# US 12,009,353 B2 · Optical device package with compatible lid and carrier

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- Number: US 12,009,353 B2
- Document ID: US12009353B2
- Status: Granted
- Kind: B2
- Application number: 17/719,280
- Filed: 2022-04-12
- Published: 2022-07-28
- Granted: 2024-06-11
- Earliest claimed: 2019-10-25
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Tsung-Yueh Tsai; Meng-Jen Wang; Yu-Fang Tsai; Meng-Jung Chuang
- Web page: https://patentgrep.com/patent/US12009353B2

## CPC

- H10F 39/804: {Containers or encapsulations}
- H10W 90/00: Package configurations
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/071: {Connecting or disconnecting}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 76/01: Manufacture or treatment
- H10W 72/0198: {batch processes}
- H10W 72/072: {of bump connectors}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30: Die-attach connectors
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/10: characterised by their shape or disposition
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 76/60: Seals
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

## Claims

### Claim 1

An optical device package, comprising:
a carrier;
an optical element disposed on an upper surface of the carrier;
a lid disposed on the upper surface of the carrier; and
an adhesive between the lid and the carrier;
wherein at least a portion of the adhesive is below the optical element;
wherein the upper surface of the carrier comprises a first portion and a second portion recessed with respect to the first portion, and wherein the adhesive is disposed on the second portion of the upper surface of the carrier.

### Claim 2 (depends on 1)

The optical device package of claim 1, wherein a portion of the adhesive is between the lid and the optical element.

### Claim 3 (depends on 1)

The optical device package of claim 1, wherein the adhesive is in contact with an inner sidewall of the lid.

### Claim 4 (depends on 1)

The optical device package of claim 1, wherein a lateral surface of the adhesive is substantially coplanar with a lateral surface of the lid.

### Claim 5 (depends on 4)

The optical device package of claim 4, wherein the lateral surface of the adhesive is substantially aligned with a lateral surface of the carrier.

### Claim 6 (depends on 1)

The optical device package of claim 1, wherein an elevation of a top surface of the adhesive is higher than an elevation of a bottom surface of the lid.

### Claim 7 (depends on 1)

The optical device package of claim 1, wherein a portion of the adhesive is between the lid and the optical element, and wherein the adhesive is in contact with an inner sidewall of the lid, and wherein a lateral surface of the adhesive is substantially coplanar with a lateral surface of the lid, and wherein an elevation of a top surface of the adhesive is higher than an elevation of a bottom surface of the lid.