# US 12,010,790 B2 · High-frequency circuit including a circuit board and a waveguide structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,790 B2 - Document ID: US12010790B2 - Status: Granted - Kind: B2 - Application number: 17/504,401 - Filed: 2021-10-18 - Published: 2022-05-05 - Granted: 2024-06-11 - Earliest claimed: 2020-10-29 - Assignees: Robert Bosch GmbH - Applicants: Robert Bosch GmbH - Inventors: Christian Hollaender; Klaus Baur; Gustav Klett; Klaus Voigtlaender; Michael Schoor; Ronny Ludwig - Web page: https://patentgrep.com/patent/US12010790B2 ## CPC - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - G01S 7/03: Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver - H01Q 1/526: {Electromagnetic shields} - H01Q 13/06: Waveguide mouths (horns H01Q13/02) - H01Q 21/064: {using horn or slot aerials (slotted waveguides arrays H01Q21/005)} - H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them - G01S 7/027: {Constructional details of housings, e.g. form, type, material or ruggedness} - G01S 13/931: of land vehicles - H01Q 1/3233: {particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems} - H05K 1/0251: {related to vias or transitions between vias and transmission lines} - H05K 3/308: {Adaptations of leads (connectors to printed circuits H01R12/00)} - H05K 2201/09985: Hollow waveguide combined with printed circuit - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/1059: Connections made by press-fit insertion - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board. ## Claims ### Claim 1 A high-frequency circuit comprising: a circuit board which bears at least one electronic component and a conductor structure; and a waveguide structure manufactured separately from the circuit board, which is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure, wherein the waveguide structure is held on the circuit board using press-fit pins formed in one piece with a metal plate which bears the waveguide structure. ### Claim 2 (depends on 1) The high-frequency circuit as recited in claim 1, wherein the metal plate and the press-fit pins are formed from a sheet-metal plate, the press-fit pins being formed from bent strips of the sheet-metal plate. ### Claim 3 (depends on 2) The high-frequency circuit as recited in claim 2, wherein at least some of the press-fit pins are located in slots of the metal plate. ### Claim 4 (depends on 1) The high-frequency circuit as recited in claim 1, wherein channels of the waveguide structure are each delimited at least on two sides opposite to one another by metallized walls of a plastic body and the metal plate delimits the channels on one of the remaining sides. ### Claim 5 (depends on 4) The high-frequency circuit as recited in claim 4, wherein one or multiple plastic bodies which delimit the channels of the waveguide structure are situated in a sandwich-like manner between the metal plate and a further sheet-metal plate. ### Claim 6 (depends on 5) The high-frequency circuit as recited in claim 5, wherein the waveguide structure is a waveguide antenna, including emission openings in the sheet-metal plate and/or the further sheet-metal plate. ### Claim 7 (depends on 1) The high-frequency circuit as recited in claim 1, wherein the metal plate is part of an electromagnetic shield for the electronic component. ### Claim 8 (depends on 1) The high-frequency circuit as recited in claim 1, wherein the metal plate is in thermal contact with the electronic component via a heat conduction element. ### Claim 9 (depends on 1) The high-frequency circuit as recited in claim 1, wherein the metal plate is located on a side of the waveguide structure opposite to the circuit board. ### Claim 10 (depends on 9) The high-frequency circuit as recited in claim 9, wherein a metallization layer is applied to a surface of the circuit board, which extends over an entire outline of the electronic component and/or delimits wave guiding channels of the waveguide structure on one side. ### Claim 11 (depends on 1) The high-frequency circuit as recited in claim 1, wherein: at least one of the at least one electronic component and the conductor are borne over a plane of the circuit board; the waveguide structure forms a coupling dome in which a coupling channel extends at a right angle to the plane of the circuit board; and a launcher extends upward from the conductor structure over the circuit board into the coupling channel. ### Claim 12 (depends on 11) The high-frequency circuit as recited in claim 11, wherein the launcher is enclosed by an annular, electrically conductive area, which extends upwards from an upper surface of the circuit board towards the waveguide structure and rests against a bottom end face of the coupling dome. ### Claim 13 (depends on 12) The high-frequency circuit as recited in claim 12, wherein the conductive area is formed by a conductive adhesive. ### Claim 14 A high-frequency circuit comprising: a circuit board which bears, over a plane of the circuit board, at least one electronic component and a conductor structure; and a waveguide structure manufactured separately from the circuit board, which is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure; wherein: the waveguide structure forms a coupling dome in which a coupling channel extends at a right angle to the plane of the circuit board; the conductor structure forms a launcher on the circuit board for the coupling channel; the launcher is positioned inside an outline of the coupling channel; and the circuit board is pre-tensioned locally against the coupling dome by a spring at a point of each coupling dome. ### Claim 15 A high-frequency circuit comprising: a circuit board on a plane of which at least one electronic component is arranged; and a waveguide structure manufactured separately from the circuit board, which is positioned on, and facing the plane of, the circuit board in such a way that high-frequency signals are transferable between the electronic component and the waveguide structure; wherein: the waveguide structure is held on the circuit board using press-fit pins formed in one piece with a metal plate which bears the waveguide structure; and launchers for coupling in the high-frequency signal into the waveguide structure are integrated into the electronic component with respective channels extending from the electronic component in a direction perpendicular to the plane of the circuit board towards the waveguide structure for transfer of signals of the electronic component from the launchers into the waveguide structure through the channels.