 1) The system of claim 1, further comprising an inspection station configured to inspect the electronic components as held by the vacuum cell before placement of the electronic components on a receiving substrate or after placement of the electronic components on the receiving substrate. ### Claim 7 (depends on 1) The system of claim 1, wherein the solvent is selected according to a vacuum level and temperature and is one of: water, ethanol, glycol or an organic solvent. ### Claim 8 (depends on 1) The system of claim 1, wherein the inkjet print head is configured to cause the electronic components to detach from the vacuum cell and includes multiple nozzles to pick and place multiple ones of the electronic components at the same time. ### Claim 9 (depends on 1) The system of claim 1, wherein the vacuum cell includes a substrate structured so as to reduce solvent penetration, to reduce electrostatic forces on one of the electronic components when attached thereto, and to align the one of the electronic components to a target area in X, Y, and Z directions. ### Claim 10 A system for surface mounting electronic components on a printed circuit board, the system comprising: a vacuum cell configured for picking the electronic components; and a laser-based element configured to cause a first one of the electronic components to detach from the vacuum cell by heating a solvent at a detachment point inside the vacuum cell, wherein a vapor pressure of the solvent and a pressure inside the vacuum cell are selected with respect to one another so that the solvent vaporizes upon the heating of the solvent. ### Claim 11 (depends on 10) The system of claim 10, wherein the vacuum cell is closed by a porous substrate or a micro hole array plate on at least one side or part thereof. ### Claim 12 (depends on 10) The system of claim 10, further comprising a controller configured to control a temperature and humidity of the vacuum cell. ### Claim 13 (depends on 10) The system of claim 10, wherein the electronic components include one or more of a resistor, a light emitting diode (LED) or an integrated circuit (IC). ### Claim 14 (depends on 10) The system of claim 10, further comprising an inspection station configured to inspect the electronic components as held by the vacuum cell before placement of the electronic components on a receiving substrate or after placement of the electronic components on the receiving substrate. ### Claim 15 (depends on 10) The system of claim 10, wherein the solvent is selected according to a vacuum level and temperature and is one of: water, ethanol, glycol or an organic solvent. ### Claim 16 (depends on 10) The system of claim 10, wherein the vacuum cell includes a substrate structured so as to reduce solvent penetration, to reduce electrostatic forces on one of the electronic components when attached thereto, and to align the one of the electronic components to a target area in X, Y, and Z directions.