# US 12,009,588 B2 · Antenna installation structure and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,588 B2 - Document ID: US12009588B2 - Status: Granted - Kind: B2 - Application number: 17/675,443 - Filed: 2022-02-18 - Published: 2022-06-02 - Granted: 2024-06-11 - Earliest claimed: 2019-09-26 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Takeyuki Okabe; Nobuyuki Tenno; Daiki Kobayashi - Web page: https://patentgrep.com/patent/US12009588B2 ## CPC - H01Q 1/243: {with built-in antennas} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/24: with receiving set - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)} - H01Q 13/08: Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An antenna installation structure includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor which are on the first main surface and are separated from each other. The insulation layer is in contact with the first main surface of the antenna substrate. The bonding material is between the insulation layer and a radiation side wall of a housing and is in contact with the insulation layer and the radiation side wall. The porosity of the insulation layer is lower than the porosity of the bonding material. ## Claims ### Claim 1 An antenna, comprising: an antenna substrate including a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor on the first main surface and are separated from each other; an insulation layer in contact with the first main surface of the antenna substrate; and a bonding material between the insulation layer and another component and in contact with the insulation layer and the another component; wherein a porosity of the insulation layer is lower than a porosity of the bonding material. ### Claim 2 (depends on 1) The antenna according to claim 1, wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material. ### Claim 3 (depends on 1) The antenna according to claim 1, wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer. ### Claim 4 (depends on 1) The antenna according to claim 1, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor. ### Claim 5 (depends on 1) The antenna according to claim 1, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor. ### Claim 6 (depends on 1) The antenna according to claim 1, wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion. ### Claim 7 (depends on 1) The antenna according to claim 1, wherein a relative permittivity of the antenna substrate is lower than a relative permittivity of the insulation layer; and the relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material. ### Claim 8 An antenna installation structure, comprising: an antenna including: an antenna substrate including a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor on the first main surface and separated from each other; an insulation layer in contact with the first main surface of the antenna substrate; and a bonding material between the insulation layer and another component and in contact with the insulation layer and the another component; wherein a porosity of the insulation layer is lower than a porosity of the bonding material in an antenna; and the antenna and the another component are connected to each other. ### Claim 9 (depends on 8) The antenna installation structure according to claim 8, wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material. ### Claim 10 (depends on 8) The antenna installation structure according to claim 8, wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer. ### Claim 11 (depends on 8) The antenna installation structure according to claim 8, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor. ### Claim 12 (depends on 8) The antenna installation structure according to claim 8, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor. ### Claim 13 (depends on 8) The antenna installation structure according to claim 8, wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion. ### Claim 14 (depends on 8) The antenna installation structure according to claim 8, wherein a relative permittivity of the antenna substrate is lower than a relative permittivity of the insulation layer; and the relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material. ### Claim 15 (depends on 8) An electronic device, comprising: the antenna installation structure according to claim 8, and a circuit substrate to be connected to the antenna substrate; wherein the another component is a housing that houses the antenna substrate and the circuit substrate. ### Claim 16 (depends on 15) The electronic device according to claim 15, wherein a relative permittivity of the insulation layer is lower than a relative permittivity of the bonding material. ### Claim 17 (depends on 15) The electronic device according to claim 15, wherein a region surrounded by a surface of the antenna conductor facing the ground conductor, a surface of the ground conductor facing the antenna conductor, and the first main surface is filled with the insulation layer. ### Claim 18 (depends on 15) The electronic device according to claim 15, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the ground conductor. ### Claim 19 (depends on 15) The electronic device according to claim 15, wherein the antenna substrate includes, in the dielectric base, an interlayer connection conductor to be connected to the antenna conductor. ### Claim 20 (depends on 15) The electronic device according to claim 15, wherein the antenna substrate includes a bent portion between a portion to be bonded to the bonding material via the insulation layer and another portion.