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US 12,009,361 B2Granted
Protection devices with trigger devices and methods of formation thereof
AssigneeInfineon Technologies AG
InventorsVadim Valentinovic Vendt, Joost Willemen, Andre Schmenn, Damian Sojka
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Abstract
A method of forming a semiconductor device includes forming a first vertical protection device comprising a thyristor in a substrate, forming a first lateral trigger element for triggering the first vertical protection device in the substrate, and forming an electrical path in the substrate to electrically couple the first lateral trigger element with the first vertical protection device.
Claims6
A method of forming a semiconductor device, the method comprising:
- forming a first vertical protection device comprising a thyristor in a substrate;
- forming a first lateral trigger element for triggering the first vertical protection device in the substrate;
- and
- forming an electrical path in the substrate to electrically couple the first lateral trigger element with the first vertical protection device;
- forming a second vertical protection device comprising a second thyristor in the substrate;
- forming a second lateral trigger element for triggering the second vertical protection device in the substrate;
- and
- forming a second electrical path in the substrate to electrically couple the second lateral trigger element with the second vertical protection device,
- wherein the first and second vertical protection devices form a bidirectional transient voltage suppressor device,
- wherein the first and second lateral trigger elements are each configured as bipolar transistors.
7 more elements
Dependencies are inferred from the claim text.