# US 12,009,586 B2 · Conductive device, method for producing conductive device, and radio

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- Number: US 12,009,586 B2
- Document ID: US12009586B2
- Status: Granted
- Kind: B2
- Application number: 17/429,144
- Filed: 2020-02-06
- Published: 2022-01-13
- Granted: 2024-06-11
- Earliest claimed: 2019-02-08
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Takuya Mino; Takanori Aketa
- Web page: https://patentgrep.com/patent/US12009586B2

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q 9/285: {Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407)}
- H01Q 1/24: with receiving set
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
- H05K 3/1258: {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H01B 5/14: comprising conductive layers or films on insulating-supports
- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 3/247: {Finish coating of conductors by using conductive pastes, inks or powders}
- H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/09263: Meander
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

The conductive device includes a substrate and an electrically conductive portion. The electrically conductive portion is provided on the substrate. The electrically conductive portion includes an electrically conductive part and a low resistance conductive layer. The electrically conductive part is provided on the substrate and includes an electrically conductive particle and an organic binder. The low resistance conductive layer covers at least part of a surface of the electrically conductive part and has lower resistivity than the electrically conductive part.

## Claims

### Claim 1

A conductive device, comprising:
a substrate; and
an electrically conductive portion provided on the substrate,
the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,
wherein the low resistance conductive layer is a sintered silver layer including a plurality of silver nanoparticles.

### Claim 2 (depends on 1)

The conductive device of claim 1 wherein
the electrically conductive part is stretchable.

### Claim 3 (depends on 1)

The conductive device of claim 1, wherein
the substrate is a flexible substrate.

### Claim 4 (depends on 1)

The conductive device of claim 1, further comprising a protecting sheet stacked on the substrate and covering the electrically conductive portion.

### Claim 5 (depends on 1)

The conductive device of any one of claim 1, wherein the electrically conductive particle is a silver particle.

### Claim 6 (depends on 1)

The conductive device of claim 1, wherein
the substrate has a groove overlapping the electrically conductive portion in plan view in a thickness direction of the substrate, the groove extending along an edge of the electrically conductive portion, and
in the plan view in the thickness direction of the substrate, the edge of the electrically conductive portion overlaps one opening edge of a pair of opening edges in a width direction of the groove, the one opening edge being closer to the edge of the electrically conductive portion, and
the electrically conductive portion includes a projection portion inserted in the grooves.

### Claim 7 (depends on 1)

The conductive device of claim 1, wherein
the low resistance conductive layer is stacked on an entirety of the surface of the electrically conductive part.

### Claim 8 (depends on 7)

A method for producing the conductive device of claim 7, the method comprising:
preparing the substrate;
applying conductive paste to a formation target area of the electrically conductive part on the substrate, the conductive paste including the electrically conductive particle, the organic binder, and a solvent;
heating the conductive paste to form the electrically conductive part; and
forming the low resistance conductive layer on the surface of the electrically conductive part.

### Claim 9

A radio comprising a conductive device as an antenna device,
the conductive device comprising:
a substrate; and
an electrically conductive portion provided on the substrate,
the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,
wherein the low resistance conductive layer is a sintered silver layer including a plurality of silver nanoparticles.

### Claim 10 (depends on 9)

The radio of claim 9, further comprising a housing, wherein
the housing and the conductive device are integrated with each other.

### Claim 11 (depends on 10)

The radio of claim 10 further comprising a connection terminal electrically connected to the conductive device, wherein
the conductive device is electrically connectable to a component outside the conductive device via the connection terminal.

### Claim 12 (depends on 10)

The radio of claim 10, wherein
the housing is a film insert molded product including the conductive device as a film.

### Claim 13

A radio comprising:
a conductive device as an antenna device;
a housing; and
a connection terminal electrically connected to the conductive device, the conductive device comprising:
a substrate; and
an electrically conductive portion provided on the substrate, the electrically conductive portion including:
an electrically conductive part provided on the substrate and including an electrically conductive particle and an organic binder; and
a low resistance conductive layer covering at least part of a surface of the electrically conductive part and having a lower resistivity than the electrically conductive part,
wherein the housing and the conductive device are integrated with each other,
the conductive device is electrically connectable to a component outside the conductive device via the connection terminal, and
the connection terminal has:
a through part extending through the substrate in a thickness direction of the substrates; and
a base part between the substrate and the housing.

### Claim 14 (depends on 13)

The radio of claim 13, wherein
the base part has an outer peripheral part, and at least part of the outer peripheral part is thinner than a center part of the base part.

### Claim 15 (depends on 13)

The radio of claim 13, wherein
the base part has a groove formed in a surface located on an opposite side from the substrate in the thickness direction of the substrate.
