# US 12,009,334 B2 · Insulating paste-based conductive device and manufacturing method thereof

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- Number: US 12,009,334 B2
- Document ID: US12009334B2
- Status: Granted
- Kind: B2
- Application number: 17/721,418
- Filed: 2022-04-15
- Published: 2023-09-28
- Granted: 2024-06-11
- Earliest claimed: 2022-03-24
- Assignees: Shenzhen Guangshe Zhaoming Technology Co., LTD
- Applicants: Shenzhen Guangshe Zhaoming Technology Co., LTD
- Inventors: Jianwei Chen
- Web page: https://patentgrep.com/patent/US12009334B2

## CPC

- H05K 3/321: by conductive adhesives
- H05K 3/368: {parallel to each other (H05K3/361 takes precedence)}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/30: Die-attach connectors
- H10W 72/354: {comprising polymers}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided are an insulating paste-based conductive device and a manufacturing method thereof. The device comprises a first substrate and a second substrate arranged relative to the first substrate, and further comprises at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, the insulating paste coating being electrically connected with the first electrode and the corresponding second electrode. The invention has good universality, such that the requirements of implementing or applying the art on a ceramic circuit board, a metal-based circuit board, an epoxy glass fiber circuit board, a flexible printed circuit board and a glass circuit board can be set, and an electronic circuit board without a packaging element on the circuit boards above can also be manufactured.

## Claims

### Claim 1

An insulating paste-based conductive device, comprising a first substrate and a second substrate arranged relative to the first substrate, and further comprising at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, wherein the insulating paste coating is electrically connected with the first electrode and the corresponding second electrode;
where, the insulating paste coating has a nanometer thickness.

### Claim 2 (depends on 1)

The insulating paste-based conductive device according to claim 1, wherein a plurality of first electrodes arranged in an array are provided, and a plurality of second electrodes arranged in an array are also provided relative to the first electrodes.

### Claim 3 (depends on 1)

The insulating paste-based conductive device according to claim 1, wherein the insulating paste coating is a thermosetting adhesive.

### Claim 4 (depends on 1)

The insulating paste-based conductive device according to claim 1, wherein the first electrode and the second electrode are non-transparent electrodes, specifically comprising copper electrodes, gold electrodes, silver electrodes, alloy electrodes, silver-burned electrodes, elargol electrodes or carbon electrodes.

### Claim 5 (depends on 1)

The insulating paste-based conductive device according to claim 1, wherein the first electrode and the second electrodeare transparent electrodes, specifically comprising nano-silver electrodes, nano-aluminum electrodes, nano-copper electrodes or ITO electrodes.