# US 12,009,792 B2 · Power amplifier with decreased RF return current losses

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- Number: US 12,009,792 B2
- Document ID: US12009792B2
- Status: Granted
- Kind: B2
- Application number: 17/272,814
- Filed: 2019-09-03
- Published: 2021-08-19
- Granted: 2024-06-11
- Earliest claimed: 2018-09-03
- Assignees: Ampleon Netherlands B.V.
- Applicants: Ampleon Netherlands B.V.
- Inventors: Vittorio Cuoco; Jos Van Der Zanden; Yi Zhu; Iouri Volokhine
- Web page: https://patentgrep.com/patent/US12009792B2

## CPC

- H03F 3/245: {with semiconductor devices only}
- H03F 3/195: in integrated circuits
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H03F 2200/222: A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier
- H03F 2200/387: A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier
- H03F 2200/451: the amplifier being a radio frequency amplifier
- H10W 44/206: {Wires}
- H10W 44/231: {Arrangements for applying bias}
- H10W 44/234: {Arrangements for impedance matching}
- H10W 44/251: {for monolithic microwave integrated circuits [MMIC]}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H03F: AMPLIFIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Example embodiments relate to power amplifiers with decreased RF return current losses. One embodiment includes a RF power amplifier package that includes a semiconductor die, an input lead, first bondwire connections, second bondwire connections, and a plurality of shields. The semiconductor die includes an RF power transistor that includes output bond pads, input bond pads, a plurality of input fingers, and a plurality of output fingers. Further, each shield of the plurality of shields is arranged in between a respective input finger of the plurality of input fingers and a respective output finger of the plurality of output fingers and extending along with said respective input finger and output finger. In addition, each shield of the plurality of shields is connected to a ground terminal of the RF power transistor. The input fingers, output fingers, and shields are formed using a metal layer stack of multiple metal layers.

## Claims

### Claim 1

A radio-frequency (RF) power amplifier package comprising:
a semiconductor die comprising;
an RF power transistor comprising:
a plurality of output bond pads;
a plurality of input bond pads;
a plurality of input fingers that are connected to the plurality of input bond pads; and
a plurality of output fingers that are connected to the plurality of output bond pads;
an input lead arranged on an input side of the RF power amplifier package and an output lead arranged on an output side of the RF power amplifier package;
a plurality of first bondwire connections extending from the plurality of input bond pads towards the input side of the RF power amplifier package and connecting, either directly or indirectly, the plurality of input bond pads to the input lead;
a plurality of second bondwire connections extending from the plurality of output bond pads towards the output side of the RF power amplifier package and connecting, either directly or indirectly, the plurality of output bond pads to the output lead; and
a plurality of shields, each shield of the plurality of shields being arranged in between a respective input finger of the plurality of input fingers and a respective output finger of the plurality of output fingers and extending along with said respective input finger and output finger,
wherein each shield of the plurality of shields is connected to a ground terminal of the RF power transistor,
wherein each input finger of the plurality of input fingers, each output finger of the plurality of output fingers, and each shield of the plurality of shields are formed using a metal layer stack of multiple metal layers of which upper metal layers have a greater thickness than lower metal layers, and
wherein:
each input finger of the plurality of input fingers physically extends for a larger part in a region in between the input side of the RF power amplifier package and the plurality of input bond pads than in a region in between the plurality of input bond pads and the output side of the RF power amplifier package, wherein each input finger of the plurality of input fingers physically extends for more than 70% in the region in between the input side of the RF power amplifier package and the plurality of input bond pads, preferably more than 90%; and/or
each output finger of the plurality of output fingers physically extends for a larger part in a region in between the plurality of output bond pads and the output side of the RF power amplifier package than in a region in between the input side of the RF power amplifier package and the plurality of output bond pads, wherein each output finger of the plurality of output fingers physically extends for more than 70% in the region in between the plurality of output bond pads and the output side of the RF power amplifier package, preferably more than 90%.

### Claim 2 (depends on 1)

The RF power amplifier package according to claim 1, wherein the plurality of input bond pads is grouped into an input bond bar, and wherein the plurality of output bond pads is grouped into an output bond bar.

### Claim 3 (depends on 2)

The RF power amplifier package according to claim 2, wherein each output finger that is connected to the output bond bar corresponds to a respective output finger of the plurality of output fingers, and wherein each input finger that is connected to the input bond bar corresponds to a respective input finger of the plurality of input fingers.

### Claim 4 (depends on 2)

The RF power amplifier package according to claim 2, wherein the plurality of output fingers extends underneath the input bond bar or the plurality of input fingers extends underneath the output bond bar.

### Claim 5 (depends on 1)

The RF power amplifier package according to claim 1,
wherein the plurality of output bond pads is arranged nearer to an edge of the semiconductor die that is closest to the input side of the RF power amplifier package,
wherein the RF power transistor preferably further comprises a plurality of auxiliary output bond pads arranged on the semiconductor die and in between the plurality of output bond pads and the output side,
wherein the second bondwire connections comprise a plurality of first output bondwires that extend between the plurality of output bond pads and the plurality of auxiliary output bond pads and a plurality of second output bondwires that extend from the plurality of auxiliary output bond pads towards the output lead, and
wherein the plurality of auxiliary output bond pads is preferably grouped into an auxiliary output bond bar.

### Claim 6 (depends on 5)

The RF power amplifier package according to claim 5, further comprising an output matching network arranged in between the output lead and the semiconductor die,
wherein the second bondwire connections comprise a plurality of fourth output bondwires that extend between the output lead and the output matching network and a plurality of third output bondwires that extend between the output matching network and the plurality of output bond pads or the plurality of auxiliary output bond pads,
wherein the output matching network preferably comprises an output matching capacitor having a first terminal and a grounded second terminal, and
wherein the plurality of third output bondwires and the plurality of fourth output bondwires are each connected to the first terminal of the output matching capacitor.

### Claim 7 (depends on 6)

The RF power amplifier package according to claim 6, further comprising a conductive substrate on which the semiconductor die is mounted,
wherein the output matching capacitor is mounted on the conductive substrate,
wherein the grounded second terminal of the output matching capacitor is preferably connected to the conductive substrate, and
wherein the ground terminal of the RF power transistor is preferably connected to a substrate via the conductive substrate of the semiconductor die.

### Claim 8 (depends on 1)

The RF power amplifier package according to claim 1,
wherein the plurality of input bond pads are arranged nearer to an edge of the semiconductor die that is closest to the output side of the RF power amplifier package,
wherein the RF power transistor preferably further comprises a plurality of auxiliary input bond pads arranged on the semiconductor die and in between the plurality of input bond pads and the input side,
wherein the first bondwire connections comprise a plurality of first input bondwires that extend from the plurality of auxiliary input bond pads towards the input side and a plurality of second input bondwires that extend between the plurality of auxiliary input bond pads and the plurality of input bond pads, and
wherein the plurality of auxiliary input bond pads is preferably grouped into an auxiliary input bond bar.

### Claim 9 (depends on 8)

The RF power amplifier package according to claim 8, further comprising an input matching network arranged in between the input lead and the semiconductor die,
wherein the first bondwire connections comprise a plurality of third input bondwires that extend between the input lead and the input matching network and a plurality of fourth input bondwires that extend between the input matching network and the plurality of input bond pads or the plurality of auxiliary input bond pads,
wherein the input matching network preferably comprises an input matching capacitor having a first terminal and a grounded second terminal, and
wherein the plurality of third input bondwires and the plurality of fourth input bondwires are each connected to the first terminal of the input matching capacitor.

### Claim 10 (depends on 9)

The RF power amplifier package according to claim 9, further comprising a conductive substrate on which the semiconductor die is mounted,
wherein the input matching capacitor is mounted on the conductive substrate,
wherein the grounded second terminal of the input matching capacitor is preferably connected to the conductive substrate, and
wherein the ground terminal of the RF power transistor is preferably connected to a substrate via the conductive substrate of the semiconductor die.

### Claim 11 (depends on 1)

The RF power amplifier package according to claim 1, further comprising:
a DC blocking capacitor having a first terminal and a second grounded terminal; and
one or more resonance bondwires connected in between the plurality of output bond pads and the first terminal of the DC blocking capacitor,
wherein the DC blocking capacitor essentially forms a short at an RF operating frequency of the RF power amplifier package,
wherein an inductance of the one or more resonance bondwires is designed such that it resonates with an output capacitance of the RF power transistor at or close to the RF operating frequency, and
wherein the DC blocking capacitor is preferably arranged on a separate semiconductor die in between the semiconductor die and the output lead or on the semiconductor die.

### Claim 12 (depends on 11)

The RF power amplifier package according to claim 11, wherein the DC blocking capacitor is arranged on the semiconductor die, and wherein:
the DC blocking capacitor is arranged nearer to an edge of the semiconductor die that is closest to the input side of the RF power amplifier package and wherein each output finger of the plurality of output fingers physically extends for a larger part in the region in between the input side of the RF power amplifier package and the plurality of output bond pads than in the region in between the plurality of output bond pads and the output side of the RF power amplifier package; or
the DC blocking capacitor is arranged nearer to an edge of the semiconductor die that is closest to the output side of the RF power amplifier package and wherein each output finger of the plurality of output fingers physically extends for a larger part in the region in between the plurality of output bond pads and the output side of the RF power amplifier package than in the region in between the input side of the RF power amplifier package and the plurality of output bond pads.

### Claim 13 (depends on 11)

The RF power amplifier package according to claim 11, further comprising a conductive substrate on which the semiconductor die is mounted,
wherein the DC blocking capacitor is mounted on the conductive substrate,
wherein the second grounded terminal of the DC blocking capacitor is preferably connected to the conductive substrate, and
wherein the ground terminal of the RF power transistor is preferably connected to a substrate via the conductive substrate of the semiconductor die.

### Claim 14 (depends on 1)

The RF power amplifier package according to claim 1, wherein the first bondwire connections connect directly to the input lead.

### Claim 15 (depends on 1)

The RF power amplifier package according to claim 1, wherein the second bondwire connections connect directly to the output lead.

### Claim 16 (depends on 1)

The RF power amplifier package according to claim 1,
wherein the RF power transistor comprises a RF power field-effect transistor (FET), and
wherein a input of the RF power transistor corresponds to a gate of the RF power FET, an output of the RF power transistor corresponds to a drain of the RF power FET, and the ground terminal of the RF power transistor corresponds to a source of the RF power FET.

### Claim 17 (depends on 1)

An electronic device comprising the RF power amplifier package according to claim 1.