# US 12,009,750 B2 · Power source device

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- Number: US 12,009,750 B2
- Document ID: US12009750B2
- Status: Granted
- Kind: B2
- Application number: 17/283,723
- Filed: 2019-10-18
- Published: 2021-10-21
- Granted: 2024-06-11
- Earliest claimed: 2018-10-19
- Assignees: Sony Interactive Entertainment Inc.
- Applicants: Sony Interactive Entertainment Inc.
- Inventors: Kazuki Sasao; Etsuji Kaneko; Hideki Ito
- Web page: https://patentgrep.com/patent/US12009750B2

## CPC

- H02M 3/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H02M 3/1588: {comprising at least one synchronous rectifier element (H02M3/1582, H02M3/1584 take precedence)}
- H02M 3/1584: {with a plurality of power processing stages connected in parallel}
- H02M 3/1586: {switched with a phase shift, i.e. interleaved}
- H05K 1/181: associated with surface mounted components
- H05K 3/3415: {on both sides of the substrate or combined with lead-in-hole components}
- Y02B 70/10: Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS

## Abstract

A DC/DC converter includes N inductors and N power modules which correspond to N phases. At least one of the N power modules is mounted on a sub-mounting surface that is opposite to a main mounting surface of a printed circuit board.

## Claims

### Claim 1

A power source device comprising:
an input line that receives a supply of a direct-current input voltage; an output line that is connected to a load;
N inductors that correspond to N phases and each have one end connected to the output line, where N is an integer greater than zero and the N inductors are mounted to a main mounting surface of a printed circuit board; and
N power modules that correspond to the N phases and each have an input pin, a switching
pin, and a ground pin, the input pin being connected to the input line, the switching pin being connected to another end of a corresponding inductor, the ground pin being grounded, wherein:
at least one of the N power modules is mounted on a sub-mounting surface that is opposite to the main mounting surface of the printed circuit board,
the N inductors are linearly arranged in a first direction, wherein the first direction is an X-direction of the printed circuit board, and
an i-th (i=1 to N) power module is disposed adjacently in a second direction, wherein the second direction is a Y-direction of the printed circuit board, to a corresponding i-th inductor, the second direction being perpendicular to the first direction.

### Claim 2 (depends on 1)

The power source device according to claim 1, wherein
the printed circuit board includes
a pad that is mounted on the sub-mounting surface and disposed at a position corresponding to a position of the input pin of the power module, and
an in-pad via that is disposed in the pad.

### Claim 3 (depends on 1)

The power source device according to claim 1, wherein the N power modules are all mounted on the sub-mounting surface.

### Claim 4 (depends on 3)

The power source device according to claim 3, further comprising:
a heat sink that is shared by the N power modules and is in contact with upper surfaces of the N power modules.

### Claim 5 (depends on 1)

The power source device according to claim 1, wherein the N power modules are mounted alternately on the main mounting surface and the sub-mounting surface.

### Claim 6 (depends on 5)

The power source device according to claim 5, wherein respective pairs of the N power modules are connected to a respective common input line.

### Claim 7 (depends on 1)

The power source device according to claim 1, wherein
the N inductors are each formed by connecting two inductor chips having a same inductance value in parallel, and
the two inductor chips are mounted opposite one another, in an overlap manner on the main mounting surface and the sub-mounting surface, respectively, of the printed circuit board.