# US 12,009,339 B2 · Electronic device and method of transferring electronic element using stamping and magnetic field alignment

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,009,339 B2
- Document ID: US12009339B2
- Status: Granted
- Kind: B2
- Application number: 16/996,446
- Filed: 2020-08-18
- Published: 2022-02-24
- Granted: 2024-06-11
- Earliest claimed: 2020-08-18
- Assignees: Seoul National University R&Db Foundation
- Applicants: Seoul National University R&Db Foundation
- Inventors: Yongtaek Hong; Hyungsoo Yoon; Eunho Oh; Byeongmoon Lee; Sujin Jeong
- Web page: https://patentgrep.com/patent/US12009339B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/01: Manufacture or treatment
- H10W 72/00: Interconnections or connectors in packages
- H10W 90/00: Package configurations
- H10H 20/0364: {of interconnections}
- H10W 72/01333: {in liquid form, e.g. spin coating, spray coating or immersion coating}
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07307: {the auxiliary member being a temporary substrate, e.g. a removable substrate}
- H10W 72/07321: {Aligning}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/344: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/351: {Materials of die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/951: {Materials of bond pads}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

## Claims

### Claim 1

An electronic device, comprising:
a substance;
a pair of electrodes extending in one direction, the pair of electrodes on at least one surface of the substance;
a plurality of electronic elements, each of the plurality of electronic elements arranged perpendicularly across the pair of electrodes to form an array aligned with each other; and
a plurality of cured polymers between the plurality of electronic elements and the pair of electrodes and spaced apart from each other by forming an island structure;
wherein each of the plurality of electronic elements has at least one contact pad on at least one surface facing at least one of the pair of electrodes for electrical connection,
wherein the plurality of cured polymers include a plurality of ferromagnetic particles arranged in one direction, and the pair of electrodes and a plurality of contact pads of the plurality of electronic elements are electrically connected through the plurality of ferromagnetic particles,
wherein the at least one of the pair of electrodes include a structure formed extending in at least one direction,
wherein the at least one direction in which the at least one of the pair of electrodes extends and the one direction in which the plurality of ferromagnetic particles are arranged are perpendicular to each other,
at least some of the plurality of cured polymers are formed in a form in which a planar area is wider than a planar area of the electronic device and surrounds the electronic device when viewed from above,
wherein each of the plurality of electronic elements is a micro light emitting diode (LED).

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein an electrical connection between the plurality of electronic elements and the at least one electrode is formed by adhering polymers formed on at least one surface of the plurality of electronic elements on the at least one electrode through a stamping method.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein the plurality of electronic elements have independent cured polymers corresponding to each and the independent cured polymers do not form a physical connection with each other.

### Claim 4 (depends on 1)

The electronic device according to claim 1, wherein the at least one contact pad is surrounded by the plurality of cured polymers.