# US 12,009,336 B2 · Packages with electrical fuses

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- Number: US 12,009,336 B2
- Document ID: US12009336B2
- Status: Granted
- Kind: B2
- Application number: 17/390,823
- Filed: 2021-07-30
- Published: 2023-02-02
- Granted: 2024-06-11
- Earliest claimed: 2021-07-30
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: Mahmud Halim Chowdhury; Amin Sijelmassi; Murali Kittappa; Anindya Poddar; Honglin Guo; Joe Adam Garcia; John Paul Tellkamp
- Web page: https://patentgrep.com/patent/US12009336B2

## CPC

- H01H 85/0241: {Structural association of a fuse and another component or apparatus (switches with built-in fuses H01H9/10, spark-gap arresters H01H85/44, transformers and inductances H01F27/402, capacitors H01G2/14, lamps H01K1/66, semiconductors H10W20/493 or H10W42/80)}
- H10W 70/465: {Bumps or wires}
- H01H 85/02: Details
- H10W 42/80: protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60)
- H01H 2085/0283: {Structural association with a semiconductor device}
- H10W 70/429: {being the outer leads}
- H10W 70/635: {Through-vias}
- H10W 72/01551: {Changing the shapes of bond wires}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/073: {of die-attach connectors}
- H10W 72/075: {of bond wires}
- H10W 72/07511: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
- H10W 72/07521: {Aligning}
- H10W 72/07552: {changes in structures or sizes}
- H10W 72/50: Bond wires
- H10W 72/521: {Structures or relative sizes of bond wires}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5434: {the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires}
- H10W 72/5438: {the bond wires having multiple connections on the same bond pad}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/851: {Dispositions of multiple connectors or interconnections}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/755: {between a chip and a laterally-adjacent insulating package substrate, interpose or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.

## Claims

### Claim 1

A package, comprising:
a semiconductor die having a device side and a bond pad on the device side;
a conductive terminal exposed to an exterior of the package; and
an electrical fuse comprising:
a conductive ball coupled to the bond pad; and
a bond wire coupled to the conductive terminal, the bond wire stitch-bonded to the conductive ball.

### Claim 2 (depends on 1)

The package of claim 1, wherein the conductive ball has a height that is between 55% and 65% of a diameter of the bond wire.

### Claim 3 (depends on 1)

The package of claim 1, wherein the conductive ball has a height ranging from 0.33 mils to 1.625 mils.

### Claim 4 (depends on 1)

The package of claim 1, wherein the bond wire has a diameter ranging from 0.6 mils to 2.5 mils.

### Claim 5 (depends on 1)

The package of claim 1, further comprising a second bond wire stitch-bonded to the conductive ball and coupled to the conductive terminal.

### Claim 6 (depends on 1)

The package of claim 1, wherein the electrical fuse includes a second conductive ball on the conductive terminal, the bond wire coupled to the second conductive ball.

### Claim 7 (depends on 1)

The package of claim 1, wherein the conductive terminal is a gullwing package lead.

### Claim 8 (depends on 1)

The package of claim 1, wherein a stitch bond between the bond wire and the conductive ball has a stitch offset, an absolute value of the stitch offset not exceeding 30% of a diameter of the bond wire.

### Claim 9

A package, comprising:
a substrate having a first surface including a conductive trace, a second surface opposing the first surface and having a conductive ball, and a via coupled to the conductive trace and to the conductive ball;
a semiconductor die above the substrate, the semiconductor die having a device side facing away from the substrate and having a bond pad, a conductive member coupled to the bond pad; and
an electrical fuse comprising a bond wire and a conductive member coupled to the bond pad, the bond wire coupled to the conductive member with a stitch bond and to the conductive trace.

### Claim 10 (depends on 9)

The package of claim 9, wherein the package is a ball grid array (BGA) package or a quad flat no lead (QFN) package.

### Claim 11 (depends on 9)

The package of claim 9, wherein a diameter of the bond wire ranges from 0.6 mils to 2.5 mils.

### Claim 12 (depends on 9)

The package of claim 9, wherein the conductive member has a height that ranges from 55% to 65% of a diameter of the bond wire.

### Claim 13 (depends on 9)

The package of claim 9, wherein the stitch bond has a stitch offset, an absolute value of the stitch offset not exceeding 30% of a diameter of the bond wire.

### Claim 14

An electronic device, comprising:
a printed circuit board (PCB);
a switching power supply coupled to the PCB; and
a gate driver package coupled to the PCB and to the switching power supply, the gate driver package comprising:
a conductive pathway electrically accessible to the switching power supply;
a semiconductor die having a bond pad; and
an electrical fuse having a conductive member coupled to the bond pad, the electrical fuse having a bond wire coupled to the conductive pathway and to the conductive member, a diameter of the bond wire ranging from 0.6 mils to 2.5 mils.

### Claim 15 (depends on 14)

The electronic device of claim 14, wherein the bond wire is stitch-bonded to the conductive member.

### Claim 16 (depends on 15)

The electronic device of claim 15, wherein a stitch bond between the bond wire and the conductive member has a stitch offset, an absolute value of the stitch offset not exceeding 30% of the diameter of the bond wire.

### Claim 17 (depends on 14)

The electronic device of claim 14, wherein the electronic device is a ball grid array package.

### Claim 18 (depends on 14)

The electronic device of claim 14, wherein the conductive member has a height ranging from 55% to 65% of the bond wire diameter.

### Claim 19 (depends on 14)

The electronic device of claim 14, wherein the electrical fuse includes a second conductive member on the conductive pathway, the bond wire coupled to the second conductive member.