# US 12,009,572 B2 · Antenna package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,572 B2 - Document ID: US12009572B2 - Status: Granted - Kind: B2 - Application number: 17/742,039 - Filed: 2022-05-11 - Published: 2022-11-24 - Granted: 2024-06-11 - Earliest claimed: 2021-05-18 - Assignees: STMicroelectronics (Grenoble 2) SAS; STMicroelectronics (Alps) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS; STMicroelectronics (Alps) SAS - Inventors: Romain Coffy; Georg Kimmich - Web page: https://patentgrep.com/patent/US12009572B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 1/422: {comprising two or more layers of dielectric material (H01Q1/425 takes precedence)} - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 13/18: the slot being backed by, or formed in boundary wall of, a resonant cavity (longitudinally slotted cylinder H01Q13/12 ){; Open cavity antennas} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna. ## Claims ### Claim 1 A package, comprising: an upper level including: a stack comprising insulating layers and conductive elements; a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; and an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element. ### Claim 2 (depends on 1) The package according to claim 1, wherein the first cavity has a side plastic surface and a bottom plastic surface and wherein said second conductive track is located on the bottom plastic surface of the first cavity. ### Claim 3 (depends on 2) The package according to claim 2, wherein the first cavity is filled with a first material having a dielectric permittivity less than 20. ### Claim 4 (depends on 1) The package according to claim 1, wherein said second conductive track is located over the first cavity on the second side of the plastic element. ### Claim 5 A package comprising: an upper level including: a stack comprising insulating layers and conductive elements; a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; and an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element; wherein the plastic element further includes a second cavity extending into the plastic element from said first side with a second height that is less than said thickness of the plastic element between the first and second sides, said second cavity surrounding the first cavity. ### Claim 6 (depends on 5) The package according to claim 5, wherein the second cavity is separated from the first cavity by a first wall extending for the first height of the first cavity and resting on the stack. ### Claim 7 (depends on 5) The package according to claim 5, wherein the antenna further comprises a third conductive track located within the second cavity. ### Claim 8 (depends on 7) The package according to claim 7, wherein said third conductive track comprises a first portion extending on a side wall of the second cavity and a second portion extending on a bottom of the second cavity. ### Claim 9 (depends on 8) The package according to claim 8, wherein said second conductive track is located at a bottom of the first cavity and wherein the second portion of the third conductive track is coplanar with the second conductive track. ### Claim 10 (depends on 8) The package according to claim 8, wherein said second conductive track is located at a bottom of the first cavity and wherein the second portion of the third conductive track extends in a plane different from a plane of the second conductive track. ### Claim 11 (depends on 7) The package according to claim 7, wherein the third conductive track is electrically coupled to the first conductive track. ### Claim 12 (depends on 5) The package according to claim 5, wherein the first cavity is filled with a first dielectric material and wherein the second cavity is filled with a second dielectric material different from the first dielectric material. ### Claim 13 A package further comprising: an upper level including: a stack comprising insulating layers and conductive elements; a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; and an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element a lower level; wherein the upper level is attached to the lower level by electrical connecting elements; wherein a third cavity is defined between the upper level and the lower level and surrounded by said electrical connecting elements; and an integrated circuit chip located within the third cavity and electrically connected to the antenna. ### Claim 14 (depends on 13) The package according to claim 13, further comprising a fourth conductive track extending into the stack between the first conductive track and the third cavity. ### Claim 15 (depends on 1) The package according to claim 1, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 16 A method for manufacturing a package, comprising: forming an upper level by: forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna; forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack; and forming a second conductive track resting on a wall of the plastic element. ### Claim 17 (depends on 16) The method of claim 16, further comprising filling the first cavity with a first material having a dielectric permittivity less than 20. ### Claim 18 A method comprising: forming an upper level by: forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna; forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack; and forming a second conductive track resting on a wall of the plastic element wherein forming the plastic element further includes forming a second cavity extending into the plastic element from said first side with a second height that is less than said thickness of the plastic element between the first and second sides, said second cavity surrounding the first cavity. ### Claim 19 (depends on 18) The method according to claim 18, further comprising forming a third conductive track extending along at least one wall of the second cavity. ### Claim 20 (depends on 19) The method according to claim 19, wherein the third conductive track comprises a first portion extending on a side wall of the second cavity and a second portion extending on a bottom of the second cavity. ### Claim 21 (depends on 20) The method according to claim 20, wherein the second conductive track extends on a bottom of the first cavity and the second portion of the third conductive track is coplanar with the second conductive track. ### Claim 22 (depends on 20) The method according to claim 20, wherein the second conductive track extends on a bottom of the first cavity and the second portion of the third conductive track extends in a plane different from a plane of the second conductive track. ### Claim 23 (depends on 19) The method according to claim 19, further comprising electrically coupling the third conductive track to the first conductive track. ### Claim 24 (depends on 18) The method according to claim 18, further comprising filling the first cavity with a first dielectric material and filling the second cavity with a second dielectric material different from the first dielectric material. ### Claim 25 (depends on 24) The method according to claim 24, wherein forming the plastic element comprises molding and wherein filling the first and second cavities with the first and second dielectric materials, respectively, occurs after molding. ### Claim 26 A method comprising: forming an upper level by: forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna; forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides; mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack; and forming a second conductive track resting on a wall of the plastic element forming a lower level; and attaching the upper level to lower level, said attaching defining, between the upper level and the lower level, a third cavity. ### Claim 27 (depends on 26) The method according to claim 26, further comprising forming a fourth conductive track extending into the stack between the first conductive track and the third cavity. ### Claim 28 (depends on 16) The method of claim 16, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 29 (depends on 28) The method according to claim 28, wherein forming the plastic element comprises performing a laser direct structuring operation. ### Claim 30 (depends on 5) The package according to claim 5, wherein said second conductive track is located at a bottom of the first cavity. ### Claim 31 (depends on 30) The package according to claim 30, wherein the first cavity is filled with a first material having a dielectric permittivity less than 20. ### Claim 32 (depends on 5) The package according to claim 5, wherein said second conductive track is located over the first cavity on the second side of the plastic element. ### Claim 33 (depends on 5) The package according to claim 5, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 34 (depends on 13) The package according to claim 13, wherein said second conductive track is located at a bottom of the first cavity. ### Claim 35 (depends on 34) The package according to claim 34, wherein the first cavity is filled with a first material having a dielectric permittivity less than 20. ### Claim 36 (depends on 13) The package according to claim 13, wherein said second conductive track is located over the first cavity on the second side of the plastic element. ### Claim 37 (depends on 13) The package according to claim 13, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 38 (depends on 18) The method of claim 18, further comprising filling the first cavity with a first material having a dielectric permittivity less than 20. ### Claim 39 (depends on 18) The method of claim 18, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 40 (depends on 39) The method according to claim 39, wherein forming the plastic element comprises performing a laser direct structuring operation. ### Claim 41 (depends on 26) The method of claim 26, further comprising filling the first cavity with a first material having a dielectric permittivity less than 20. ### Claim 42 (depends on 26) The method of claim 26, wherein the plastic element is made of a thermoplastic material that is doped with a non-conductive inorganic metal compound. ### Claim 43 (depends on 42) The method according to claim 42, wherein forming the plastic element comprises performing a laser direct structuring operation.