# US 12,010,793 B2 · Ceramic circuit board, ceramic green sheet for ceramic circuit board, and glass ceramic powder for ceramic circuit board

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- Number: US 12,010,793 B2
- Document ID: US12010793B2
- Status: Granted
- Kind: B2
- Application number: 17/632,590
- Filed: 2020-07-30
- Published: 2022-09-01
- Granted: 2024-06-11
- Earliest claimed: 2019-08-06
- Assignees: Nippon Electric Glass Co., Ltd.
- Applicants: Nippon Electric Glass Co., Ltd.
- Inventors: Hiroaki Hara; Shuji Nakazawa
- Web page: https://patentgrep.com/patent/US12010793B2

## CPC

- C03C 3/089: containing boron
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- C03C 12/00: Powdered glass (C03C8/02 takes precedence); Bead compositions
- C03C 14/004: {the non-glass component being in the form of particles or flakes}
- C04B 35/117: Composites
- C04B 35/16: based on silicates other than clay {(zircon C04B35/48)}
- H05K 3/4629: {laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets}
- C03C 2214/04: Particles; Flakes
- C04B 2235/3217: Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
- C04B 2235/3284: Zinc oxides, zincates, cadmium oxides, cadmiates, mercury oxides, mercurates or oxide forming salts thereof
- C04B 2235/3427: Silicates other than clay, e.g. water glass
- C04B 2235/365: Borosilicate glass
- C04B 2235/5436: micrometer sized, i.e. from 1 to 100 micron
- C04B 2235/6025: Tape casting, e.g. with a doctor blade
- C04B 2235/612: Machining
- C04B 2235/96: Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B 2235/9607: Thermal properties, e.g. thermal expansion coefficient
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE

## Abstract

A ceramic circuit board includes: a ceramic board; and an internal conductor disposed in the ceramic board, in which the ceramic board contains glass, a willemite filler, and an alumina filler, and an average particle diameter of the willemite filler is larger than an average particle diameter of the alumina filler.

## Claims

### Claim 1

A ceramic circuit board comprising:
a ceramic board; and
an internal conductor disposed in the ceramic board,
wherein the ceramic board contains glass, a willemite filler, and an alumina filler,
an average particle diameter of the willemite filler is larger than an average particle diameter of the alumina filler, and
a thermal expansion coefficient of the ceramic board is 4 ppm/° C. or less in a temperature range of −40° C. to +125° C.

### Claim 2 (depends on 1)

The ceramic circuit board according to claim 1, wherein the ceramic board contains, in terms of mass %, 30% to 65% of the glass, 14% to 56% of the willemite filler, and 7% to 42% of the alumina filler.

### Claim 3 (depends on 1)

The ceramic circuit board according to claim 1, wherein the glass is borosilicate glass.

### Claim 4 (depends on 3)

The ceramic circuit board according to claim 3, wherein the borosilicate glass contains, as a glass composition, in terms of mass %, 60% to 80% of SiO2, 10% to 30% of B2O3, 1% to 5% of Li2O+Na2O+K2O, and 0% to 20% of MgO+CaO+SrO+BaO.

### Claim 5

A ceramic green sheet for a ceramic circuit board comprising: in terms of mass %,
30% to 65% of a glass powder;
14% to 34% of a willemite filler; and
7% to 42% of an alumina filler,
wherein an average particle diameter of the willemite filler is larger than an average particle diameter of the alumina filler.

### Claim 6

A glass ceramic powder for a ceramic circuit board comprising: in terms of mass %,
30% to 65% of a glass powder;
14% to 34% of a willemite filler; and
7% to 42% of an alumina filler,
wherein an average particle diameter of the willemite filler is larger than an average particle diameter of the alumina filler.

### Claim 7 (depends on 2)

The ceramic circuit board according to claim 2, wherein the glass is borosilicate glass.

### Claim 8 (depends on 7)

The ceramic circuit board according to claim 7, wherein the borosilicate glass contains, as a glass composition, in terms of mass %, 60% to 80% of SiO2, 10% to 30% of B2O3, 1% to 5% of Li2O+Na2O+K2O, and 0% to 20% of MgO+CaO+SrO+BaO.