# US 12,010,791 B2 · Device, electronic apparatus, and wiring connection method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,791 B2 - Document ID: US12010791B2 - Status: Granted - Kind: B2 - Application number: 17/754,625 - Filed: 2020-10-13 - Published: 2022-12-08 - Granted: 2024-06-11 - Earliest claimed: 2019-10-15 - Assignees: Sony Group Corporation - Applicants: Sony Group Corporation - Inventors: Hiroshi Kawai; Taizo Nishimura; Masahiko Shimizu; Takayuki Tanaka; Naohiro Takahashi - Web page: https://patentgrep.com/patent/US12010791B2 ## CPC - H05K 1/0277: {Bendability or stretchability details (H05K1/038, H05K3/4691 take precedence)} - H05K 3/361: {Assembling flexible printed circuits with other printed circuits} - H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} - H01R 11/01: characterised by the form or arrangement of the conductive interconnection between the connecting locations - H05K 3/20: by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} - H05K 1/0283: {Stretchable printed circuits} - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - H05K 2201/10151: Sensor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion. ## Claims ### Claim 1 A device, comprising: a base having elasticity; a device body on the base; a wiring line on the base; a coupling member coupled to the wiring line; and an electrically conductive adhesive layer between the wiring line and the coupling member, wherein the wiring line extends from the electrically conductive adhesive layer to the device body, the wiring line has a wiring portion that overlaps with the electrically conductive adhesive layer, the electrically conductive adhesive layer includes: a plurality of electrically conductive particles; a first peripheral portion; a first region that includes the plurality of electrically conductive particles in a crushed state; and a second region closer to the first peripheral portion of the electrically conductive adhesive layer than the first region, the second region includes the plurality of electrically conductive particles in an uncrushed state, each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion. ### Claim 2 (depends on 1) The device according to claim 1, wherein the first region and the second region are provided in an order of the first region and the second region in the extending direction of the wiring portion. ### Claim 3 (depends on 1) The device according to claim 1, wherein the electrically conductive adhesive layer includes an adhesive, and the adhesive has elasticity. ### Claim 4 (depends on 1) The device according to claim 1, wherein the device body has elasticity. ### Claim 5 (depends on 1) The device according to claim 1, wherein the electrically conductive adhesive layer comprises one of an anisotropic conductive film or an anisotropic conductive adhesive. ### Claim 6 (depends on 1) The device according to claim 1, wherein the coupling member comprises a flexible printed circuit. ### Claim 7 (depends on 1) The device according to claim 1, wherein the device body comprises a sensor body. ### Claim 8 An electronic apparatus, comprising a device that includes: a base having elasticity; a device body on the base; a wiring line on the base; a coupling member coupled to the wiring line; and an electrically conductive adhesive layer between the wiring line and the coupling member, wherein the wiring line extends from the electrically conductive adhesive layer to the device body, the wiring line has a wiring portion overlapping with the electrically conductive adhesive layer, the electrically conductive adhesive layer includes: a plurality of electrically conductive particles; a peripheral portion; a first region that includes the plurality of electrically conductive particles in a crushed state; and a second region closer to the peripheral portion of the electrically conductive adhesive layer than the first region, the second region includes the plurality of electrically conductive particles in an uncrushed state, each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion. ### Claim 9 A wiring coupling method, comprising: overlaying a coupling member on a wiring line via an electrically conductive adhesive layer, wherein the wiring line is on an elastic base, the wiring line has a wiring portion that overlaps with the electrically conductive adhesive layer, the electrically conductive adhesive layer includes: a plurality of electrically conductive particles; a peripheral portion; a first region that includes the plurality of electrically conductive particles in a crushed state; and a second region closer to the peripheral portion than the first region, the second region includes the plurality of electrically conductive particles in an uncrushed state, each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion; and pressing and heating a portion of the first region and the second region inward from the peripheral portion of the electrically conductive adhesive layer. ### Claim 10 (depends on 1) The device according to claim 1, wherein the first region of the electrically conductive adhesive layer has a thickness similar to a thickness of the second region of the electrically conductive adhesive layer. ### Claim 11 (depends on 1) The device according to claim 1, wherein the electrically conductive adhesive layer further includes: a second peripheral portion opposite to the first peripheral portion; and a third region adjacent to the second peripheral portion, and the first region is between the third region and the second region. ### Claim 12 (depends on 11) The device according to claim 11, wherein the degree of polymerization of the electrically conductive adhesive layer decreases from the first region to the third region opposite to the extending direction of the wiring portion.