# US 12,010,416 B1 · Camera module including embedded ceramic substrate package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,010,416 B1 - Document ID: US12010416B1 - Status: Granted - Kind: B1 - Application number: 17/024,024 - Filed: 2020-09-17 - Granted: 2024-06-11 - Earliest claimed: 2019-09-27 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Wei Shi; Adar Magen - Web page: https://patentgrep.com/patent/US12010416B1 ## CPC - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/60: Control of cameras or camera modules - H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12} - H10F 39/804: {Containers or encapsulations} - H10F 39/8063: {Microlenses} - H10F 39/811: {Interconnections} - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor. ## Claims ### Claim 1 A camera module, comprising: an image sensor configured to capture light projected onto a surface of the image sensor; and an embedded ceramic substrate package directly attached to the image sensor, the embedded ceramic substrate package comprising: a bulk molding compound (BMC); a ceramic substrate embedded in the BMC; and one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC; wherein at least one of the BMC or one of the RDLs is directly attached to the image sensor, and wherein at least one of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor. ### Claim 2 (depends on 1) The camera module as recited in claim 1, wherein: the ceramic substrate of the embedded ceramic substrate package overlies a flexible printed circuit (FPC); and the ceramic substrate overlying the FPC is overmolded with the BMC. ### Claim 3 (depends on 2) The camera module as recited in claim 2, wherein at least a portion of the electrical signal trace routing is disposed within the BMC. ### Claim 4 (depends on 3) The camera module as recited in claim 3, wherein the image sensor is electrically connected to the electrical signal trace routing disposed within the BMC. ### Claim 5 (depends on 1) The camera module as recited in claim 1, wherein: at least a portion of the RDL includes the electrical signal trace routing; the ceramic substrate of the embedded ceramic substrate package overlies the RDL; and the ceramic substrate overlying the RDL is overmolded with the BMC. ### Claim 6 (depends on 5) The camera module as recited in claim 5, wherein the image sensor is electrically connected to the electrical signal trace routing of the RDL. ### Claim 7 (depends on 1) The camera module of claim 1, wherein the ceramic substrate of the embedded substrate package includes electrical circuitry on both a first surface of the ceramic substrate and a second surface of the ceramic substrate opposite the first surface. ### Claim 8 (depends on 7) The camera module as recited in claim 7, wherein the electrical circuitry consists of passive electrical circuitry. ### Claim 9 (depends on 1) The camera module of claim 1, wherein the ceramic substrate is a single-layer substrate. ### Claim 10 (depends on 1) The camera module of claim 1, wherein the ceramic substrate is a multiple-layer substrate. ### Claim 11 (depends on 1) The camera module as recited in claim 1, wherein the ceramic substrate is an alumina-based ceramic substrate. ### Claim 12 (depends on 1) The camera module as recited in claim 1, wherein at least a portion of the BMC lies above or below the image sensor in a vertical direction. ### Claim 13 An embedded ceramic substrate package, comprising: a bulk molding compound (BMC); a ceramic substrate embedded in the BMC; and one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC; wherein at least one of the BMC or one of the RDLs is directly attached to an image sensor that is configured to capture light projected onto a surface of the image sensor; and wherein at least a portion of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor. ### Claim 14 (depends on 13) The embedded ceramic substrate package as recited in claim 13, wherein: the ceramic substrate overlies a flexible printed circuit (FPC); and the ceramic substrate overlying the FPC is overmolded with the BMC. ### Claim 15 (depends on 14) The embedded ceramic substrate package as recited in claim 14, wherein at least a portion of the electrical signal trace routing is disposed within the BMC. ### Claim 16 (depends on 15) The embedded ceramic substrate package as recited in claim 15, wherein the image sensor is electrically connected to the electrical signal trace routing disposed within the BMC. ### Claim 17 (depends on 13) The embedded ceramic substrate package as recited in claim 13, wherein: at least a portion of the RDL includes the electrical signal trace routing; the image sensor is electrically connected to the electrical signal trace routing of the RDL; the ceramic substrate overlies the RDL; and the ceramic substrate overlying the RDL is overmolded with the BMC. ### Claim 18 (depends on 13) The embedded ceramic substrate package as recited in claim 13, wherein the ceramic substrate includes electrical circuitry on both a first surface of the ceramic substrate and a second surface of the ceramic substrate opposite the first surface. ### Claim 19 (depends on 13) The embedded ceramic substrate package as recited in claim 13, wherein the ceramic substrate is a single-layer substrate. ### Claim 20 A mobile device, comprising: one or more processors; one or more cameras; and a memory comprising program instructions executable by at least one of the one or more processors to control operations of the one or more cameras; wherein at least one of the cameras includes a camera module comprising: an image sensor configured to capture light projected onto a surface of the image sensor; and an embedded ceramic substrate package directly attached to the image sensor, the embedded ceramic substrate package comprising: a bulk molding compound (BMC); a ceramic substrate embedded in the BMC; and one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC; wherein at least one of the BMC or one of the RDLs is directly attached to the image sensor, and wherein at least a portion of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor.