# US 12,009,376 B2 · Highly integrated transmitter module for LiDAR

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- Number: US 12,009,376 B2
- Document ID: US12009376B2
- Status: Granted
- Kind: B2
- Application number: 17/131,617
- Filed: 2020-12-22
- Published: 2022-06-23
- Granted: 2024-06-11
- Earliest claimed: 2020-12-22
- Assignees: Beijing Voyager Technology Co., Ltd.
- Applicants: Beijing Voyager Technology Co., Ltd.
- Inventors: Yue Lu; Yu-Ching Yeh; Yonghong Guo; Youmin Wang
- Web page: https://patentgrep.com/patent/US12009376B2

## CPC

- H10F 39/804: {Containers or encapsulations}
- G01S 7/481: Constructional features, e.g. arrangements of optical elements
- G01S 7/4811: {common to transmitter and receiver}
- G01S 7/4813: {Housing arrangements}
- G01S 7/4863: Detector arrays, e.g. charge-transfer gates
- G01S 17/02: Systems using the reflection of electromagnetic waves other than radio waves (G01S17/66 takes precedence)
- G01S 17/931: of land vehicles
- H01S 5/183: having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S 5/4025: {Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence)}
- H10F 39/8027: {Geometry of the photosensitive area}
- H10F 39/8057: {Optical shielding}
- G01S 7/4815: {using multiple transmitters}
- H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings
- H01S 5/0222: Gas-filled housings
- H01S 5/02257: using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
- H01S 5/02326: Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
- H01S 5/0239: Combinations of electrical or optical elements
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

Embodiments of the disclosure provide an optical sensing system, an integrated transmitter module for the optical sensing system, and an optical sensing method performed using the optical sensing system. The exemplary optical sensing system includes an integrated transmitter module configured to emit an optical signal into an environment surrounding the optical sensing system. The integrated transmitter module includes a laser emitter, one or more driving integrated circuits, and one or more optics integrated into a chamber that is hermetically sealed. The optical sensing system further includes a photodetector configured to receive the optical signal reflected from the environment and convert the received optical signal to an electrical signal. The optical sensing system additionally includes a readout circuit configured to convert the electrical signal to a digital signal. The photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.

## Claims

### Claim 1

An optical sensing system, comprising:
an integrated transmitter module configured to emit an optical signal into an environment surrounding the optical sensing system,
wherein the integrated transmitter module comprises a laser emitter, one or more driving integrated circuits (ICs), and one or more optics integrated into a chamber that is hermetically sealed,
wherein a first set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material;
a photodetector configured to receive the optical signal reflected from the environment surrounding the optical sensing system and convert the received optical signal to an electrical signal; and
a readout circuit configured to convert the electrical signal to a digital signal,
wherein the photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.

### Claim 2 (depends on 1)

The optical sensing system of claim 1, wherein the PCB is a ceramic PCB with a high thermal conductivity and a low expansion coefficient.

### Claim 3 (depends on 1)

The optical sensing system of claim 1, wherein the one or more optics are aligned with the laser emitter.

### Claim 4 (depends on 1)

The optical sensing system of claim 1, wherein the substrate comprises a lens mount fixed to the inner surface of the chamber.

### Claim 5 (depends on 1)

The optical sensing system of claim 1, wherein the chamber is configured to enclose a predefined air composition inside the chamber.

### Claim 6 (depends on 1)

The optical sensing system of claim 1, wherein the laser emitter comprises at least one of a single emitter, a multi-emitter unit, an emitter array, or an emitter stack.

### Claim 7 (depends on 6)

The optical sensing system of claim 6, wherein:
when the laser emitter comprises the multi-emitter unit, the multi-emitter unit comprises a plurality of single emitters disposed in a single chip;
when the laser emitter comprises the emitter array, the emitter array comprises a plurality of single emitters disposed on a single substrate; and
when the laser emitter comprises the emitter stack, the emitter stack comprises a plurality of emitter arrays vertically or horizontally stacked together.

### Claim 8 (depends on 1)

The optical sensing system of claim 1, wherein the chamber further comprises a second set of pins disposed on an outside surface of the chamber, the second set of pins establishing a communication link between the integrated transmitter module and a controller of the optical sensing system, wherein the controller is located outside the chamber.

### Claim 9 (depends on 1)

The optical sensing system of claim 1, wherein the integrated transmitter module further comprises a monitoring component configured to monitor at least one of a laser power, a module temperature, or a wavelength of the emitted optical signal.

### Claim 10

An optical sensing method, comprising:
emitting, by an integrated transmitter module of an optical sensing system, an optical signal into an environment surrounding the optical sensing system,
wherein the integrated transmitter module comprises a laser emitter, one or more driving integrated circuits (ICs), and one or more optics integrated into a chamber that is hermetically sealed,
wherein a first set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material;
detecting, by a photodetector of the optical sensing system, the optical signal reflected from the environment surrounding the optical sensing system;
converting, by the photodetector, the detected optical signal to an electrical signal; and
converting, by a readout circuit of the optical sensing system, the electrical signal to a digital signal,
wherein the photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.

### Claim 11 (depends on 10)

The optical sensing method of claim 10, wherein the PCB is a ceramic PCB with a high thermal conductivity and a low expansion coefficient.

### Claim 12 (depends on 10)

The optical sensing method of claim 10, wherein the one or more optics are aligned with the laser emitter.

### Claim 13 (depends on 10)

The optical sensing method of claim 10, wherein the substrate comprises a lens mount fixed to the inner surface of the chamber.

### Claim 14 (depends on 10)

The optical sensing method of claim 10, wherein the chamber encloses a predefined air composition inside the chamber.

### Claim 15 (depends on 10)

The optical sensing method of claim 10, wherein the laser emitter comprises at least one of a single emitter, a multi-emitter unit, an emitter array, or an emitter stack.

### Claim 16 (depends on 10)

The optical sensing method of claim 10, further comprising:
establishing, by a second set of pins disposed on an outside surface of the chamber, a communication link between the integrated transmitter module and a controller of the optical sensing system, wherein the controller is located outside the chamber.

### Claim 17 (depends on 10)

The optical sensing method of claim 10, further comprising:
monitoring, by a monitoring component of the integrated transmitter module, at least one of a laser power, a module temperature, or a wavelength of the emitted optical signal.

### Claim 18

An integrated transmitter module for an optical sensing system, comprising:
a laser emitter configured to emit an optical signal to an environment surrounding the optical sensing system;
one or more driving integrated circuits (ICs) configured to drive the laser emitter to emit the optical signal; and
one or more optics configured to shape the optical signal into a predefined shape for emitting to the environment,
wherein the laser emitter, the one or more driving ICs, and the one or more optics are integrated into a hermetically sealed chamber,
wherein a set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material.

### Claim 19 (depends on 18)

The integrated transmitter module of claim 18, wherein the PCB is a ceramic PCB with a high thermal conductivity and a low expansion coefficient.

### Claim 20 (depends on 18)

The integrated transmitter module of claim 18, wherein the one or more optics are aligned with the laser emitter.