# US 12,009,633 B2 · Laser device and method for manufacturing a laser device

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- Number: US 12,009,633 B2
- Document ID: US12009633B2
- Status: Granted
- Kind: B2
- Application number: 17/285,244
- Filed: 2019-10-17
- Published: 2021-12-02
- Granted: 2024-06-11
- Earliest claimed: 2018-10-17
- Assignees: OSRAM Opto Semiconductors GmbH
- Applicants: OSRAM Opto Semiconductors GmbH
- Inventors: Joerg Sorg
- Web page: https://patentgrep.com/patent/US12009633B2

## CPC

- H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings
- H01S 5/0222: Gas-filled housings
- H01S 5/02255: using beam deflecting elements
- H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
- H01S 5/02345: Wire-bonding
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H01S 5/0071: {for beam steering, e.g. using a mirror outside the cavity to change the beam direction}
- H01S 5/0231: Stems
- H01S 5/02476: {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements}
- H01S 5/32341: {blue laser based on GaN or GaP}
- H10W 70/682: {comprising holes having chips therein}
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

## Claims

### Claim 1

A laser device, comprising:
a hermetic housing having an interior space and being at least partially made of printed circuit board material,
a laser element arranged in the interior space, and
at least one inorganic layer hermetically shielding the interior space from the printed circuit board material and in contact with the printed circuit board.

### Claim 2 (depends on 1)

The laser device according to claim 1, wherein the laser element is configured to emit laser radiation having a wavelength that is at most 570 nm.

### Claim 3 (depends on 1)

The laser device according to claim 1, wherein the housing comprises a printed circuit board, in which an insert part made of an inorganic material is integrated, as a base plate and the laser element is arranged on the insert part.

### Claim 4 (depends on 3)

The laser device according to claim 3, wherein the insert part comprises at least one electrical via.

### Claim 5 (depends on 1)

The laser device according to claim 1, wherein the housing comprises a ceramic or inorganic base plate and the laser element is arranged on the ceramic or inorganic base plate, and wherein the ceramic or inorganic base plate comprises in particular at least one electrical via.

### Claim 6 (depends on 1)

The laser device according to claim 1, wherein at least one active component and/or at least one passive component are integrated into the printed circuit board material.

### Claim 7 (depends on 1)

The laser device according to claim 1, wherein a further plate, which is at least partially made of an organic material and which comprises a recess, is arranged on the printed circuit board, and the recess at least partially forms the interior space of the housing.

### Claim 8 (depends on 1)

The laser device according to claim 1, wherein the housing comprises a cover plate which is at least partially made of a material which is transparent to the laser radiation emitted by the laser element.

### Claim 9 (depends on 8)

The laser device according to claim 8, wherein the cover plate is at least partially made of an organic material in which an insert part made of a material transparent to the laser radiation emitted by the laser element is integrated.

### Claim 10 (depends on 1)

The laser device according to claim 1, wherein the at least one inorganic layer is at least one metal layer electrodeposited on the printed circuit board material.

### Claim 11

A method for manufacturing a laser device, comprising:
making a housing at least partially of a printed circuit board material,
arranging a laser element in an interior space of the housing,
hermetically shielding the interior space from the printed circuit board material with at least one inorganic layer, and
hermetically sealing the housing by inserting an insert part comprising an inorganic material into a printed circuit board.

### Claim 12 (depends on 11)

The method according to claim 11, further comprising:
providing the insert part and printed circuit board as a base plate housing; and
arranging the laser element on the insert part.

### Claim 13 (depends on 12)

The method according to claim 12, further comprising:
arranging a further plate, which is at least partially made of an organic material and which comprises a recess, on the printed circuit board, wherein the recess at least partially forms the interior space of the housing.

### Claim 14 (depends on 13)

The method according to claim 13, further comprising:
applying the at least one inorganic layer to the printed circuit board and the further plate, and
applying thereafter a cover plate made at least partially of a material transparent to the laser radiation emitted by the laser element to the further plate.

### Claim 15 (depends on 14)

The method according to claim 14, wherein the cover plate is fixed to the further plate by means of a joining material comprising a metallic material, a low temperature glass and/or an inorganic adhesive material.

### Claim 16 (depends on 12)

The method according to claim 12, further comprising providing a cover plate made at least partially of a material transparent to the laser radiation emitted by the laser element, and fixing a further plate made at least partially of an organic material and comprising a recess on the cover plate, and wherein the recess at least partially forms the interior space of the housing.

### Claim 17 (depends on 16)

The method according to claim 16, further comprising applying the at least one inorganic layer to the printed circuit board, and after fixing the further plate to the cover plate, applying at least one further inorganic layer to the further plate to shield the interior space from the further plate, and thereafter applying the cover plate to the printed circuit board together with the further plate.

### Claim 18 (depends on 17)

The method according to claim 17, wherein the cover plate together with the further plate is fixed to the printed circuit board by a joining material comprising a metallic material, a low temperature glass and/or an inorganic adhesive material.

### Claim 19 (depends on 11)

The method according to claim 11, wherein the at least one inorganic layer comprises at least one metal layer electrodeposited on the printed circuit board material.