# US 12,009,351 B2 · Plurality of semiconductor devices between stacked substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,009,351 B2 - Document ID: US12009351B2 - Status: Granted - Kind: B2 - Application number: 17/525,833 - Filed: 2021-11-12 - Published: 2023-05-18 - Granted: 2024-06-11 - Earliest claimed: 2021-11-12 - Assignees: Advanced Semiconductor Engineering, Inc. - Applicants: Advanced Semiconductor Engineering, Inc. - Inventors: Wei-Hao Chang - Web page: https://patentgrep.com/patent/US12009351B2 ## CPC - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 90/00: Package configurations - H10D 84/01: Manufacture or treatment - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10W 70/611: {for connecting multiple chips together} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 72/0198: {batch processes} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 74/01: Manufacture or treatment - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7418: {of passive members, e.g. a chip mounting substrate} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/722: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component. ## Claims ### Claim 1 An electronic device, comprising: a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate; a second component disposed on the second surface of the second substrate; and a support member covering the first component; wherein the support member is configured to be attached to a tape so that a divided operation on the second substrate can be performed; wherein a third component is disposed on the first substrate and underneath the second substrate; wherein a portion of the first substrate is free from being covered by the second substrate; wherein a fourth component is disposed on the portion of the first substrate; wherein a first package body is disposed on the first substrate and cover the third component and the fourth component. ### Claim 2 (depends on 1) The electronic device of claim 1, further comprising an interposer electrically connecting the first substrate to the second substrate. ### Claim 3 (depends on 1) The electronic device of claim 1, wherein the first package body has a surface facing away from the first substrate, and wherein the support member is exposed from the surface of the first package body. ### Claim 4 (depends on 1) The electronic device of claim 1, wherein the support member has a surface facing away from the second substrate, and wherein the first component is exposed from the surface of the support member. ### Claim 5 (depends on 1) The electronic device of claim 1, wherein the support member has a side surface and the first package body has a side surface, and wherein the side surface of the support member is spaced apart from the side surface of the first package body. ### Claim 6 (depends on 1) The electronic device of claim 1, wherein the first substrate has a first surface facing the second substrate and a second surface opposite to the first surface of the first substrate, and wherein a fifth component is disposed on the second surface of the first substrate and a second package body is disposed on the second surface of the first substrate and covers the fifth component. ### Claim 7 An electronic device, comprising: a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate, a second surface facing the first substrate and a side surface between the first surface and the second surface, a first component disposed on the first surface of the second substrate; a second component disposed on the second surface of the second substrate a third component disposed on the first substrate and under the second substrate; and a first package body covering the first component and having a lateral surface substantially coplanar with the side surface of the second substrate; wherein a portion of the first substrate is free from being covered by the second substrate wherein a fourth component is disposed on the portion of the first substrate; wherein a second package body is disposed on the portion of the first substrate and covers the third component and the fourth component. ### Claim 8 An electronic device, comprising: a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate, a second surface facing the first substrate and a side surface between the first surface and the second surface, a first component disposed on the first surface of the second substrate; a second component disposed on the second surface of the second substrate a third component disposed on the first substrate and under the second substrate; a first package body covering the first component and having a lateral surface substantially coplanar with the side surface of the second substrate; wherein a portion of the first substrate is free from being covered by the second substrate; a third substrate disposed under the first substrate and having a first surface facing away from the first substrate; a fifth component disposed on the first surface of the third substrate; and a third package body disposed on the first surface of the third substrate and covering the fifth component; wherein the third package body has a surface facing away from the third substrate and the fifth component is exposed from the surface of the third package body.