# US 12,009,464 B2 · Display device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,464 B2 - Document ID: US12009464B2 - Status: Granted - Kind: B2 - Application number: 17/515,558 - Filed: 2021-11-01 - Published: 2023-02-16 - Granted: 2024-06-11 - Earliest claimed: 2021-08-06 - Assignees: Au Optronics Corporation - Applicants: Au Optronics Corporation - Inventors: Wei-Fu Wu; Yu Tseng; Yu-Ting Liu; Chih-Cheng Kao; Tsai-Chi Yeh - Web page: https://patentgrep.com/patent/US12009464B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H10H 20/01: Manufacture or treatment - H10W 70/611: {for connecting multiple chips together} - H10W 70/688: {Flexible insulating substrates} - H10W 90/00: Package configurations - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/056: Folded around rigid support or component - H05K 2201/10128: Display - H10H 20/0364: {of interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics. ## Claims ### Claim 1 A display device, comprising: a pixel array substrate, having a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface, wherein a plurality of bonding pads are located on the first surface; and a circuit board, electrically connected to the bonding pads, bent from above the first surface of the pixel array substrate to below the second surface, wherein the circuit board comprises a thermoplastic substrate, wherein the thermoplastic substrate comprises a third surface facing the pixel array substrate and a fourth surface opposite to the third surface, and the thermoplastic substrate comprises a first bend formed by thermoplastics. ### Claim 2 (depends on 1) The display device according to claim 1, wherein the circuit board further comprises: a first conducting pattern, located on the third surface, electrically connected to the bonding pads; a second conducting pattern, located on the fourth surface; and a plurality of electric conductive vias, penetrating the thermoplastic substrate, electrically connecting the first conducting pattern to the second conducting pattern. ### Claim 3 (depends on 2) The display device according to claim 2, wherein the circuit board further comprises: a first protective layer, located on the first conducting pattern; and a second protective layer, located on the second conducting pattern, wherein the first protective layer and the second protective layer are separated from the first bend of the thermoplastic substrate. ### Claim 4 (depends on 3) The display device according to claim 3, wherein a horizontal spacing between a side surface of the first protective layer and a side surface of the second protective layer on one side is greater than or equal to 500 micrometers. ### Claim 5 (depends on 1) The display device according to claim 1, wherein a Young's modulus of the first bend of the thermoplastic substrate is 3 GPa to 5 GPa. ### Claim 6 (depends on 1) The display device according to claim 1, wherein a glass transition temperature of the thermoplastic substrate is 145° C. to 165° C. ### Claim 7 (depends on 1) The display device according to claim 1, wherein a thickness of the thermoplastic substrate is 25 micrometers to 50 micrometers. ### Claim 8 (depends on 1) The display device according to claim 1, wherein the circuit board directly contacts the first side surface of the pixel array substrate. ### Claim 9 (depends on 1) The display device according to claim 1, further comprising: a backlight module, located on the second surface of the pixel array substrate, wherein the circuit board directly contacts a second side surface of the backlight module. ### Claim 10 (depends on 1) The display device according to claim 1, wherein the thermoplastic substrate comprises a liquid crystal polymer substrate. ### Claim 11 (depends on 10) The display device according to claim 10, wherein the liquid crystal polymer substrate comprises a plurality of liquid crystal molecules, and a long axis direction of the liquid crystal molecules is parallel to a bending direction of the first bend. ### Claim 12 (depends on 1) The display device according to claim 1, wherein the thermoplastic substrate further comprises a second bend, wherein the first bend allows the thermoplastic substrate to bend from above the first surface of the pixel array substrate to the first side surface of the pixel array substrate, the second bend allows the thermoplastic substrate to bend from the first side surface of the pixel array substrate to below the second surface of the pixel array substrate, and a bending angle of the first bend is smaller than a bending angle of the second bend or the second bend comprises an arc surface. ### Claim 13 (depends on 12) The display device according to claim 12, further comprising: a chip package structure, electrically connected to the circuit board, wherein the chip package structure comprises: a substrate; a circuit, located on the substrate; and at least one chip, electrically connected to the circuit. ### Claim 14 (depends on 1) The display device according to claim 1, wherein the thermoplastic substrate comprises a side surface connecting the third surface and the fourth surface, wherein the side surface is located above the first surface of the pixel array substrate, and the side surface is not a flat surface. ### Claim 15 A manufacturing method of a display device, comprising: providing a pixel array substrate, wherein the pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface, wherein a plurality of bonding pads are located on the first surface; providing a circuit board, wherein the circuit board comprises a thermoplastic substrate: heating the thermoplastic substrate to form a first bend formed by thermoplastics in the thermoplastic substrate; and electrically connecting the circuit board to the bonding pads. ### Claim 16 (depends on 15) The manufacturing method of the display device according to claim 15, wherein a method of providing the circuit board comprises: forming the thermoplastic substrate; forming the first conducting pattern on the third surface of the thermoplastic substrate; forming the second conducting pattern on the fourth surface of the thermoplastic substrate; forming a plurality of vias in the thermoplastic substrate; forming a conductive material in the vias to form a plurality of electric conductive vias, wherein the electric conductive vias electrically connect the first conducting pattern to the second conducting pattern; forming a first protective layer on the first conducting pattern; and forming a second protective layer on the second conducting pattern, wherein the first protective layer and the second protective layer are separated from the first bend of the thermoplastic substrate. ### Claim 17 (depends on 15) The manufacturing method of the display device according to claim 15, wherein after electrically connecting the circuit board to the bonding pads, the circuit board is bent from the first surface of the pixel array substrate to the first side surface of the pixel array substrate, and then the step of heating the thermoplastic substrate is performed by using a thermal compression head. ### Claim 18 (depends on 17) The manufacturing method of the display device according to claim 17, further comprising: bending the circuit board to form a second bend in the thermoplastic substrate, wherein the first bend allows the thermoplastic substrate to bend from above the first surface of the pixel array substrate to the first side surface of the pixel array substrate, and the second bend allows the thermoplastic substrate to bend from the first side surface of the pixel array substrate to below the second surface of the pixel array substrate, wherein a bending angle of the first bend is smaller than a bending angle of the second bend or the second bend comprises an arc surface. ### Claim 19 (depends on 15) The manufacturing method of the display device according to claim 15, wherein before electrically connecting the circuit board to the bonding pads, the circuit board is placed in a mold, and the step of heating the thermoplastic substrate is performed by using the mold. ### Claim 20 (depends on 19) The manufacturing method of the display device according to claim 19, wherein the mold heats a side surface of the thermoplastic substrate and allows the side surface to be formed by thermoplastics.